Disposition

Industry

CPC
H01L2224/091

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/091Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine-pitch joining pad structure
- Patent number 12,354,983
- Issue date Jul 8, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with peculiar bond pad arrangement for leveraging...
- Patent number 12,327,806
- Issue date Jun 10, 2025
- Airoha Technology (HK) Limited
- Huan-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 12,278,204
- Issue date Apr 15, 2025
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, apparatus, and chip
- Patent number 12,278,200
- Issue date Apr 15, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,132,040
- Issue date Oct 29, 2024
- Kioxia Corporation
- Nobuaki Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,068,299
- Issue date Aug 20, 2024
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 11,990,448
- Issue date May 21, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,942,463
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having adjoined via structures formed by bond...
- Patent number 11,887,954
- Issue date Jan 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,876,080
- Issue date Jan 16, 2024
- Kioxia Corporation
- Masahiro Yoshihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,862,606
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 11,855,130
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,830,853
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226355
- Publication date Jul 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250219000
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20250203893
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183230
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...
- Publication number 20250174509
- Publication date May 29, 2025
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250167147
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149480
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonhee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20250105183
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyung Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105193
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079291
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHO...
- Publication number 20250070102
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250038142
- Publication date Jan 30, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250015038
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404970
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371849
- Publication date Nov 7, 2024
- KIOXIA Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
- Publication number 20240274576
- Publication date Aug 15, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP SHARING DATA BUS
- Publication number 20240266325
- Publication date Aug 8, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE
- Publication number 20240222322
- Publication date Jul 4, 2024
- SAMSUNG ELECRTONICS CO., LTD.
- Hanmin Nam
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222331
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Chip package structure and storage system

Fine-pitch joining pad structure

Semiconductor die with peculiar bond pad arrangement for leveraging...

Semiconductor package

DBI to SI bonding for simplified handle wafer

3D chip sharing data bus

Pattern decomposition lithography techniques

Semiconductor element, apparatus, and chip

Three-dimensional device structure including substrate-embedded int...

Connecting multiple chips using an interconnect device

Semiconductor package

Semiconductor storage device

Bonded assembly containing different size opposing bonding pads and...

Method for forming a three-dimensional (3D) memory device having bo...

Semiconductor device and method of manufacturing the same

Chip package structure

Hybrid bonding with uniform pattern density

Direct bonding in microelectronic assemblies

Semiconductor devices

MEMS device having a metallization structure embedded in a dielectr...

Semiconductor device and method of manufacturing

Semiconductor devices having adjoined via structures formed by bond...

Semiconductor memory device

Packages with metal line crack prevention design

Three-dimensional device structure including substrate-embedded int...

Offset-aligned three-dimensional integrated circuit

Wafer chip scale packages with visible solder fillets

Wafer scale bonded active photonics interposer

Semiconductor devices and methods for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN B...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

3D CHIP SHARING DATA BUS

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

NON-VOLATILE MEMORY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE