Diffusion bonding

Industry

CPC
H01L2224/8482

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8482Diffusion bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,379,049
- Issue date Jun 28, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroki Ikeuchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor module including solid-liquid...
- Patent number 7,670,879
- Issue date Mar 2, 2010
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tin-based solder layer and method for m...
- Patent number 7,579,212
- Issue date Aug 25, 2009
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having tin-based solder layer and method for m...
- Patent number 7,361,996
- Issue date Apr 22, 2008
- Denso Corporation
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INKJET PRINTING OF DIFFUSION SOLDER
- Publication number 20240379615
- Publication date Nov 14, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor module
- Publication number 20070197017
- Publication date Aug 23, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having tin-based solder layer and method for m...
- Publication number 20070176293
- Publication date Aug 2, 2007
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having tin-based solder layer and method for m...
- Publication number 20060049521
- Publication date Mar 9, 2006
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS

Diffusion bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package with vertical interconnect between carrier and clip

Semiconductor device having multiple contact clips

Semiconductor apparatus

Module including a discrete device mounted on a DCB substrate

Semiconductor device using diffusion soldering

Manufacturing method of semiconductor module including solid-liquid...

Semiconductor device having tin-based solder layer and method for m...

Semiconductor device having tin-based solder layer and method for m...

Patents Applicationslast 30 patents

INKJET PRINTING OF DIFFUSION SOLDER

Semiconductor Device Using Diffusion Soldering

Module Including a Discrete Device Mounted on a DCB Substrate

Manufacturing method of semiconductor module

Semiconductor device having tin-based solder layer and method for m...

Semiconductor device having tin-based solder layer and method for m...