Dip coating

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H01L2224/43822

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/43822Dip coating

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Patents Grantslast 30 patents

Information Patent Grant
Resin coated bonding wire, method of manufacturing the same, and se...
- Patent number 5,396,104
- Issue date Mar 7, 1995
- Nippon Steel Corporation
- Masao Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wire bonding with applied insulative coating
- Patent number 4,678,114
- Issue date Jul 7, 1987
- Kabushiki Kaisha Toshiba
- Hideharu Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire, semiconductor device having the same, and bonding met...
- Patent number 4,488,674
- Issue date Dec 18, 1984
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hideharu Egawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS