Disposition

Industry

CPC
H01L2224/211

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/211Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,211,801
- Issue date Jan 28, 2025
- Parabellum Strategic Opportunities Fund LLC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 12,211,817
- Issue date Jan 28, 2025
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out LED packaging structure and method
- Patent number 12,132,036
- Issue date Oct 29, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnection package structure and method
- Patent number 12,112,956
- Issue date Oct 8, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,736
- Issue date Sep 10, 2024
- Kabushiki Kaisha Toshiba
- Tatsuya Nishiwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity memory circuit with low effective latency
- Patent number 12,073,082
- Issue date Aug 27, 2024
- SUNRISE MEMORY CORPORATION
- Youn Cheul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic package and method of manufacture
- Patent number 12,038,599
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,021,053
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,002,781
- Issue date Jun 4, 2024
- Tokyo Institute of Technology
- Takayuki Ohba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuits on soft substrates
- Patent number 11,996,380
- Issue date May 28, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a through-electrode penetrating a m...
- Patent number 11,942,458
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including seed structure and method of manufa...
- Patent number 11,935,858
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,963
- Issue date Jan 30, 2024
- Kioxia Corporation
- Kazuma Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 11,862,610
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
- Publication number 20250046743
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20250029947
- Publication date Jan 23, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...
- Publication number 20250022859
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20250006616
- Publication date Jan 2, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME
- Publication number 20240387433
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240387387
- Publication date Nov 21, 2024
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING AND METHODS OF FORMING SAME
- Publication number 20240379618
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240379489
- Publication date Nov 14, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH MULTIPLE CORE LAYERS TO PROVIDE VARIED THICKNESS CAV...
- Publication number 20240355747
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND FORMING METHOD THE...
- Publication number 20240355986
- Publication date Oct 24, 2024
- Lextar Electronics Corporation
- Shiou-Yi KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347575
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH CAPACITY MEMORY CIRCUIT WITH LOW EFFECTIVE LATENCY
- Publication number 20240345736
- Publication date Oct 17, 2024
- Sunrise Memory Corporation
- Youn Cheul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339392
- Publication date Oct 10, 2024
- InnoLux Corporation
- Chih-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240329302
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240312879
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240304584
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hai-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240304585
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274566
- Publication date Aug 15, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274505
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240264389
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang PU
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Passivation structure with planar top surfaces

Chip package and method of forming the same

Semiconductor device and manufacturing method for semiconductor device

Submodule semiconductor package

Die package and method of forming a die package

Semiconductor package using cavity substrate and manufacturing methods

Package structure having hollow cylinders and method of fabricating...

Multi-chip integrated fan-out package

Package

Fan-out LED packaging structure and method

Semiconductor device assemblies and systems with one or more dies a...

Semiconductor package with dual sides of metal routing

Chip interconnection package structure and method

Method for forming chip package structure

Package structure with conductive patterns in a redistribution layer

Semiconductor device

Package structure and manufacturing method thereof

High capacity memory circuit with low effective latency

Integrated fan-out packaging

Photonic package and method of manufacture

Semiconductor package and method

Semiconductor device and method for manufacturing same

Flexible circuits on soft substrates

Electronic device package and fabricating method thereof

Semiconductor package and method

Semiconductor package and method

Semiconductor package including a through-electrode penetrating a m...

Semiconductor devices including seed structure and method of manufa...

Semiconductor device

Fan-out packages providing enhanced mechanical strength and methods...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...

HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGING AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE

PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE WITH MULTIPLE CORE LAYERS TO PROVIDE VARIED THICKNESS CAV...

MICRO LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND FORMING METHOD THE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

HIGH CAPACITY MEMORY CIRCUIT WITH LOW EFFECTIVE LATENCY

ELECTRONIC DEVICE

Photonic Package and Method of Manufacture

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...

PACKAGE STRUCTURE

Semiconductor Package and Method

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF