Disposition

Industry

CPC
H01L2224/091

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/091Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,068,299
- Issue date Aug 20, 2024
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 11,990,448
- Issue date May 21, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,942,463
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having adjoined via structures formed by bond...
- Patent number 11,887,954
- Issue date Jan 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,876,080
- Issue date Jan 16, 2024
- Kioxia Corporation
- Masahiro Yoshihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,862,606
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 11,855,130
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,830,853
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 11,824,042
- Issue date Nov 21, 2023
- Xcelsis Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor package including semiconduc...
- Patent number 11,769,700
- Issue date Sep 26, 2023
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite IC chips including a chiplet embedded within metallizatio...
- Patent number 11,749,649
- Issue date Sep 5, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,721,684
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, integrated circuit package and display app...
- Patent number 11,721,640
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Jun-gu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display having multi-color pixel array and method of fabr...
- Patent number 11,721,681
- Issue date Aug 8, 2023
- Korea Advanced Institute of Science and Technology
- Sanghyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,710,727
- Issue date Jul 25, 2023
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Vias in composite IC chip structures
- Patent number 11,694,986
- Issue date Jul 4, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC-embedded substrate having heat dissipation structu...
- Patent number 11,682,628
- Issue date Jun 20, 2023
- TDK Corporation
- Kazutoshi Tsuyutani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250015038
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404970
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371849
- Publication date Nov 7, 2024
- KIOXIA Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240274576
- Publication date Aug 15, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP SHARING DATA BUS
- Publication number 20240266325
- Publication date Aug 8, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE
- Publication number 20240222322
- Publication date Jul 4, 2024
- SAMSUNG ELECRTONICS CO., LTD.
- Hanmin Nam
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222331
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170456
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Seo Eun KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079392
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079391
- Publication date Mar 7, 2024
- Taiwan Semiconductor Mqanufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411328
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...
- Publication number 20230402416
- Publication date Dec 14, 2023
- Airoha Technology (HK) Limited
- Huan-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230395536
- Publication date Dec 7, 2023
- Murata Manufacturing Co., Ltd.
- Naohide TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20230378247
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting multiple chips using an interconnect device

Semiconductor package

Semiconductor storage device

Bonded assembly containing different size opposing bonding pads and...

Method for forming a three-dimensional (3D) memory device having bo...

Semiconductor device and method of manufacturing the same

Chip package structure

Hybrid bonding with uniform pattern density

Direct bonding in microelectronic assemblies

Semiconductor devices

MEMS device having a metallization structure embedded in a dielectr...

Semiconductor device and method of manufacturing

Semiconductor devices having adjoined via structures formed by bond...

Semiconductor memory device

Packages with metal line crack prevention design

Three-dimensional device structure including substrate-embedded int...

Offset-aligned three-dimensional integrated circuit

Wafer chip scale packages with visible solder fillets

Wafer scale bonded active photonics interposer

Semiconductor devices and methods for manufacturing the same

3D chip sharing data bus

DBI to SI bonding for simplified handle wafer

Semiconductor substrate, semiconductor package including semiconduc...

Composite IC chips including a chiplet embedded within metallizatio...

Semiconductor device

Integrated circuit chip, integrated circuit package and display app...

Micro LED display having multi-color pixel array and method of fabr...

Semiconductor storage device

Vias in composite IC chip structures

Semiconductor IC-embedded substrate having heat dissipation structu...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

3D CHIP SHARING DATA BUS

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

NON-VOLATILE MEMORY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Die Structures and Methods of Forming the Same

3DIC Package and Method Forming the Same

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

Dielectric Blocking Layer and Method Forming the Same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

FINE-PITCH JOINING PAD STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME