Diffusion bonding

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H01L2224/8282

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8282Diffusion bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 11,282,771
- Issue date Mar 22, 2022
- Shinko Electric Industries Co., Ltd.
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,331,043
- Issue date May 3, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20200152556
- Publication date May 14, 2020
- Shinko Electric Industries Co., Ltd.
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS