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H01L2224/81206

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81206Direction of oscillation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device, device, and manufacturing method
- Patent number 11,854,957
- Issue date Dec 26, 2023
- Seiko Epson Corporation
- Naoki Il
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact bump connection and contact bump and method for producing a...
- Patent number 10,292,270
- Issue date May 14, 2019
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Clamping mechanism for processing of a substrate within a substrate...
- Patent number 9,443,819
- Issue date Sep 13, 2016
- Apple Inc.
- Gerard Anthony C. Afable
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Contact bumps methods of making contact bumps
- Patent number 9,215,809
- Issue date Dec 15, 2015
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method of fabricating the same
- Patent number 9,214,445
- Issue date Dec 15, 2015
- Taiyo Yuden Co., Ltd.
- Motoi Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,884,447
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Hiroaki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic terminals by using elastic contact
- Patent number 7,810,701
- Issue date Oct 12, 2010
- Alps Electric Co., Ltd.
- Shinichi Nagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and electronic parts packaging structure
- Patent number 7,557,450
- Issue date Jul 7, 2009
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and electronic parts packaging structure
- Patent number 7,183,647
- Issue date Feb 27, 2007
- Shinko Electric Industries, Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device and manufacturing method therefor
- Patent number 6,933,615
- Issue date Aug 23, 2005
- Murata Manufacturing Co., Ltd.
- Takenobu Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,756,686
- Issue date Jun 29, 2004
- Renesas Technology Corp.
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting apparatus for electronic part
- Patent number 6,543,668
- Issue date Apr 8, 2003
- Taiyo Yuden Co., Ltd.
- Tomonori Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing semiconductor device, and se...
- Patent number 6,509,206
- Issue date Jan 21, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold-based electrical interconnections for microelectronic devices
- Patent number 6,500,760
- Issue date Dec 31, 2002
- Sandia Corporation
- Kenneth A. Peterson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for packaging high temperature solid state ele...
- Patent number 6,169,330
- Issue date Jan 2, 2001
- Astrulux, Inc.
- Jacques Isaac Pankove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging high temperature solid state ele...
- Patent number 5,930,666
- Issue date Jul 27, 1999
- Astralux, Incorporated
- Jacques Isaac Pankove
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, ELECTRONIC DEVICE HAVING THE SAME AND METHOD OF...
- Publication number 20180114768
- Publication date Apr 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Sang Hyeon SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
- Publication number 20140339695
- Publication date Nov 20, 2014
- Taiyo Yuden Co., Ltd.
- Motoi YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20140084460
- Publication date Mar 27, 2014
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120292760
- Publication date Nov 22, 2012
- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT
- Publication number 20090250154
- Publication date Oct 8, 2009
- Alps Electric Co., Ltd.
- Shinichi Nagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR
- Publication number 20080303147
- Publication date Dec 11, 2008
- FUJITSU TEN LIMITED
- Hiromichi WATANABE
- G01 - MEASURING TESTING
Information Patent Application
Wiring substrate and electronic parts packaging structure
- Publication number 20070114673
- Publication date May 24, 2007
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC PARTS PACKAGING STRUCTURE
- Publication number 20040212087
- Publication date Oct 28, 2004
- SHINKO ELECTRIC INDUSTRIES CO., LTD
- Kei MURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component device and manufacturing method therefor
- Publication number 20040178486
- Publication date Sep 16, 2004
- Murata Manufacturing Co., Ltd.
- Takenobu Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20030057537
- Publication date Mar 27, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating semiconductor device
- Publication number 20020081768
- Publication date Jun 27, 2002
- Koji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for manufacturing semiconductor device, and se...
- Publication number 20020070459
- Publication date Jun 13, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS

Direction of oscillation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit device, device, and manufacturing method

Contact bump connection and contact bump and method for producing a...

Clamping mechanism for processing of a substrate within a substrate...

Contact bumps methods of making contact bumps

Electronic component and method of fabricating the same

Semiconductor device and method of manufacturing the same

Method for bonding metallic terminals by using elastic contact

Wiring substrate and electronic parts packaging structure

Wiring substrate and electronic parts packaging structure

Electronic component device and manufacturing method therefor

Semiconductor device

Mounting method and mounting apparatus for electronic part

Method and apparatus for manufacturing semiconductor device, and se...

Gold-based electrical interconnections for microelectronic devices

Method and apparatus for packaging high temperature solid state ele...

Method and apparatus for packaging high temperature solid state ele...

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

SEMICONDUCTOR CHIP, ELECTRONIC DEVICE HAVING THE SAME AND METHOD OF...

ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME

Contact bumps methods of making contact bumps

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Wiring substrate and electronic parts packaging structure

WIRING SUBSTRATE AND ELECTRONIC PARTS PACKAGING STRUCTURE

Electronic component device and manufacturing method therefor

Semiconductor device

Semiconductor device and method of fabricating semiconductor device

Method and apparatus for manufacturing semiconductor device, and se...