Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces

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H01L2224/82895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82895Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Stitched devices
- Patent number 10,535,645
- Issue date Jan 14, 2020
- ALSEPHINA INNOVATIONS INC.
- Wei Shao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STITCHED DEVICES
- Publication number 20170125396
- Publication date May 4, 2017
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei SHAO
- H01 - BASIC ELECTRIC ELEMENTS