Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces

Follow

Industry

CPC
H01L2224/84895

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84895Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces

Industries

No activities in the last 12 months