Doping the insulating layers

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H01L21/3115

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/3115Doping the insulating layers

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Patents Grantslast 30 patents

Information Patent Grant
Isolation structures of semiconductor devices
- Patent number 12,363,962
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pinyen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration methods to fabricate internal spacers for nanowire devices
- Patent number 12,363,967
- Issue date Jul 15, 2025
- Sony Group Corporation
- Seiyon Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
System and method for multiple step directional patterning
- Patent number 12,354,873
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Kai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device and resulting device
- Patent number 12,349,449
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tong-Min Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 12,347,725
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating physically unclonable function device
- Patent number 12,322,645
- Issue date Jun 3, 2025
- United Microelectronics Corp.
- Ping-Chia Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,324,193
- Issue date Jun 3, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshinobu Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature patterning using pitch relaxation and directional end-pushi...
- Patent number 12,315,737
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hua Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a gate structure including semiconductor material...
- Patent number 12,315,738
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition window enlargement
- Patent number 12,300,496
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner spacer for semiconductor device
- Patent number 12,283,618
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Ting Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,279,431
- Issue date Apr 15, 2025
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,278,141
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having funnel-shaped gate structures
- Patent number 12,278,267
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming the spacers of a transistor gate
- Patent number 12,261,211
- Issue date Mar 25, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric memory device
- Patent number 12,262,542
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure
- Patent number 12,250,833
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods of the same
- Patent number 12,225,725
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- So Hyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,222,653
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hui Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,327
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures for semiconductor devices
- Patent number 12,218,013
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Fai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized stress modulation by implant to back of wafer
- Patent number 12,217,974
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure of semiconductor device and method of manufacture
- Patent number 12,211,701
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsan-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sacrificial layer for semiconductor process
- Patent number 12,205,994
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsan-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device having source/drain regions including a plurality of...
- Patent number 12,205,988
- Issue date Jan 21, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuyuki Tomida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method for reducing roughness of patterned resist...
- Patent number 12,198,931
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced flicker noise
- Patent number 12,191,374
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming ultra-shallow junction
- Patent number 12,165,876
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jian Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked nanosheet gate-all-around device structures
- Patent number 12,166,042
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for modifying a strain state of at least one semiconductor l...
- Patent number 12,154,786
- Issue date Nov 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES
- Publication number 20250240962
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING ISOLATION PROTECTION FEATURES AND...
- Publication number 20250241051
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED ETCH RESISTANCE OF NITRIDE LAYERS USING CHEMICAL VAPOR DE...
- Publication number 20250226211
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Rajesh PRASAD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLASH MEMORY AND METHOD FOR FORMING THE SAME
- Publication number 20250220898
- Publication date Jul 3, 2025
- WINBOND ELECTRONICS CORP.
- Taku KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250210414
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC MEMORY DEVICE
- Publication number 20250194100
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CAPACITOR ARRAY
- Publication number 20250194117
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Zhi-Xuan SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE IMPLANT FOR GATE-ALL-AROUND DEVICES
- Publication number 20250194127
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Yan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...
- Publication number 20250194165
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Changwoo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION THEREOF
- Publication number 20250185268
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Rong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structures For Semiconductor Devices
- Publication number 20250176250
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Fai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...
- Publication number 20250149451
- Publication date May 8, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVITY OF BORON HARD MASKS USING ION IMPLANT
- Publication number 20250140566
- Publication date May 1, 2025
- Applied Materials, Inc.
- Aykut Aydin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250140568
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- SangHyuk YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250142894
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Huije RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250142934
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Asuka MATSUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PARAMETER IMPLANTATION FOR MANAGING WAFER DISTORTION
- Publication number 20250140567
- Publication date May 1, 2025
- Applied Materials, Inc.
- Stanislav S. TODOROV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER
- Publication number 20250140569
- Publication date May 1, 2025
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250126870
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NBTI REDUCTION AND RELIABILITY IMPROVEMENT FOR SELECTIVE LAYOUTS
- Publication number 20250113586
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul PANDEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Modulation Through Implantation and the Structures Thereof
- Publication number 20250062247
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DOPING CARBON IN THIN FILM ON WAFER
- Publication number 20250054771
- Publication date Feb 13, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
- Publication number 20250046730
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET
- Publication number 20250048670
- Publication date Feb 6, 2025
- ROBERT BOSCH GmbH
- Daniel Krebs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET
- Publication number 20250048674
- Publication date Feb 6, 2025
- ROBERT BOSCH GmbH
- Daniel Krebs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20250046619
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Guifu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEUTRAL STRESS DIAMOND-LIKE CARBON
- Publication number 20250046611
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR
- Publication number 20240426026
- Publication date Dec 26, 2024
- TJ INNOVATIVE SEMICONDUCTOR SUBSTRATE TECHNOLOGY CO., LTD.
- Fengwen MU
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Doping the insulating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Isolation structures of semiconductor devices

Integration methods to fabricate internal spacers for nanowire devices

System and method for multiple step directional patterning

Method for forming semiconductor device and resulting device

Semiconductor structure with material modification and low resistan...

Method for fabricating physically unclonable function device

Semiconductor device and method for manufacturing the same

Feature patterning using pitch relaxation and directional end-pushi...

Method of forming a gate structure including semiconductor material...

Deposition window enlargement

Inner spacer for semiconductor device

Integrated assemblies and methods of forming integrated assemblies

Semiconductor devices and methods of manufacture

Semiconductor devices having funnel-shaped gate structures

Method of forming the spacers of a transistor gate

Ferroelectric memory device

Method for manufacturing semiconductor device structure

Semiconductor devices and manufacturing methods of the same

Method for forming semiconductor structure

Semiconductor device and method

Gate structures for semiconductor devices

Localized stress modulation by implant to back of wafer

Gate structure of semiconductor device and method of manufacture

Sacrificial layer for semiconductor process

FinFET device having source/drain regions including a plurality of...

Ion implantation method for reducing roughness of patterned resist...

Semiconductor device with reduced flicker noise

Method for forming ultra-shallow junction

Stacked nanosheet gate-all-around device structures

Method for modifying a strain state of at least one semiconductor l...

Patents Applicationslast 30 patents

INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES

SEMICONDUCTOR STRUCTURE INCLUDING ISOLATION PROTECTION FEATURES AND...

INCREASED ETCH RESISTANCE OF NITRIDE LAYERS USING CHEMICAL VAPOR DE...

FLASH MEMORY AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

FERROELECTRIC MEMORY DEVICE

METHOD OF MANUFACTURING CAPACITOR ARRAY

HIGH-TEMPERATURE IMPLANT FOR GATE-ALL-AROUND DEVICES

UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION THEREOF

Gate Structures For Semiconductor Devices

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPOSITE INTERCONNECT STRUCTUR...

SELECTIVITY OF BORON HARD MASKS USING ION IMPLANT

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MULTI-PARAMETER IMPLANTATION FOR MANAGING WAFER DISTORTION

LOCALIZED STRESS MODULATION BY IMPLANT TO BACK OF WAFER

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

NBTI REDUCTION AND RELIABILITY IMPROVEMENT FOR SELECTIVE LAYOUTS

Warpage Modulation Through Implantation and the Structures Thereof

METHOD FOR DOPING CARBON IN THIN FILM ON WAFER

APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...

METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET

METHOD FOR PRODUCING A POWER FINFET, AND POWER FINFET

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

NEUTRAL STRESS DIAMOND-LIKE CARBON

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE