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H01L2224/141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/141Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,165,951
- Issue date Dec 10, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,119,288
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for pixel data compensation for display drivers w...
- Patent number 12,051,355
- Issue date Jul 30, 2024
- Synaptics Incorporated
- Kazuhiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,046,535
- Issue date Jul 23, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, optical structure and method for manufacturing t...
- Patent number 12,033,934
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density microbump and probe pad arrangement for semiconductor...
- Patent number 12,033,903
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Nikhil Jayakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 12,026,008
- Issue date Jul 2, 2024
- Altera Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 12,027,492
- Issue date Jul 2, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE
- Publication number 20240411096
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...
- Publication number 20240332134
- Publication date Oct 3, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD
- Publication number 20240332236
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shenggao LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL MAP PATTERN
- Publication number 20240332154
- Publication date Oct 3, 2024
- Cisco Technology, Inc.
- Wenbin MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332328
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Hui-Tzu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321799
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321797
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yoshiaki SHIMOOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE
- Publication number 20240321801
- Publication date Sep 26, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Haiying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321667
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240304584
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hai-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...
- Publication number 20240297165
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION
- Publication number 20240290709
- Publication date Aug 29, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20240282672
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- BONGWEE YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES
- Publication number 20240266348
- Publication date Aug 8, 2024
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240250093
- Publication date Jul 25, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE
- Publication number 20240250052
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including anisotropic conductive film (ACF)

RF devices with enhanced performance and methods of forming the same

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device assembly with die support structures

Forming large chips through stitching

Integrated fan-out package and the methods of manufacturing

Semiconductor package including test bumps

Semiconductor bonding structures and methods

Semiconductor package

Multi-chip package and method of providing die-to-die interconnects...

Stress reduction apparatus and method

High density interconnect device and method

Bump structure having a side recess and semiconductor structure inc...

Joint structure in semiconductor package and manufacturing method t...

Method of manufacturing an integrated fan-out package having fan-ou...

Multi-die fine grain integrated voltage regulation

Device and method for pixel data compensation for display drivers w...

Wafer level chip scale packaging intermediate structure apparatus a...

RF devices with enhanced performance and methods of forming the same

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Package structure, optical structure and method for manufacturing t...

Chip package structure

Thermal pads between stacked semiconductor dies and associated syst...

Package-on-package semiconductor assemblies and methods of manufact...

Package structure with bridge die laterally wrapped by insulating e...

High-density microbump and probe pad arrangement for semiconductor...

Techniques for clock signal transmission in integrated circuits and...

Semiconductor module and semiconductor device

Advanced device assembly structures and methods

Multilayer body and method of manufacturing the same

Patents Applicationslast 30 patents

OPTOELECTRONIC PACKAGE STRUCTURE

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

METHOD OF FORMING PACKAGE STRUCTURE

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...

SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

BALL MAP PATTERN

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...

COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION

SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT

FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE