Diffusion into or out of group IV semiconductors

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H01L21/2251

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2251Diffusion into or out of group IV semiconductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
FinFET device and methods of forming the same
- Patent number 12,249,650
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,178,042
- Issue date Dec 24, 2024
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, memory device, and method
- Patent number 12,101,926
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,087,584
- Issue date Sep 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Daejoong Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-shaped semiconductor device having connection material layer...
- Patent number 12,027,627
- Issue date Jul 2, 2024
- Unisantis Electronics Singapore Pte. Ltd.
- Fujio Masuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,027,371
- Issue date Jul 2, 2024
- Wonik IPS Co., Ltd.
- Ah Young Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral heterojunction bipolar transistor with emitter and/or colle...
- Patent number 11,990,535
- Issue date May 21, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Alexander M. Derrickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical fin field effect transistor devices with reduced top sourc...
- Patent number 11,978,783
- Issue date May 7, 2024
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked connections in 3D memory and methods of making the same
- Patent number 11,910,602
- Issue date Feb 20, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a vertical thin-film transistor that serves as...
- Patent number 11,910,612
- Issue date Feb 20, 2024
- SUNRISE MEMORY CORPORATION
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,889,672
- Issue date Jan 30, 2024
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked connections in 3D memory and methods of making the same
- Patent number 11,765,898
- Issue date Sep 19, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, memory device, and method
- Patent number 11,729,967
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional device fabrication
- Patent number 11,637,016
- Issue date Apr 25, 2023
- Ideal Power Inc.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and methods of forming the same
- Patent number 11,626,518
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked connections in 3D memory and methods of making the same
- Patent number 11,600,637
- Issue date Mar 7, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked connections in 3D memory and methods of making the same
- Patent number 11,600,636
- Issue date Mar 7, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,489,049
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor having bottom spacers on source/drain regions w...
- Patent number 11,482,612
- Issue date Oct 25, 2022
- International Business Machines Corporation
- Shogo Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical thing-film transistor and application as bit-line connecto...
- Patent number 11,398,492
- Issue date Jul 26, 2022
- SUNRISE MEMORY CORPORATION
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-shaped semiconductor device having connection material layer...
- Patent number 11,309,426
- Issue date Apr 19, 2022
- Unisantis Electronics Singapore Pte. Ltd.
- Fujio Masuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial wafer including boron and germanium and method of fabrica...
- Patent number 11,289,334
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Jung-A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,195,849
- Issue date Dec 7, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor having counter-doped regions between li...
- Patent number 11,114,551
- Issue date Sep 7, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of a semiconductor device including one or mo...
- Patent number 11,088,247
- Issue date Aug 10, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nanosheet electrostatic discharge structure
- Patent number 11,075,273
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite spacer enabling uniform doping in recessed fin devices
- Patent number 11,038,041
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor
- Patent number 11,004,752
- Issue date May 11, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 10,985,252
- Issue date Apr 20, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 10,950,613
- Issue date Mar 16, 2021
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250089246
- Publication date Mar 13, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250048717
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hokyun AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRESS STATE IN A SEMICONDUCTIVE LAYER
- Publication number 20250022711
- Publication date Jan 16, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emmanuel AUGENDRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, MEMORY DEVICE, AND METHOD
- Publication number 20240381621
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...
- Publication number 20240379361
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chuan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240372001
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epitaxial wafer, Method of manufacturing the epitaxial wafer, and M...
- Publication number 20240339503
- Publication date Oct 10, 2024
- UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
- Dae Hong KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DMOS DEVICE HAVING JUNCTION FIELD PLATE AND MANUFACTURING METHOD TH...
- Publication number 20240222473
- Publication date Jul 4, 2024
- CSMC TECHNOLOGIES FAB2 CO., LTD.
- Feng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
- Publication number 20240179919
- Publication date May 30, 2024
- Sunrise Memory Corporation
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPROCESS SUBSTRATE TREATMENT FOR ENHANCED SUBSTRATE DOPING
- Publication number 20240153774
- Publication date May 9, 2024
- Applied Materials, Inc.
- Christopher R. Hatem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20240121953
- Publication date Apr 11, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, MEMORY DEVICE, AND METHOD
- Publication number 20230363145
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR SEMICONDUCTOR DEVICE AND METHOD OF FORM...
- Publication number 20230178372
- Publication date Jun 8, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bhaskar Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE
- Publication number 20230111323
- Publication date Apr 13, 2023
- Intel Corporation
- Rahul RAMAMURTHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL HETEROJUNCTION BIPOLAR TRANSISTOR WITH EMITTER AND/OR COLLE...
- Publication number 20230065924
- Publication date Mar 2, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Alexander M. Derrickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20220319853
- Publication date Oct 6, 2022
- WONIK IPS CO., LTD.
- Ah Young HWANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
- Publication number 20220293623
- Publication date Sep 15, 2022
- Sunrise Memory Corporation
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Bidirectional Device Fabrication
- Publication number 20220262639
- Publication date Aug 18, 2022
- IDEAL POWER INC.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-SHAPED SEMICONDUCTOR DEVICE HAVING CONNECTION MATERIAL LAYER...
- Publication number 20220199837
- Publication date Jun 23, 2022
- Unisantis Electronics Singapore PTE Ltd.
- Fujio MASUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220037158
- Publication date Feb 3, 2022
- Changxin Memory Technologies, Inc.
- DAEJOONG WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, MEMORY DEVICE, AND METHOD
- Publication number 20220013523
- Publication date Jan 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Methods of Forming the Same
- Publication number 20210193830
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20210167078
- Publication date Jun 3, 2021
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210151574
- Publication date May 20, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME
- Publication number 20210134834
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME
- Publication number 20210134835
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL FIN FIELD EFFECT TRANSISTOR DEVICES WITH REDUCED TOP SOURC...
- Publication number 20210119019
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM SPACER STRUCTURE FOR VERTICAL FIELD EFFECT TRANSISTOR AND ME...
- Publication number 20210119020
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Shogo Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME
- Publication number 20210118904
- Publication date Apr 22, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME
- Publication number 20210091115
- Publication date Mar 25, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun LIU
- H01 - BASIC ELECTRIC ELEMENTS

