Disposition

Industry

CPC
H01L2224/081

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/081Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,327,777
- Issue date Jun 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 12,327,815
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for face bonded semiconductor device
- Patent number 12,327,776
- Issue date Jun 10, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Rui Tze Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,328,867
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 12,322,717
- Issue date Jun 3, 2025
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three-dimensional memory device including a bit-line-bias vertical...
- Patent number 12,322,452
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Naoto Norizuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming integrated chip structure having slotted bond pad...
- Patent number 12,322,715
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,317,494
- Issue date May 27, 2025
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,859
- Issue date May 27, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus manufacturing m...
- Patent number 12,317,627
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having a contact plug electrically conn...
- Patent number 12,317,500
- Issue date May 27, 2025
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,308,355
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, related electronic systems, and methods of...
- Patent number 12,308,333
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,308,344
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compute in memory three-dimensional non-volatile nor memory for neu...
- Patent number 12,307,354
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Yanli Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 12,300,670
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194110
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jihye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250194281
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250192100
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192109
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250191644
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sang-Hoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250192108
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE SIDE SELECT GATE ELECTRICAL ISOLATION IN NAND MEMORY USING I...
- Publication number 20250194091
- Publication date Jun 12, 2025
- SANDISK TECHNOLOGIES, INC.
- Kazuki Isozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS
- Publication number 20250192082
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sangmin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192085
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ARCHITECTURES FOR HYBRID SOLDER AND SOLDERLESS DIE STAC...
- Publication number 20250194109
- Publication date Jun 12, 2025
- Intel Corporation
- Aditya Surendra Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20250194112
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192011
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE
- Publication number 20250192127
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Dong Joo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...
- Publication number 20250192099
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Ashish Alawani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192103
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES
- Publication number 20250194078
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Heonjun Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20250183208
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES
- Publication number 20250183226
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mirror image of geometrical patterns in stacked integrated circuit...
- Publication number 20250183231
- Publication date Jun 5, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Ido Bourstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183242
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN
- Publication number 20250183098
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING POWER GATING SWITCH
- Publication number 20250185260
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183110
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183169
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Won Il Lee
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and manufacturing method thereof

Integrated circuit package and method of forming the same

Heat sink for face bonded semiconductor device

Memory devices having vertical transistors and methods for forming...

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor device and method for manufacturing a semiconductor d...

Three-dimensional memory device including a bit-line-bias vertical...

Method of forming integrated chip structure having slotted bond pad...

Method of manufacturing die stack structure

Shifted via-chain electrical-test measurements for hybrid bonding a...

Semiconductor storage device

Semiconductor memory device

Semiconductor device with redistribution plugs

Conductive buffer layers for semiconductor die assemblies and assoc...

Semiconductor memory device

Semiconductor apparatus and semiconductor apparatus manufacturing m...

Semiconductor memory device having a contact plug electrically conn...

Interconnection structure of a semiconductor chip having pads of di...

Semiconductor device and semiconductor module

Packaging architecture for disaggregated integrated voltage regulators

Microelectronic devices, related electronic systems, and methods of...

Semiconductor package

Semiconductor die, manufacturing method thereof, and semiconductor...

Package-on-package device

Multi-chip package having stress relief structure

Compute in memory three-dimensional non-volatile nor memory for neu...

Seamless bonding layers in semiconductor packages and methods of fo...

DBI to SI bonding for simplified handle wafer

Backside contact for thermal displacement in a multi-wafer stacked...

Hybrid bond pad structure

Patents Applicationslast 30 patents

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER

SEMICONDUCTOR DEVICE

MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

SYSTEM ON INTEGRATED CIRCUIT STRUCTURE

3D STACK PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

MEMORY DEVICE

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SOURCE SIDE SELECT GATE ELECTRICAL ISOLATION IN NAND MEMORY USING I...

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS

SEMICONDUCTOR PACKAGE

METHODS AND ARCHITECTURES FOR HYBRID SOLDER AND SOLDERLESS DIE STAC...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING BRIDGE STRUCTURE

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CHANNEL STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES

Mirror image of geometrical patterns in stacked integrated circuit...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN

MEMORY DEVICE INCLUDING POWER GATING SWITCH

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE