Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

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CPC
Y10S156/915

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10S156/915Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus and method
- Patent number 10,854,431
- Issue date Dec 1, 2020
- Tokyo Electron Limited
- Akira Koshiishi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma processing apparatus and method
- Patent number 10,546,727
- Issue date Jan 28, 2020
- Tokyo Electron Limited
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method
- Patent number 9,490,105
- Issue date Nov 8, 2016
- Tokyo Electron Limited
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method, etching apparatus, and ring member
- Patent number 9,441,292
- Issue date Sep 13, 2016
- Tokyo Electron Limited
- Ayuta Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for edge ring implementation for substrate pr...
- Patent number 9,184,074
- Issue date Nov 10, 2015
- Lam Research Corporation
- Rajinder Dhindsa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Etching method, etching apparatus, and ring member
- Patent number 8,945,413
- Issue date Feb 3, 2015
- Tokyo Electron Limited
- Ayuta Suzuki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Plasma processing apparatus and method
- Patent number 8,603,293
- Issue date Dec 10, 2013
- Tokyo Electron Limited
- Akira Koshiishi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for backside polymer reduction in dry-etch process
- Patent number 8,529,783
- Issue date Sep 10, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Ming Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma confinement rings having reduced polymer deposition characte...
- Patent number 8,500,952
- Issue date Aug 6, 2013
- Lam Research Corporation
- Rajinder Dhindsa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Adjustable confinement ring assembly
- Patent number 8,491,750
- Issue date Jul 23, 2013
- Lam Research Corporation
- Peter Cirigliano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 8,491,751
- Issue date Jul 23, 2013
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma confinement rings having reduced polymer deposition characte...
- Patent number 8,262,922
- Issue date Sep 11, 2012
- Lam Research Corporation
- Rajinder Dhindsa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma processing apparatus including etching processing apparatus...
- Patent number 8,197,635
- Issue date Jun 12, 2012
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma processing apparatus including etching processing apparatus...
- Patent number 8,187,485
- Issue date May 29, 2012
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Confinement ring drive
- Patent number 8,080,168
- Issue date Dec 20, 2011
- Lam Research Corporation
- Peter Cirigliano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and method
- Patent number 7,988,816
- Issue date Aug 2, 2011
- Tokyo Electron Limited
- Akira Koshiishi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ring mechanism, and plasma processing device using the ring mechanism
- Patent number 7,882,800
- Issue date Feb 8, 2011
- Tokyo Electron Limited
- Akira Koshiishi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for reducing polymer deposition on a substrate and substr...
- Patent number 7,867,356
- Issue date Jan 11, 2011
- Lam Research Corporation
- Jose Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Edge ring arrangements for substrate processing
- Patent number 7,837,827
- Issue date Nov 23, 2010
- Lam Research Corporation
- Rajinder Dhindsa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Erosion resistance enhanced quartz used in plasma etch chamber
- Patent number 7,718,559
- Issue date May 18, 2010
- Applied Materials, Inc.
- Jie Yuan
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method and apparatus for backside polymer reduction in dry-etch pro...
- Patent number 7,713,380
- Issue date May 11, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support ring assembly
- Patent number 7,670,436
- Issue date Mar 2, 2010
- Applied Materials, Inc.
- Keith A. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrically enhancing the confinement of plasma
- Patent number 7,632,375
- Issue date Dec 15, 2009
- Lam Research Corporation
- Andras Kuthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma confinement ring assemblies having reduced polymer depositio...
- Patent number 7,430,986
- Issue date Oct 7, 2008
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Convex insert ring for etch chamber
- Patent number 7,381,293
- Issue date Jun 3, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Confinement ring drive
- Patent number 7,364,623
- Issue date Apr 29, 2008
- Lam Research Corporation
- Peter Cirigliano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Step edge insert ring for etch chamber
- Patent number 7,338,578
- Issue date Mar 4, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 7,335,278
- Issue date Feb 26, 2008
- Tokyo Electron AT Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for reducing polymer deposition on a substrate and substr...
- Patent number 7,252,738
- Issue date Aug 7, 2007
- Lam Research Corporation
- Jose Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Twist-N-Lock wafer area pressure ring and assembly
- Patent number 7,211,170
- Issue date May 1, 2007
- Lam Research Corporation
- Jerrel K. Antolik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20210082669
- Publication date Mar 18, 2021
- TOKYO ELECTRON LIMITED
- Akira KOSHIISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20200111645
- Publication date Apr 9, 2020
- TOKYO ELECTRON LIMITED
- Akira KOSHIISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20140124139
- Publication date May 8, 2014
- TOKYO ELECTRON LIMITED
- Akira KOSHIISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, ETCHING APPARATUS, AND RING MEMBER
- Publication number 20130186858
- Publication date Jul 25, 2013
- TOKYO ELECTRON LIMITED
- Ayuta SUZUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA CONFINEMENT RINGS HAVING REDUCED POLYMER DEPOSITION CHARACTE...
- Publication number 20120325407
- Publication date Dec 27, 2012
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS INCLUDING ETCHING PROCESSING APPARATUS...
- Publication number 20120211163
- Publication date Aug 23, 2012
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE CONFINEMENT RING ASSEMBLY
- Publication number 20120043021
- Publication date Feb 23, 2012
- Lam Research Corporation
- Peter Cirigliano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20110272097
- Publication date Nov 10, 2011
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS INCLUDING ETCHING PROCESSING APPARATUS...
- Publication number 20110120647
- Publication date May 26, 2011
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR EDGE RING IMPLEMENTATION FOR SUBSTRATE PR...
- Publication number 20110070743
- Publication date Mar 24, 2011
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS INCLUDING ETCHING PROCESSING APPARATUS...
- Publication number 20100285670
- Publication date Nov 11, 2010
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for backside polymer reduction in dry-etch process
- Publication number 20100190349
- Publication date Jul 29, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huang-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY ENHANCING THE CONFINEMENT OF PLASMA
- Publication number 20090165954
- Publication date Jul 2, 2009
- LAM RESEARCH CORPORATION
- Andras Kuthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING ARRANGEMENTS FOR SUBSTRATE PROCESSING
- Publication number 20090000744
- Publication date Jan 1, 2009
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma confinement rings assemblies having reduced polymer depositi...
- Publication number 20080318433
- Publication date Dec 25, 2008
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EROSION RESISTANCE ENHANCED QUARTZ USED IN PLASMA ETCH CHAMBER
- Publication number 20080261800
- Publication date Oct 23, 2008
- Jie Yuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONFINEMENT RING DRIVE
- Publication number 20080149595
- Publication date Jun 26, 2008
- Peter Cirigliano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for reducing polymer deposition on a substrate and substr...
- Publication number 20080041820
- Publication date Feb 21, 2008
- LAM RESEARCH CORPORATION
- Jose Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processing apparatus including etching processing apparatus...
- Publication number 20070023143
- Publication date Feb 1, 2007
- Hitachi High-Technologies Corporation
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma confinement ring assemblies having reduced polymer depositio...
- Publication number 20060207502
- Publication date Sep 21, 2006
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Confinement ring drive
- Publication number 20060162657
- Publication date Jul 27, 2006
- Lam Research Corporation
- Peter Cirigliano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Support ring assembly
- Publication number 20060090706
- Publication date May 4, 2006
- APPLIED MATERIALS, INC.
- Keith A. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processing apparatus and method
- Publication number 20060066247
- Publication date Mar 30, 2006
- TOKYO ELECTRON LIMITED
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for etching a wafer in a plasma etch reactor
- Publication number 20050173376
- Publication date Aug 11, 2005
- Kevin G. Donohoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processing apparatus and plasma processing method
- Publication number 20050172904
- Publication date Aug 11, 2005
- Tokyo Electron AT Limited and Japan Science and Technology Corporation
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for backside polymer reduction in dry-etch pro...
- Publication number 20050164506
- Publication date Jul 28, 2005
- Huang-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Step edge insert ring for etch chamber
- Publication number 20050155718
- Publication date Jul 21, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cerium oxide containing ceramic components and coatings in semicond...
- Publication number 20050064248
- Publication date Mar 24, 2005
- Robert J. O'Donnell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrostatic chuck
- Publication number 20050018377
- Publication date Jan 27, 2005
- Samsung Electronics Co., Ltd.
- Jae-yong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ring mechanism, and plasma processing device using the ring mechanism
- Publication number 20050005859
- Publication date Jan 13, 2005
- Akira Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS

Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma processing apparatus and method

Plasma processing apparatus and method

Plasma processing apparatus and method

Etching method, etching apparatus, and ring member

Apparatus and methods for edge ring implementation for substrate pr...

Etching method, etching apparatus, and ring member

Plasma processing apparatus and method

Method for backside polymer reduction in dry-etch process

Plasma confinement rings having reduced polymer deposition characte...

Adjustable confinement ring assembly

Plasma processing apparatus

Plasma confinement rings having reduced polymer deposition characte...

Plasma processing apparatus including etching processing apparatus...

Plasma processing apparatus including etching processing apparatus...

Confinement ring drive

Plasma processing apparatus and method

Ring mechanism, and plasma processing device using the ring mechanism

Apparatus for reducing polymer deposition on a substrate and substr...

Edge ring arrangements for substrate processing

Erosion resistance enhanced quartz used in plasma etch chamber

Method and apparatus for backside polymer reduction in dry-etch pro...

Support ring assembly

Electrically enhancing the confinement of plasma

Plasma confinement ring assemblies having reduced polymer depositio...

Convex insert ring for etch chamber

Confinement ring drive

Step edge insert ring for etch chamber

Plasma processing apparatus and plasma processing method

Apparatus for reducing polymer deposition on a substrate and substr...

Twist-N-Lock wafer area pressure ring and assembly

Patents Applicationslast 30 patents

PLASMA PROCESSING APPARATUS AND METHOD

PLASMA PROCESSING APPARATUS AND METHOD

PLASMA PROCESSING APPARATUS AND METHOD

ETCHING METHOD, ETCHING APPARATUS, AND RING MEMBER

PLASMA CONFINEMENT RINGS HAVING REDUCED POLYMER DEPOSITION CHARACTE...

PLASMA PROCESSING APPARATUS INCLUDING ETCHING PROCESSING APPARATUS...

ADJUSTABLE CONFINEMENT RING ASSEMBLY

PLASMA PROCESSING APPARATUS AND METHOD

PLASMA PROCESSING APPARATUS INCLUDING ETCHING PROCESSING APPARATUS...

APPARATUS AND METHODS FOR EDGE RING IMPLEMENTATION FOR SUBSTRATE PR...

PLASMA PROCESSING APPARATUS INCLUDING ETCHING PROCESSING APPARATUS...

Method for backside polymer reduction in dry-etch process

ELECTRICALLY ENHANCING THE CONFINEMENT OF PLASMA

EDGE RING ARRANGEMENTS FOR SUBSTRATE PROCESSING

Plasma confinement rings assemblies having reduced polymer depositi...

EROSION RESISTANCE ENHANCED QUARTZ USED IN PLASMA ETCH CHAMBER

CONFINEMENT RING DRIVE

Apparatus for reducing polymer deposition on a substrate and substr...

Plasma processing apparatus including etching processing apparatus...

Plasma confinement ring assemblies having reduced polymer depositio...

Confinement ring drive

Support ring assembly

Plasma processing apparatus and method

Method for etching a wafer in a plasma etch reactor

Plasma processing apparatus and plasma processing method

Method and apparatus for backside polymer reduction in dry-etch pro...

Step edge insert ring for etch chamber

Cerium oxide containing ceramic components and coatings in semicond...

Electrostatic chuck

Ring mechanism, and plasma processing device using the ring mechanism