Disposition

Industry

CPC
H01L2924/162

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/162Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package aligning interposer and substrate
- Patent number 12,051,680
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,002,735
- Issue date Jun 4, 2024
- Tien-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and manufacturing method thereof
- Patent number 11,948,899
- Issue date Apr 2, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating component, semiconductor package, and semiconductor appa...
- Patent number 11,901,247
- Issue date Feb 13, 2024
- Kyocera Corporation
- Masami Juta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave filter apparatus
- Patent number 11,831,300
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit power delivery
- Patent number 11,817,394
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die assemblies having molded underfill structures and...
- Patent number 11,749,666
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Bradley R. Bitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
- Patent number 11,721,639
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...
- Publication number 20250038063
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...
- Publication number 20250006572
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20240376294
- Publication date Nov 14, 2024
- SUMITOMO CHEMICAL CO., LTD.
- Thomas Fletcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...
- Publication number 20240379494
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240266377
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243110
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...
- Publication number 20240222335
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Bo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
- Publication number 20240213112
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240186213
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Jin REE
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

MEMS packages and methods of manufacture thereof

Reliable semiconductor packages

Semiconductor device and manufacturing method thereof

Embedded liquid cooling

Semiconductor package and method of manufacturing semiconductor pac...

Multi-component modules (MCMs) including configurable electromagnet...

Non-conductive film sheet and semiconductor package including the same

Semiconductor package aligning interposer and substrate

Embedded lid for low cost and improved thermal performance

Bonding structure and method thereof

Semiconductor package

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor package structure and method for forming the same

3DIC packaging with hot spot thermal management features

Semiconductor substrate structure and manufacturing method thereof

Image sensor device

Insulating component, semiconductor package, and semiconductor appa...

Wearable device with combined sensing capabilities

Thermal transfer structures for semiconductor die assemblies

Electronic device package and method of manufacturing the same

Elastic wave filter apparatus

Semiconductor circuit power delivery

Three dimensional circuit implementing machine trained network

Methods of manufacturing stacked semiconductor die assemblies with...

Methods for establishing thermal joints between heat spreaders or l...

Semiconductor die assemblies having molded underfill structures and...

Multi-component modules (MCMs) including configurable electro-magne...

MEMS packages and methods of manufacture thereof

Interconnect structure with redundant electrical connectors and ass...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...

PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...

EMBEDDED SEMICONDUCTOR DEVICE

Semiconductor Device Package with Thermal Module

ELECTRONIC DEVICE WITH A REINFORCING LAYER

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

THERMALLY CONDUCTIVE COMPOSITION

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

CHIP PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE AND METHOD THEREOF

IMAGE SENSOR DEVICE

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

SEMICONDUCTOR PACKAGE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...

EMBEDDED LIQUID COOLING

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES