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H05K2201/10856

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10856Divided leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module with an electrically conductive press-fit termina...
- Patent number 11,114,780
- Issue date Sep 7, 2021
- Infineon Technologies AG
- Katharina Teichmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically connecting an electronic module and electro...
- Patent number 10,693,248
- Issue date Jun 23, 2020
- Infineon Technologies AG
- Katharina Teichmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component assembly
- Patent number 9,402,320
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solderless electrical press-fit contacting of electrical...
- Patent number 9,357,656
- Issue date May 31, 2016
- Robert Bosch GmbH
- Patrik Patzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-compliant terminals
- Patent number 9,265,150
- Issue date Feb 16, 2016
- Lear Corporation
- George E. Fox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin header assembly and method of forming the same
- Patent number 9,153,886
- Issue date Oct 6, 2015
- Continental Automotive Systems, Inc.
- Catalin Nastasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting system for electrically connecting electronic devices an...
- Patent number 8,992,267
- Issue date Mar 31, 2015
- Infineon Technologies AG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High aspect ratio stacked MLCC design
- Patent number 8,988,857
- Issue date Mar 24, 2015
- Kemet Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal press-fit connection for printed circuit boards
- Patent number 8,900,008
- Issue date Dec 2, 2014
- International Business Machines Corporation
- James A. Day
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and bus bar assembly
- Patent number 8,701,971
- Issue date Apr 22, 2014
- SUMITOMO WIRING SYSTEMS, LTD.
- Masahiro Tagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board including a flat-type electrical element and capable...
- Patent number 8,618,423
- Issue date Dec 31, 2013
- SANYO Electric Co., Ltd.
- Hirotoshi Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector having a terminal with a tin plated contact pressed again...
- Patent number 8,403,684
- Issue date Mar 26, 2013
- Mitsubishi Electric Corporation
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode assembly and methods
- Patent number 8,324,642
- Issue date Dec 4, 2012
- Once Innovations, Inc.
- Zdenko Grajcar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and method of manufacturing same
- Patent number 8,315,035
- Issue date Nov 20, 2012
- TDK Corporation
- Masaaki Togashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and bus bar assembly
- Patent number 8,094,461
- Issue date Jan 10, 2012
- SUMITOMO WIRING SYSTEMS, LTD.
- Masahiro Tagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact having improved soldering section of high compli...
- Patent number 7,878,870
- Issue date Feb 1, 2011
- Hon Hai Precision Ind. Co., Ltd.
- Chia-Wei Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin for insertion into a receiving opening in a printed circuit boa...
- Patent number 7,828,561
- Issue date Nov 9, 2010
- Robert Bosch GmbH
- Richard Gueckel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source unit, backlight unit and liquid crystal display includ...
- Patent number 7,766,499
- Issue date Aug 3, 2010
- Samsung Electronics Co., Ltd.
- Jin Hee Park
- F21 - LIGHTING
Information Patent Grant
Holding member, mounting structure in which holding member is mount...
- Patent number 7,744,408
- Issue date Jun 29, 2010
- Tyco Electronics Japan G.K.
- Seiji Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method of manufacturing electronic apparatus
- Patent number 7,621,759
- Issue date Nov 24, 2009
- Denso Corporation
- Dai Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including printed circuit board and electronic el...
- Patent number 7,578,681
- Issue date Aug 25, 2009
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring biased socket system
- Patent number 7,470,147
- Issue date Dec 30, 2008
- Intel Corporation
- Victor Prokofiev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery provided with terminals
- Patent number 7,416,812
- Issue date Aug 26, 2008
- Hitachi Maxell Ltd.
- Akira Kishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board mounted terminal construction
- Patent number 7,367,819
- Issue date May 6, 2008
- SUMITOMO WIRING SYSTEMS, LTD.
- Yukinori Saka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing member and fixing structure
- Patent number 7,364,460
- Issue date Apr 29, 2008
- Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Shinji Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit fixing terminal, and electronic component having the same...
- Patent number 7,210,969
- Issue date May 1, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukio Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting terminal and terminal mounting structure
- Patent number 7,189,081
- Issue date Mar 13, 2007
- Yazaki Corporation
- Yoshiyuki Tanaka
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Battery provided with terminals
- Patent number 7,112,388
- Issue date Sep 26, 2006
- Hitachi Maxwell Ltd.
- Akira Kishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical apparatus with compliant pins
- Patent number 7,083,434
- Issue date Aug 1, 2006
- TRW Automotive U.S. LLC
- Mike Blossfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal
- Patent number 7,048,594
- Issue date May 23, 2006
- Sumitomo Wiring Systems, Ltd.
- Takashi Tsuchiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220330429
- Publication date Oct 13, 2022
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module with an Electrically Conductive Press-Fit Termina...
- Publication number 20200251839
- Publication date Aug 6, 2020
- Katharina Teichmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...
- Publication number 20140345124
- Publication date Nov 27, 2014
- ROBERT BOSCH GmbH
- Patrik PATZNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY
- Publication number 20140133122
- Publication date May 15, 2014
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN HEADER ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20140118973
- Publication date May 1, 2014
- Catalin Nastasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PRESS-FIT CONNECTION FOR PRINTED CIRCUIT BOARDS
- Publication number 20130316551
- Publication date Nov 28, 2013
- International Business Machines Corporation
- James A. Day
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD
- Publication number 20130312257
- Publication date Nov 28, 2013
- International Business Machines Corporation
- James A. Day
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM PROVIDED WITH A SOLDER JOINT
- Publication number 20130264102
- Publication date Oct 10, 2013
- Tellabs Oy
- Antti HOLMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE, TERMINAL AND MANUFACTURING METHOD
- Publication number 20130222686
- Publication date Aug 29, 2013
- Pantech Co., Ltd.
- Sun Woo BAEK
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH ASPECT RATIO STACKED MLCC DESIGN
- Publication number 20130146347
- Publication date Jun 13, 2013
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SYSTEM FOR ELECTRICALLY CONNECTING ELECTRONIC DEVICES AN...
- Publication number 20120164865
- Publication date Jun 28, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection Of Printed Circuit Boards
- Publication number 20120156898
- Publication date Jun 21, 2012
- Werner Kallee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable Varistor
- Publication number 20120122326
- Publication date May 17, 2012
- Werner Kallee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD AND BUS BAR ASSEMBLY
- Publication number 20120074208
- Publication date Mar 29, 2012
- SUMITOMO WIRING SYSTEMS, LTD.
- Masahiro TAGANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...
- Publication number 20110235348
- Publication date Sep 29, 2011
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC CONTROL DEVICE USING THE SAME
- Publication number 20100267252
- Publication date Oct 21, 2010
- Matsushita Electric Industrial Co., Ltd.
- Katsuya Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light Emitting Diode Assembly and Methods
- Publication number 20100207150
- Publication date Aug 19, 2010
- ONCE INNOVATIONS, INC.
- Zdenko Grajcar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20100188798
- Publication date Jul 29, 2010
- TDK Corporation
- Masaaki TOGASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL CONTACT HAVING IMPROVED SOLDERING SECTION OF HIGH COMPLI...
- Publication number 20100081329
- Publication date Apr 1, 2010
- HON HAI Precision Industry CO., LTD.
- CHIA-WEI FAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PIN FOR INSERTION INTO A RECEIVING OPENING IN A PRINTED CIRCUIT BOA...
- Publication number 20090298312
- Publication date Dec 3, 2009
- Richard Gueckel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Holding Member, Mounting Structure In Which Holding Member Is Mount...
- Publication number 20090190318
- Publication date Jul 30, 2009
- Seiji Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic apparatus and method of manufacturing electronic apparatus
- Publication number 20090191730
- Publication date Jul 30, 2009
- DENSO CORPORATION
- Dai Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device including printed circuit board and electronic el...
- Publication number 20090068864
- Publication date Mar 12, 2009
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD INCLUDING A FLAT-TYPE ELECTRICAL ELEMENT AND CAPABLE...
- Publication number 20080236880
- Publication date Oct 2, 2008
- Sanyo Electric Co., Ltd.
- Hirotoshi OZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant pin
- Publication number 20080166928
- Publication date Jul 10, 2008
- Liang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20080142571
- Publication date Jun 19, 2008
- Takehide Yokozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUD...
- Publication number 20080106898
- Publication date May 8, 2008
- Samsung Electronics Co., Ltd.
- Jin Hee PARK
- G02 - OPTICS
Information Patent Application
Printed board and method for producing the printed board
- Publication number 20080080154
- Publication date Apr 3, 2008
- SIMITOMO WIRING SYSTEMS, LTD.
- Masahiro Tagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector and terminal thereof
- Publication number 20070249240
- Publication date Oct 25, 2007
- Molex Incorporated
- Chun-Hsiang Chiang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method for postponing application of customizing compone...
- Publication number 20070211443
- Publication date Sep 13, 2007
- Rockwell Automation Technologies, Inc.
- David Wechter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Divided leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module with an electrically conductive press-fit termina...

Method for electrically connecting an electronic module and electro...

Electronic component assembly

Method for solderless electrical press-fit contacting of electrical...

Semi-compliant terminals

Pin header assembly and method of forming the same

Connecting system for electrically connecting electronic devices an...

High aspect ratio stacked MLCC design

Universal press-fit connection for printed circuit boards

Printed board and bus bar assembly

Mounting board including a flat-type electrical element and capable...

Connector having a terminal with a tin plated contact pressed again...

Light emitting diode assembly and methods

Multilayer capacitor and method of manufacturing same

Printed board and bus bar assembly

Electrical contact having improved soldering section of high compli...

Pin for insertion into a receiving opening in a printed circuit boa...

Light source unit, backlight unit and liquid crystal display includ...

Holding member, mounting structure in which holding member is mount...

Electronic apparatus and method of manufacturing electronic apparatus

Electronic device including printed circuit board and electronic el...

Spring biased socket system

Battery provided with terminals

Board mounted terminal construction

Fixing member and fixing structure

Press-fit fixing terminal, and electronic component having the same...

Method of mounting terminal and terminal mounting structure

Battery provided with terminals

Electrical apparatus with compliant pins

Terminal

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic Module with an Electrically Conductive Press-Fit Termina...

METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...

ELECTRONIC COMPONENT ASSEMBLY

PIN HEADER ASSEMBLY AND METHOD OF FORMING THE SAME

UNIVERSAL PRESS-FIT CONNECTION FOR PRINTED CIRCUIT BOARDS

CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD

SYSTEM PROVIDED WITH A SOLDER JOINT

CAMERA MODULE, TERMINAL AND MANUFACTURING METHOD

HIGH ASPECT RATIO STACKED MLCC DESIGN

CONNECTING SYSTEM FOR ELECTRICALLY CONNECTING ELECTRONIC DEVICES AN...

Connection Of Printed Circuit Boards

Pluggable Varistor

PRINTED BOARD AND BUS BAR ASSEMBLY

STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...

ELECTRONIC COMPONENT AND ELECTRONIC CONTROL DEVICE USING THE SAME

Light Emitting Diode Assembly and Methods

MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME

ELECTRICAL CONTACT HAVING IMPROVED SOLDERING SECTION OF HIGH COMPLI...

PIN FOR INSERTION INTO A RECEIVING OPENING IN A PRINTED CIRCUIT BOA...

Holding Member, Mounting Structure In Which Holding Member Is Mount...

Electronic apparatus and method of manufacturing electronic apparatus

Electronic device including printed circuit board and electronic el...

MOUNTING BOARD INCLUDING A FLAT-TYPE ELECTRICAL ELEMENT AND CAPABLE...

Compliant pin

ELECTRONIC DEVICE

LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUD...

Printed board and method for producing the printed board

Electrical connector and terminal thereof

System and method for postponing application of customizing compone...