Digital-to-analog converter [DAC]

Industry

CPC
H01L2924/14253

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/14253Digital-to-analog converter [DAC]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display pixels with integrated pipeline
- Patent number 11,699,383
- Issue date Jul 11, 2023
- Tectus Corporation
- Paul Scott Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated pillar dies having integrated electromagnetic shield layers
- Patent number 11,694,970
- Issue date Jul 4, 2023
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 11,621,232
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic control unit and vehicle apparatus
- Patent number 10,859,624
- Issue date Dec 8, 2020
- Renesas Electronics Corporation
- Akira Uemura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Magnetically coupled galvanically isolated communication using lead...
- Patent number 10,833,590
- Issue date Nov 10, 2020
- Power Integrations, Inc.
- Balu Balakrishnan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacking of three-dimensional circuits including through-silicon-vias
- Patent number 10,700,041
- Issue date Jun 30, 2020
- Facebook Technologies, LLC
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically coupled galvanically isolated communication using lead...
- Patent number 10,361,632
- Issue date Jul 23, 2019
- Power Integrations, Inc.
- Balu Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back stacked dies
- Patent number 10,290,618
- Issue date May 14, 2019
- Intersil Americas LLC
- Francois Hebert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Magnetically coupled galvanically isolated communication using lead...
- Patent number 10,079,543
- Issue date Sep 18, 2018
- Power Intergrations, Inc.
- Balu Balakrishnan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with separated main terminals
- Patent number 9,966,344
- Issue date May 8, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 9,935,074
- Issue date Apr 3, 2018
- Denso Corporation
- Syoichirou Oomae
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Clock generation circuitry
- Patent number 9,887,667
- Issue date Feb 6, 2018
- SOCIONEXT INC.
- Ian Juso Dedic
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated power transfer device
- Patent number 9,812,989
- Issue date Nov 7, 2017
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip, chip package and die
- Patent number 9,331,059
- Issue date May 3, 2016
- Infineon Technologies AG
- Robert Allinger
- G01 - MEASURING TESTING
Information Patent Grant
Flexible sized die for use in multi-die integrated circuit
- Patent number 9,026,872
- Issue date May 5, 2015
- Xilinx, Inc.
- Rafael C. Camarota
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240194573
- Publication date Jun 13, 2024
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343700
- Publication date Oct 26, 2023
- RENESAS ELECTRONICS CORPORATION
- Nobuhito SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230299046
- Publication date Sep 21, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- Chih-Chiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20230245982
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION DEVICE, POWER DISTRIBUTION SYSTEM AND MANUFACTUR...
- Publication number 20230223370
- Publication date Jul 13, 2023
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20220352087
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED PILLAR DIES HAVING INTEGRATED ELECTROMAGNETIC SHIELD LAYERS
- Publication number 20220302042
- Publication date Sep 22, 2022
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
- Publication number 20220130778
- Publication date Apr 28, 2022
- Cirrus Logic International Semiconductor Ltd.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING OF THREE-DIMENSIONAL CIRCUITS INCLUDING THROUGH-SILICON-VIAS
- Publication number 20200098729
- Publication date Mar 26, 2020
- Facebook Technologies, LLC
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
- Publication number 20180226893
- Publication date Aug 9, 2018
- Power Integrations, Inc.
- Balu Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCK GENERATION CIRCUITRY
- Publication number 20170264241
- Publication date Sep 14, 2017
- SOCIONEXT INC.
- Ian Juso DEDIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC CONTROL UNIT AND VEHICLE APPARATUS
- Publication number 20170184658
- Publication date Jun 29, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira Uemura
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170103962
- Publication date Apr 13, 2017
- Denso Corporation
- Syoichirou OOMAE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077044
- Publication date Mar 16, 2017
- Fuji Electric Co., Ltd.
- Shin Soyano
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BACK-TO-BACK STACKED DIES
- Publication number 20170053904
- Publication date Feb 23, 2017
- INTERSIL AMERICAS LLC
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
- Publication number 20160233774
- Publication date Aug 11, 2016
- Power Integrations, Inc.
- Balu Balakrishnan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device Having Multiple Contact Clips
- Publication number 20150214189
- Publication date Jul 30, 2015
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CHIP PACKAGE AND DIE
- Publication number 20150162318
- Publication date Jun 11, 2015
- INFINEON TECHNOLOGIES AG
- Robert Allinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
- Publication number 20140131843
- Publication date May 15, 2014
- Power Integrations, Inc.
- Balu Balakrishnan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE SIZED DIE FOR USE IN MULTI-DIE INTEGRATED CIRCUIT
- Publication number 20140049932
- Publication date Feb 20, 2014
- Xilinx, Inc.
- Rafael C. Camarota
- G01 - MEASURING TESTING

Digital-to-analog converter [DAC]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display pixels with integrated pipeline

Plated pillar dies having integrated electromagnetic shield layers

Semiconductor package with electromagnetic interference shielding

Coupling of integrated circuits (ICS) through a passivation-defined...

Semiconductor device, electronic control unit and vehicle apparatus

Magnetically coupled galvanically isolated communication using lead...

Stacking of three-dimensional circuits including through-silicon-vias

Magnetically coupled galvanically isolated communication using lead...

Back-to-back stacked dies

Magnetically coupled galvanically isolated communication using lead...

Semiconductor device with separated main terminals

Semiconductor device and method for manufacturing same

Clock generation circuitry

Semiconductor device having multiple contact clips

Isolated power transfer device

Chip, chip package and die

Flexible sized die for use in multi-die integrated circuit

Patents Applicationslast 30 patents

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE DEVICE AND METHOD OF OPERATING THE SAME

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

POWER DISTRIBUTION DEVICE, POWER DISTRIBUTION SYSTEM AND MANUFACTUR...

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

PLATED PILLAR DIES HAVING INTEGRATED ELECTROMAGNETIC SHIELD LAYERS

COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...

STACKING OF THREE-DIMENSIONAL CIRCUITS INCLUDING THROUGH-SILICON-VIAS

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...

CLOCK GENERATION CIRCUITRY

SEMICONDUCTOR DEVICE, ELECTRONIC CONTROL UNIT AND VEHICLE APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

BACK-TO-BACK STACKED DIES

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...

Semiconductor Device Having Multiple Contact Clips

CHIP, CHIP PACKAGE AND DIE

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...

FLEXIBLE SIZED DIE FOR USE IN MULTI-DIE INTEGRATED CIRCUIT