Diffusion bonding

Industry

CPC
H01L2224/8082

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8082Diffusion bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro device
- Patent number 10,964,662
- Issue date Mar 30, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,777,527
- Issue date Sep 15, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of thick metal pads
- Patent number 9,673,157
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with enhanced adhesion strength
- Patent number 9,159,674
- Issue date Oct 13, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for bonding of chips on wafers
- Patent number 8,927,335
- Issue date Jan 6, 2015
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with enhanced adhesion strength
- Patent number 8,748,288
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Encapsulated semiconductor chip with external contact pads and manu...
- Patent number 8,338,231
- Issue date Dec 25, 2012
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND...
- Publication number 20240304600
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Shalini Jakanadan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063193
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG-FLIPPING OF DIES PRIOR TO BONDING
- Publication number 20230360950
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20230081238
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Minho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die for S...
- Publication number 20220285334
- Publication date Sep 8, 2022
- SEMTECH CORPORATION
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO DEVICE
- Publication number 20210013172
- Publication date Jan 14, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH
- Publication number 20140239458
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR BONDING OF CHIPS ON WAFERS
- Publication number 20120184069
- Publication date Jul 19, 2012
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Semiconductor Chip with External Contact Pads and Manu...
- Publication number 20110233754
- Publication date Sep 29, 2011
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH
- Publication number 20110193240
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Diffusion bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device and method of stacking semiconductor die for s...

Method of transferring micro device

Method for transferring micro device

Processing of thick metal pads

Semiconductor device and method for manufacturing a semiconductor d...

Bonded structure with enhanced adhesion strength

Method for bonding of chips on wafers

Bonded structure with enhanced adhesion strength

Encapsulated semiconductor chip with external contact pads and manu...

Patents Applicationslast 30 patents

CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND...

SEMICONDUCTOR PACKAGE

GANG-FLIPPING OF DIES PRIOR TO BONDING

IMAGE SENSOR

Semiconductor Device and Method of Stacking Semiconductor Die for S...

METHOD OF TRANSFERRING MICRO DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH

METHOD FOR BONDING OF CHIPS ON WAFERS

Encapsulated Semiconductor Chip with External Contact Pads and Manu...

BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH