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H01L2224/171

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/171Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 12,255,149
- Issue date Mar 18, 2025
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Game engine on a chip
- Patent number 12,249,018
- Issue date Mar 11, 2025
- TMRW FOUNDATION IP S.ÀR.L.
- Cevat Yerli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit substrate structure and manufacturing method thereof
- Patent number 12,243,838
- Issue date Mar 4, 2025
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate void filling for an integrated circuit assembly
- Patent number 12,237,300
- Issue date Feb 25, 2025
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,218,100
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Inhyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 12,216,543
- Issue date Feb 4, 2025
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,199,063
- Issue date Jan 14, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double resist structure for electrodeposition bonding
- Patent number 12,183,708
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Koki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,154,884
- Issue date Nov 26, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
- Publication number 20250116810
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Daegon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK
- Publication number 20250111765
- Publication date Apr 3, 2025
- Xilinx, Inc.
- Thomas Paul LEBOEUF
- G08 - SIGNALLING
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105158
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sung Min MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105193
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20250096178
- Publication date Mar 20, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250096194
- Publication date Mar 20, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...
- Publication number 20250087252
- Publication date Mar 13, 2025
- Rambus Inc.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079250
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079379
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250062241
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL CHANNEL, MODULE SUBSTRATE, AND SEMICONDUCTOR SYSTEM INCLUDIN...
- Publication number 20250062239
- Publication date Feb 20, 2025
- UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
- HYUN JUN PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...
- Publication number 20250062269
- Publication date Feb 20, 2025
- Micron Technology, Inc.
- Kai Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250046659
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Se Ra Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250015049
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE POWER TRANSFER ON PRINTED CIRCUIT BOARD
- Publication number 20250006713
- Publication date Jan 2, 2025
- Intel Corporation
- Bharath Reddy GUDIGOPURAM
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package process and package structure

Semiconductor packages with an intermetallic layer

Wire bond wires for interference shielding

Semiconductor device and data transferring method for semiconductor...

Game engine on a chip

Three dimensional circuit implementing machine trained network

Circuit substrate structure and manufacturing method thereof

Alternative surfaces for conductive pad layers of silicon bridges f...

Through-substrate void filling for an integrated circuit assembly

Semiconductor package

Devices and methods related to radio-frequency filters on silicon-o...

Fan-out package having a main die and a dummy die

TSV check circuit with replica path

Semiconductor package

Multi-chip package with high density interconnects

Semiconductor package and method of forming the same

Fault tolerant memory systems and components with interconnected an...

Semiconductor package for improving power integrity characteristics

Microelectronic package with solder array thermal interface materia...

Honeycomb pattern for conductive features

Microelectronic assemblies

Integrated voltage regulator (IVR) package including inductor and c...

Double resist structure for electrodeposition bonding

Metal-free frame design for silicon bridges for semiconductor packages

Multi-tier IC package including processor and high bandwidth memory

Semiconductor packaging method, semiconductor assembly and electron...

Bonding structures and methods for forming the same

Forming large chips through stitching

Semiconductor package

Integrated fan-out package and the methods of manufacturing

Patents Applicationslast 30 patents

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

TAMPER SENSOR FOR 3-DIMENSIONAL DIE STACK

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE

MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED S...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Package

SEMICONDUCTOR DEVICE

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SIGNAL CHANNEL, MODULE SUBSTRATE, AND SEMICONDUCTOR SYSTEM INCLUDIN...

SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...

FORMING LARGE CHIPS THROUGH STITCHING

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLIES

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

HIGH VOLTAGE POWER TRANSFER ON PRINTED CIRCUIT BOARD