Disposition

Industry

CPC
H01L2224/081

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/081Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,183,715
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,183,698
- Issue date Dec 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple pixel package structure with buried chip and electronic de...
- Patent number 12,183,724
- Issue date Dec 31, 2024
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus having semiconductor substrates...
- Patent number 12,176,340
- Issue date Dec 24, 2024
- Canon Kabushiki Kaisha
- Akira Oseto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,178,055
- Issue date Dec 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods for bonding tested wafers and t...
- Patent number 12,176,320
- Issue date Dec 24, 2024
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,176,309
- Issue date Dec 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yanhong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,176,310
- Issue date Dec 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 12,176,294
- Issue date Dec 24, 2024
- Adeia Semiconductor Bonding Technologies, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device using high stress cleave plane
- Patent number 12,176,326
- Issue date Dec 24, 2024
- Silicon Genesis Corporation
- Theodore E. Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic equipment
- Patent number 12,170,303
- Issue date Dec 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaaki Bairo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daisy-chain seal ring structure
- Patent number 12,170,234
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,170,257
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,170,258
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a lower chip including a peripheral...
- Patent number 12,166,000
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hoonjoo Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-bonded memory stacks with copper-bonded interconnection memo...
- Patent number 12,166,027
- Issue date Dec 10, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor
- Patent number 12,166,059
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Min-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and operation method of detecting defecti...
- Patent number 12,165,721
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kwangho Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 12,166,016
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Publication number 20250006651
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCA...
- Publication number 20250006659
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ji-Feng Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional Stack Package Structure And Method Making The Same
- Publication number 20250006702
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250006596
- Publication date Jan 2, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE
- Publication number 20250006704
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND M...
- Publication number 20250006705
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking Single-Photon Avalanche Diodes and High Voltage Devices
- Publication number 20250006766
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...
- Publication number 20250006669
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Features For Reducing Non-Bond and Methods of Forming the Same
- Publication number 20250006677
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Publication number 20250006678
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006700
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing and Passive Components in a Direct Bonding Layer
- Publication number 20250006630
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006632
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIALS FOR DIRECT BONDING
- Publication number 20250006679
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE SEMICONDUCTOR SO...
- Publication number 20250008736
- Publication date Jan 2, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kartik SONDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- Publication number 20250006663
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250006675
- Publication date Jan 2, 2025
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250006676
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jinkyeong SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS
- Publication number 20250006553
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250006587
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...
- Publication number 20250006695
- Publication date Jan 2, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS
- Publication number 20250006719
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios Panagopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING SCHOTT...
- Publication number 20240429208
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429146
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Minwoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING PERIPHERAL CIRCUIT AND CELL ARR...
- Publication number 20240429187
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Homoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240429147
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with logic circuits and memor...

Method for manufacturing semiconductor structure

Structure and method for isolation of bit-line drivers for a three-...

Multiple pixel package structure with buried chip and electronic de...

Process control for package formation

Photoelectric conversion apparatus having semiconductor substrates...

3D semiconductor memory devices and structures

Semiconductor structure and methods for bonding tested wafers and t...

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Bonded structure with interconnect structure

Semiconductor chip structure

Package structure with photonic die and method

3D chip package based on vertical-through-via connector

Method of forming semiconductor device using high stress cleave plane

Semiconductor device and electronic equipment

Daisy-chain seal ring structure

Semiconductor package and method of fabricating the same

Integrated circuit packages and methods of forming the same

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Integrated circuit assemblies with direct chip attach to circuit bo...

Semiconductor device including a lower chip including a peripheral...

Copper-bonded memory stacks with copper-bonded interconnection memo...

Signal routing between memory die and logic die

Image sensor

Nonvolatile memory device and operation method of detecting defecti...

Manufacturing method of package

Direct-bonded LED arrays drivers

Packaged semiconductor devices including backside power rails and m...

Patents Applicationslast 30 patents

SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT

METHODS AND STRUCTURE FOR REDUCED WARPAGE AND IMPROVED ACOUSTIC SCA...

Three-dimensional Stack Package Structure And Method Making The Same

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

SEMICONDUCTOR DEVICE WITH A SPACED SUPPLY VOLTAGE AND GROUND REFERENCE

PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND M...

Stacking Single-Photon Avalanche Diodes and High Voltage Devices

PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURI...

Bond Features For Reducing Non-Bond and Methods of Forming the Same

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING

SEMICONDUCTOR STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Routing and Passive Components in a Direct Bonding Layer

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

CONDUCTIVE MATERIALS FOR DIRECT BONDING

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE SEMICONDUCTOR SO...

DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING

SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...

ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING SCHOTT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED CIRCUIT DEVICE INCLUDING PERIPHERAL CIRCUIT AND CELL ARR...

SEMICONDUCTOR APPARATUS