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SEMICONDUCTOR PACKAGE
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Publication number 20250046754
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Publication date Feb 6, 2025
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Samsung Electronics Co., Ltd.
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Hyun-Mook Choi
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20250046758
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Publication date Feb 6, 2025
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NUVOTON TECHNOLOGY CORPORATION JAPAN
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Takashi OHASHI
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGING STRUCTURE AND PACKAGING METHOD
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Publication number 20250046776
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Publication date Feb 6, 2025
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Semiconductor Manufacturing International (Shanghai) Corporation
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Jisong JIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250046747
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Publication date Feb 6, 2025
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Samsung Electronics Co., Ltd.
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Junyun KWEON
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250046749
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Publication date Feb 6, 2025
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Samsung Electronics Co., Ltd.
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Hyunsoo Chung
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20250046759
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Publication date Feb 6, 2025
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NUVOTON TECHNOLOGY CORPORATION JAPAN
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Takeshi IMAMURA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250038149
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Publication date Jan 30, 2025
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Samsung Electronics Co., Ltd.
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HYUNGJUN JEON
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP-ON-FILM PACKAGE
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Publication number 20250038064
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Publication date Jan 30, 2025
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Samsung Electronics Co., Ltd.
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Minwoo Cho
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H01 - BASIC ELECTRIC ELEMENTS
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MODULAR CHIPLET SYSTEM
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Publication number 20250029971
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Publication date Jan 23, 2025
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Zero ASIC Corporation
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Andreas Olofsson
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H01 - BASIC ELECTRIC ELEMENTS
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