Diffusion bonding

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H01L2224/8382

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8382Diffusion bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
- Patent number 11,373,925
- Issue date Jun 28, 2022
- LIGHT-MED (USA), INC.
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless multi-layered ceramic capacitor stack
- Patent number 11,227,719
- Issue date Jan 18, 2022
- KEMET Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,139,375
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming an electric heater
- Patent number 11,088,104
- Issue date Aug 10, 2021
- Heraeus Precious Metals North America Conshohocken LLC
- Ryan Persons
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed in a cavity between substrates
- Patent number 11,050,407
- Issue date Jun 29, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,984,955
- Issue date Apr 20, 2021
- KEMET Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of liquid assisted bonding
- Patent number 10,971,472
- Issue date Apr 6, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed in a cavity between substrates and includ...
- Patent number 10,965,269
- Issue date Mar 30, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure
- Publication number 20240312955
- Publication date Sep 19, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LOW-WARPAGE CARRIER
- Publication number 20240222234
- Publication date Jul 4, 2024
- INFINEON TECHNOLOGIES AG
- Abdul Rahman MOHAMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Diffusion Soldering with Contaminant Protection
- Publication number 20220084981
- Publication date Mar 17, 2022
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...
- Publication number 20220084903
- Publication date Mar 17, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...
- Publication number 20220005744
- Publication date Jan 6, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LIQUID ASSISTED BONDING
- Publication number 20210013174
- Publication date Jan 14, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200286849
- Publication date Sep 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING AN ELECTRIC HEATER
- Publication number 20200194398
- Publication date Jun 18, 2020
- Heraeus Precious Metals North America Conshohocken LLC
- Ryan Persons
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Solder Preform for Diffusion Soldering, Method for the Production t...
- Publication number 20200139490
- Publication date May 7, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Power electronic metal-ceramic module and printed circuit board mod...
- Publication number 20190363043
- Publication date Nov 28, 2019
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...
- Publication number 20190237389
- Publication date Aug 1, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Antennas for Semiconductor Devices and Related Manufacturin...
- Publication number 20190221531
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190122998
- Publication date Apr 25, 2019
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Diffusion bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Transient liquid phase bonding compositions and power electronics a...

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor device having an antenna arranged over an active main...

Diffusion soldering with contaminant protection

Advanced device assembly structures and methods

Semiconductor structure having silver-indium transient liquid phase...

Method for fabricating a semiconductor device by using different co...

Light emitting diode display with redundancy scheme

Semiconductor package and method for fabricating a semiconductor pa...

Diffusion soldering with contaminant protection

Multilayered transient liquid phase bonding

Chip assembly

Alternative compositions for high temperature soldering applications

Die-attach method to compensate for thermal expansion

Method for mounting an electrical component in which a hood is used...

Soldering a conductor to an aluminum layer

Light emitting diode display with redundancy scheme

Silver-indium transient liquid phase method of bonding semiconducto...

Leadless multi-layered ceramic capacitor stack

Non-eutectic bonding

Semiconductor device and method of manufacturing a semiconductor de...

Bonded structure and method of manufacturing the same

Process for forming an electric heater

Semiconductor packages with an intermetallic layer

Electronic devices formed in a cavity between substrates

Electronic component structures with reduced microphonic noise

Method of liquid assisted bonding

Light emitting diode display with redundancy scheme

Electronic devices formed in a cavity between substrates and includ...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

Advanced Device Assembly Structures And Methods

Bonding Structure

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

PACKAGE WITH LOW-WARPAGE CARRIER

Method for Fabricating a Power Semiconductor Device

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Advanced Device Assembly Structures And Methods

Diffusion Soldering with Contaminant Protection

SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...

SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Power Semiconductor Device and Method for Fabricating a Power Semic...

Method for Fabricating a Semiconductor Device by Using Different Co...

METHOD OF LIQUID ASSISTED BONDING

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

PROCESS FOR FORMING AN ELECTRIC HEATER

Solder Preform for Diffusion Soldering, Method for the Production t...

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

Power electronic metal-ceramic module and printed circuit board mod...

COOLING BOND LAYER AND POWER ELECTRONICS ASSEMBLIES INCORPORATING T...

On-Chip Antennas for Semiconductor Devices and Related Manufacturin...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DIE BONDING TO A BOARD