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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/141
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic module and electronic device
Patent number
12,368,108
Issue date
Jul 22, 2025
Canon Kabushiki Kaisha
Nobuaki Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
12,368,132
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
Patent number
12,362,343
Issue date
Jul 15, 2025
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
12,362,178
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods of LIDAR sensor systems having integrated semic...
Patent number
12,352,868
Issue date
Jul 8, 2025
AURORA OPERATIONS, INC.
James Ferrara
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compact routing package for high frequency isolation
Patent number
12,315,790
Issue date
May 27, 2025
Cypress Semiconductor Corporation
Chenxi Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures to increase substrate routing density and methods of for...
Patent number
12,308,321
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
12,300,598
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming thereof
Patent number
12,300,656
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip socket, testing fixture and chip testing method thereof
Patent number
12,292,455
Issue date
May 6, 2025
NANYA TECHNOLOGY CORPORATION
Shih-Ting Lin
G11 - INFORMATION STORAGE
Information
Patent Grant
Polyimide profile control
Patent number
12,288,758
Issue date
Apr 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Chi Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and method of forming the same
Patent number
12,283,537
Issue date
Apr 22, 2025
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
Patent number
12,283,559
Issue date
Apr 22, 2025
Texas Instruments Incorporated
Lin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display substrate and display device
Patent number
12,278,213
Issue date
Apr 15, 2025
BOE Technology Group Co., Ltd.
Mingxing Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package with 3D magnetic core inductor
Patent number
12,272,637
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including adhesive layer and method for manuf...
Patent number
12,218,065
Issue date
Feb 4, 2025
Samsung Electronics Co., Ltd.
Yeohoon Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package with high density interconnects
Patent number
12,218,069
Issue date
Feb 4, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die connection system and method
Patent number
12,218,093
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier structures between external electrical connectors
Patent number
12,218,035
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
Patent number
12,211,864
Issue date
Jan 28, 2025
NINGBO SUNNY OPOTECH CO., LTD.
Zhongyu Luan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package for improving power integrity characteristics
Patent number
12,213,256
Issue date
Jan 28, 2025
Samsung Electronics Co., Ltd.
Junghwa Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fine pitch copper pillar package and method
Patent number
12,191,241
Issue date
Jan 7, 2025
Amkor Technology Singapore Holding Pte Ltd.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure comprising up-narrow and down-wide openings...
Patent number
12,191,271
Issue date
Jan 7, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zengyan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a high reliability
Patent number
12,183,718
Issue date
Dec 31, 2024
Samsung Electronics Co., Ltd.
Ji-Hwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
Patent number
12,183,655
Issue date
Dec 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost package warpage solution
Patent number
12,183,596
Issue date
Dec 31, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with varying interconnects
Patent number
12,183,702
Issue date
Dec 31, 2024
International Business Machines Corporation
Kamal K. Sikka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing display panel, display panel, and display...
Patent number
12,176,334
Issue date
Dec 24, 2024
Shanghai Tianma Micro-Electronics Co., Ltd.
Canyuan Zhang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250239571
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Jaejun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
Publication number
20250226269
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
MING-CHUNG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
Publication number
20250218998
Publication date
Jul 3, 2025
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
Publication number
20250218880
Publication date
Jul 3, 2025
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT...
Publication number
20250218961
Publication date
Jul 3, 2025
Intel Corporation
Tolga Acikalin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD DESIGN FOR EMBEDDED INTERCONNECT BRIDGES IN PACKAGE SUBSTRATES
Publication number
20250218959
Publication date
Jul 3, 2025
Intel Corporation
Minglu LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF ALIGNMENT STRUCTURES FOR INTERCONNECT BRIDGES
Publication number
20250218965
Publication date
Jul 3, 2025
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS OF LIDAR SENSOR SYSTEMS HAVING INTEGRATED SEMIC...
Publication number
20250208299
Publication date
Jun 26, 2025
AURORA OPERATIONS, INC.
James Ferrara
B60 - VEHICLES IN GENERAL
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
Publication number
20250210426
Publication date
Jun 26, 2025
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE FOR PHOTONIC COMPONENTS
Publication number
20250210490
Publication date
Jun 26, 2025
Nokia Solutions and Networks Oy
Juthika BASAK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
Publication number
20250194011
Publication date
Jun 12, 2025
Samsung Electronics Co., Ltd.
Eunhye Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
Publication number
20250192069
Publication date
Jun 12, 2025
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRESS MITIGATING PILLAR BUMPS
Publication number
20250183211
Publication date
Jun 5, 2025
QUALCOMM Incorporated
Wei HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Connection System and Method
Publication number
20250174591
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
Publication number
20250174495
Publication date
May 29, 2025
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Sheng HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
Publication number
20250167046
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Pang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250167151
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Chonghee LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Level Integration of Passive Devices
Publication number
20250167176
Publication date
May 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
Publication number
20250157971
Publication date
May 15, 2025
Institute of Semiconductors, Guangdong Academy of Sciences
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF
Publication number
20250157970
Publication date
May 15, 2025
Chipbond Technology Corporation
Kung-Tzu Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
Publication number
20250149489
Publication date
May 8, 2025
Apple Inc.
Jared L. Zerbe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250149494
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP ARRANGEMENT OF INTEGRATED CIRCUITS FOR FLIP CHIP BONDING
Publication number
20250140725
Publication date
May 1, 2025
SYNAPTICS INCORPORATED
Shinya Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...
Publication number
20250125271
Publication date
Apr 17, 2025
Samsung Electronics Co., Ltd.
Yeohoon YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
Publication number
20250125275
Publication date
Apr 17, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
Publication number
20250125307
Publication date
Apr 17, 2025
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20250118631
Publication date
Apr 10, 2025
WINBOND ELECTRONICS CORP.
Jin-Neng WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...
Publication number
20250118663
Publication date
Apr 10, 2025
JARIET TECHNOLOGIES, INC.
Scott Richard POWELL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
Publication number
20250112198
Publication date
Apr 3, 2025
Intel Corporation
Pratyasha Mohapatra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
Publication number
20250112175
Publication date
Apr 3, 2025
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS