Disposition

Industry

CPC
H01L2224/2956

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2956Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,181,445
- Issue date Jan 15, 2019
- Mitsubishi Electric Corporation
- Akihisa Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanomicrocrystallite paste for pressureless sintering
- Patent number 9,875,983
- Issue date Jan 23, 2018
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 9,741,677
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having electrode interconnections within a con...
- Patent number 9,252,346
- Issue date Feb 2, 2016
- LG Electronics Inc.
- Byungjoon Rhee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 9,087,778
- Issue date Jul 21, 2015
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 8,746,538
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR DEVICE AND METHOD FOR MANUFACTURING SENSOR DEVICE
- Publication number 20240387437
- Publication date Nov 21, 2024
- MITSUMI ELECTRIC CO., LTD.
- Soichiro SUZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE BONDING STRUC...
- Publication number 20230395551
- Publication date Dec 7, 2023
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi KISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230387062
- Publication date Nov 30, 2023
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170352629
- Publication date Dec 7, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Akihisa FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL
- Publication number 20170352638
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL
- Publication number 20170256515
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20170133341
- Publication date May 11, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Alloy and Semiconductor Device
- Publication number 20160300809
- Publication date Oct 13, 2016
- Hitachi, Ltd
- Takaaki MIYAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE
- Publication number 20150235980
- Publication date Aug 20, 2015
- MITSUMI ELECTRIC CO., LTD.
- Shinya YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140217156
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Aya MUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130134210
- Publication date May 30, 2013
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120211764
- Publication date Aug 23, 2012
- Fujitsu Limited,
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Member for semiconductor device

Semiconductor packages with an intermetallic layer

Bond materials with enhanced plasma resistant characteristics and a...

Semiconductor device including antistatic die attach material

Power module

Method for producing member for semiconductor device and semiconduc...

Nanomicrocrystallite paste for pressureless sintering

UV-curable anisotropic conductive adhesive

Semiconductor device including antistatic die attach material

Bump package and methods of formation thereof

Solder, solder joint structure and method of forming solder joint s...

Hermetically sealed wafer packages

Bonding pad for thermocompression bonding, process for producing a...

Semiconductor device having electrode interconnections within a con...

Joining method and semiconductor device manufacturing method

Hermetically sealed wafer packages

Joining method and semiconductor device manufacturing method

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Electronic component mounting structure

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

SENSOR DEVICE AND METHOD FOR MANUFACTURING SENSOR DEVICE

BONDING STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE BONDING STRUC...

SEMICONDUCTOR DEVICE

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

POWER MODULE

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

Lead-Free Solder Alloy and Semiconductor Device

METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...

Bump Package and Methods of Formation Thereof

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

HERMETICALLY SEALED WAFER PACKAGES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Semiconductor device, circuit board, electro-optic device, electron...