Diffusion into or out of group IV semiconductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

FinFET device and methods of forming the same

Semiconductor device and a method of manufacturing a semiconductor...

Capacitor, memory device, and method

Method for forming semiconductor structure

Pillar-shaped semiconductor device having connection material layer...

Substrate processing method

Lateral heterojunction bipolar transistor with emitter and/or colle...

Vertical fin field effect transistor devices with reduced top sourc...

Stacked connections in 3D memory and methods of making the same

Process for forming a vertical thin-film transistor that serves as...

Semiconductor device and a method of manufacturing a semiconductor...

Stacked connections in 3D memory and methods of making the same

Capacitor, memory device, and method

Systems and methods for bidirectional device fabrication

FinFET device and methods of forming the same

Stacked connections in 3D memory and methods of making the same

Stacked connections in 3D memory and methods of making the same

Integrated assemblies, and methods of forming integrated assemblies

Vertical transistor having bottom spacers on source/drain regions w...

Vertical thing-film transistor and application as bit-line connecto...

Pillar-shaped semiconductor device having connection material layer...

Epitaxial wafer including boron and germanium and method of fabrica...

Semiconductor device and method of manufacturing the same

Fin field-effect transistor having counter-doped regions between li...

Method of fabrication of a semiconductor device including one or mo...

Nanosheet electrostatic discharge structure

Composite spacer enabling uniform doping in recessed fin devices

Fin field-effect transistor

Integrated assemblies, and methods of forming integrated assemblies

Semiconductor device and a method of manufacturing a semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A STRESS STATE IN A SEMICONDUCTIVE LAYER

CAPACITOR, MEMORY DEVICE, AND METHOD

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WI...

FinFET DEVICE AND METHODS OF FORMING THE SAME

Epitaxial wafer, Method of manufacturing the epitaxial wafer, and M...

DMOS DEVICE HAVING JUNCTION FIELD PLATE AND MANUFACTURING METHOD TH...

VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...

MULTIPROCESS SUBSTRATE TREATMENT FOR ENHANCED SUBSTRATE DOPING

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

CAPACITOR, MEMORY DEVICE, AND METHOD

FIN FIELD-EFFECT TRANSISTOR SEMICONDUCTOR DEVICE AND METHOD OF FORM...

OXIDE LAYER DOPING ON A SUB CHANNEL OF A TRANSISTOR STRUCTURE

LATERAL HETEROJUNCTION BIPOLAR TRANSISTOR WITH EMITTER AND/OR COLLE...

SUBSTRATE PROCESSING METHOD

VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...

Systems and Methods for Bidirectional Device Fabrication

PILLAR-SHAPED SEMICONDUCTOR DEVICE HAVING CONNECTION MATERIAL LAYER...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

CAPACITOR, MEMORY DEVICE, AND METHOD

FinFET Device and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME

STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME

VERTICAL FIN FIELD EFFECT TRANSISTOR DEVICES WITH REDUCED TOP SOURC...

BOTTOM SPACER STRUCTURE FOR VERTICAL FIELD EFFECT TRANSISTOR AND ME...

STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME

STACKED CONNECTIONS IN 3D MEMORY AND METHODS OF MAKING THE SAME