Differential pair signal lines

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H01L2223/6638

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6638Differential pair signal lines

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package design scheme for enabling high-speed low-loss signaling an...
- Patent number 12,057,413
- Issue date Aug 6, 2024
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects in a core layer configured for s...
- Patent number 11,955,409
- Issue date Apr 9, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of terminals arranged thereon
- Patent number 11,948,916
- Issue date Apr 2, 2024
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package differential pin pattern for cross-talk...
- Patent number 11,917,749
- Issue date Feb 27, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant carrier based packaging with enhanced WG m...
- Patent number 11,862,584
- Issue date Jan 2, 2024
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,830,820
- Issue date Nov 28, 2023
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device with built-in baluns
- Patent number 11,810,875
- Issue date Nov 7, 2023
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single metal cavity antenna in package connected to an integrated t...
- Patent number 11,784,143
- Issue date Oct 10, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable in-plane signal to ground reference configurations
- Patent number 11,705,390
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 11,637,078
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission circuit and electronic device
- Patent number 11,610,930
- Issue date Mar 21, 2023
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench reference planes for integrated-circuit die packages
- Patent number 11,557,552
- Issue date Jan 17, 2023
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimization of insertion loss variation in through-silicon vias (T...
- Patent number 11,545,416
- Issue date Jan 3, 2023
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and manufacturing method of optical module
- Patent number 11,495,589
- Issue date Nov 8, 2022
- Fujitsu Optical Components Limited
- Kento Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional panel, method for manufacturing the same and terminal
- Patent number 11,423,825
- Issue date Aug 23, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ying Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-density dual-embedded microstrip interconnects
- Patent number 11,395,402
- Issue date Jul 19, 2022
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission method and apparatus, and display device
- Patent number 11,335,238
- Issue date May 17, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianyong Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor optical device
- Patent number 11,336,072
- Issue date May 17, 2022
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground reference shape for high speed interconnect
- Patent number 11,276,655
- Issue date Mar 15, 2022
- InnogritTechnologies Co., Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel, manufacturing method thereof, and terminal
- Patent number 11,227,532
- Issue date Jan 18, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianyong Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package with rotated semiconductor die
- Patent number 11,222,850
- Issue date Jan 11, 2022
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric scheme in packages
- Patent number 11,195,788
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing carrier
- Patent number 11,114,394
- Issue date Sep 7, 2021
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission circuit and electronic device
- Patent number 11,043,525
- Issue date Jun 22, 2021
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circularly-polarized dielectric waveguide launch for millimeter-wav...
- Patent number 11,011,815
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Hassan Omar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 10,930,603
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric coating for crosstalk reduction
- Patent number 10,925,152
- Issue date Feb 16, 2021
- Intel Corporation
- Albert Sutono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and chip package
- Patent number 10,892,238
- Issue date Jan 12, 2021
- Global Unichip Corporation
- Yuan-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency ceramic board and high-frequency semiconductor eleme...
- Patent number 10,790,245
- Issue date Sep 29, 2020
- NGK ELECTRONICS DEVICES, INC.
- Noboru Kubo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274571
- Publication date Aug 15, 2024
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20240055358
- Publication date Feb 15, 2024
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...
- Publication number 20240006350
- Publication date Jan 4, 2024
- Intel Corporation
- Ellis NEASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369257
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20230335513
- Publication date Oct 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20230307390
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Dielectric Constant Carrier Based Packaging with Enhanced WG M...
- Publication number 20230207498
- Publication date Jun 29, 2023
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...
- Publication number 20230197646
- Publication date Jun 22, 2023
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20230127676
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Sangwook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20230039914
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Juyoun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Frequency Package
- Publication number 20220344289
- Publication date Oct 27, 2022
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MILLIMETER-WAVE DUAL-MODE MATCHING NETWORK
- Publication number 20220344288
- Publication date Oct 27, 2022
- NXP B.V.
- Harish Nandagopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS
- Publication number 20220328432
- Publication date Oct 13, 2022
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS IN A CORE LAYER CONFIGURED FOR S...
- Publication number 20220223499
- Publication date Jul 14, 2022
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20220108954
- Publication date Apr 7, 2022
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Dielectric Scheme in Packages
- Publication number 20220093498
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUND REFERENCE SHAPE FOR HIGH SPEED INTERCONNECT
- Publication number 20210366848
- Publication date Nov 25, 2021
- INNOGRIT TECHNOLOGIES CO., LTD
- Shiann-Ming LIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION CIRCUIT AND ELECTRONIC DEVICE
- Publication number 20210273010
- Publication date Sep 2, 2021
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20210175187
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Dielectric Scheme in Packages
- Publication number 20210118787
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING CARRIER
- Publication number 20210043588
- Publication date Feb 11, 2021
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D TRENCH REFERENCE PLANES FOR INTEGRATED-CIRCUIT DIE PACKAGES
- Publication number 20200395318
- Publication date Dec 17, 2020
- Intel Corporation
- Chin Lee Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...
- Publication number 20200373259
- Publication date Nov 26, 2020
- Intel Corporation
- Sonja KOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE
- Publication number 20200365515
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DESIGN SCHEME FOR ENABLING HIGH-SPEED LOW-LOSS SIGNALING AN...
- Publication number 20200343202
- Publication date Oct 29, 2020
- Intel Corporation
- Lijiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE IN-PLANE SIGNAL TO GROUND REFERENCE CONFIGURATIONS
- Publication number 20200312759
- Publication date Oct 1, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE AND CHIP PACKAGE
- Publication number 20200303330
- Publication date Sep 24, 2020
- GLOBAL UNICHIP CORPORATION
- Yuan-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE
- Publication number 20200286874
- Publication date Sep 10, 2020
- FUJITSU OPTICAL COMPONENTS LIMITED
- Kento TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (T...
- Publication number 20200279793
- Publication date Sep 3, 2020
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS

Differential pair signal lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coaxial through via with novel high isolation cross coupling method...

Package design scheme for enabling high-speed low-loss signaling an...

Substrate comprising interconnects in a core layer configured for s...

Semiconductor device having a plurality of terminals arranged thereon

Integrated circuit package differential pin pattern for cross-talk...

High dielectric constant carrier based packaging with enhanced WG m...

Electronic package with rotated semiconductor die

Packaged integrated circuit device with built-in baluns

Single metal cavity antenna in package connected to an integrated t...

Variable in-plane signal to ground reference configurations

Coaxial through via with novel high isolation cross coupling method...

Transmission circuit and electronic device

3D trench reference planes for integrated-circuit die packages

Minimization of insertion loss variation in through-silicon vias (T...

Optical module and manufacturing method of optical module

Functional panel, method for manufacturing the same and terminal

High-density dual-embedded microstrip interconnects

Signal transmission method and apparatus, and display device

Semiconductor optical device

Ground reference shape for high speed interconnect

Panel, manufacturing method thereof, and terminal

Electronic package with rotated semiconductor die

Hybrid dielectric scheme in packages

Signal routing carrier

Transmission circuit and electronic device

Circularly-polarized dielectric waveguide launch for millimeter-wav...

Coaxial through via with novel high isolation cross coupling method...

Dielectric coating for crosstalk reduction

Circuit structure and chip package

High-frequency ceramic board and high-frequency semiconductor eleme...

Patents Applicationslast 30 patents

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE, BASE STATION, MOBILE DEVICE AND METHOD FOR F...

SEMICONDUCTOR DEVICE

DESIGNING METHOD AND SEMICONDUCTOR DEVICE

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

High Dielectric Constant Carrier Based Packaging with Enhanced WG M...

LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...

WIRING BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

High Frequency Package

INTEGRATED MILLIMETER-WAVE DUAL-MODE MATCHING NETWORK

PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS

SUBSTRATE COMPRISING INTERCONNECTS IN A CORE LAYER CONFIGURED FOR S...

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

Hybrid Dielectric Scheme in Packages

GROUND REFERENCE SHAPE FOR HIGH SPEED INTERCONNECT

TRANSMISSION CIRCUIT AND ELECTRONIC DEVICE

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

Hybrid Dielectric Scheme in Packages

SIGNAL ROUTING CARRIER

3D TRENCH REFERENCE PLANES FOR INTEGRATED-CIRCUIT DIE PACKAGES

SINGLE METAL CAVITY ANTENNA IN PACKAGE CONNECTED TO AN INTEGRATED T...

ELECTRONIC PACKAGE WITH ROTATED SEMICONDUCTOR DIE

PACKAGE DESIGN SCHEME FOR ENABLING HIGH-SPEED LOW-LOSS SIGNALING AN...

VARIABLE IN-PLANE SIGNAL TO GROUND REFERENCE CONFIGURATIONS

CIRCUIT STRUCTURE AND CHIP PACKAGE

OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE

MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (T...