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Discharge electrode
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CPC
H01L2224/76268
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/76268
Discharge electrode
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding structure of multilayer copper bonding wire
Patent number
8,836,147
Issue date
Sep 16, 2014
Nippon Steel & Sumikin Materials Co., Ltd.
Tomohiro Uno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
Publication number
20130180757
Publication date
Jul 18, 2013
Nippon Micrometal Corporation
Tomohiro Uno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR