Doping the layers

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H01L21/3215

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3215Doping the layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage MOSFET device with improved breakdown voltage
- Patent number 12,170,329
- Issue date Dec 17, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 12,166,040
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a manufacturing method thereof
- Patent number 12,166,133
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including gate structure including barrier...
- Patent number 12,113,111
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,058,858
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit using a patterned mask layer
- Patent number 12,027,370
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source or drain structures with high germanium concentration cappin...
- Patent number 12,027,417
- Issue date Jul 2, 2024
- Intel Corporation
- Cory Bomberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,020,947
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-An Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon implantation for thicker gate silicide
- Patent number 12,020,937
- Issue date Jun 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Jianwei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,009,305
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method used in forming a memory array comprising strings of memory...
- Patent number 11,974,429
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation to reduce nanosheet gate length variation
- Patent number 11,955,533
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,994
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Byounghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure with gate over well boundary and related metho...
- Patent number 11,942,325
- Issue date Mar 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ketankumar Harishbhai Tailor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a doped gate elec...
- Patent number 11,942,326
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Petr Kostelnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including buried gate structure and method for...
- Patent number 11,943,912
- Issue date Mar 26, 2024
- SK Hynix Inc.
- Dong-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device including a doped gate electrode
- Patent number 11,908,916
- Issue date Feb 20, 2024
- SK HYNIX SYSTEM IC INC.
- Soon Yeol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced ESR in trench capacitor
- Patent number 11,888,021
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Jing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for interconnect structure
- Patent number 11,854,870
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,153
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-integrated channel and gate formation scheme for nanosheet trans...
- Patent number 11,830,877
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formation method and mask
- Patent number 11,810,787
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor devices
- Patent number 11,800,701
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Ho Kyun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,784,051
- Issue date Oct 10, 2023
- SK Hynix Inc.
- Young-Gwang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,751,393
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Manzar Siddik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching to increase threshold voltage spread
- Patent number 11,742,395
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut metal gate process for reducing transistor spacing
- Patent number 11,721,544
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD
- Publication number 20240379776
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LOW CONCENTRATION OPPOSITE TYPE DOPING DR...
- Publication number 20240363720
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240321751
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240312792
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT MOSFET AND SEMICONDUCTOR DEVICE
- Publication number 20240290784
- Publication date Aug 29, 2024
- Rohm Co., Ltd.
- Takeshi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240250144
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Byounghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Array And Method Used In Forming A Memory Array Comprising S...
- Publication number 20240244840
- Publication date Jul 18, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED ESR IN TRENCH CAPACITOR
- Publication number 20240120368
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105465
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Takahiro MIYAKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA-DOPED TRENCHES FOR MEMORY
- Publication number 20240105510
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING WORK FUNCTION LAYER AND METHOD FOR F...
- Publication number 20240079229
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA CHAN FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD
- Publication number 20240021484
- Publication date Jan 18, 2024
- Changxin Memory Technologies, Inc.
- Mengmeng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20240006175
- Publication date Jan 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kang YOU
- G11 - INFORMATION STORAGE
Information Patent Application
CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING
- Publication number 20230377873
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Etching to Increase Threshold Voltage Spread
- Publication number 20230335601
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20230335438
- Publication date Oct 19, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON IMPLANTATION FOR THICKER GATE SILICIDE
- Publication number 20230307238
- Publication date Sep 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Jianwei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230282583
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS FOR THE SAME
- Publication number 20230238435
- Publication date Jul 27, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- YAJIE CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE WITH GATE OVER WELL BOUNDARY AND RELATED METHO...
- Publication number 20230215731
- Publication date Jul 6, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ketankumar Harishbhai Tailor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING WORK FUNCTION MODULATING LAYERS
- Publication number 20230178375
- Publication date Jun 8, 2023
- Applied Materials, Inc.
- Kunal Bhatnagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GATE OF NAND FLASH
- Publication number 20230170392
- Publication date Jun 1, 2023
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Pengkai Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CONTACT STRUCTURE AND CONTACT STRUCTURE
- Publication number 20230138089
- Publication date May 4, 2023
- Changxin Memory Technologies, Inc.
- Xin XIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING LAYERS
- Publication number 20230122969
- Publication date Apr 20, 2023
- Applied Materials, Inc.
- Shirish PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR INTERCONNECT STRUCTURE
- Publication number 20230067300
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP
- Publication number 20220415818
- Publication date Dec 29, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399456
- Publication date Dec 15, 2022
- SK HYNIX INC.
- Dong Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS

Doping the layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bottom lateral expansion of contact plugs through implantation

High voltage MOSFET device with improved breakdown voltage

Integrated circuit and manufacturing method thereof

Semiconductor structure and a manufacturing method thereof

Integrated assemblies having one or more modifying substances distr...

Semiconductor structure including gate structure including barrier...

Three-dimensional memory devices and methods for forming the same

Method of forming an integrated circuit using a patterned mask layer

Integrated assemblies and methods of forming integrated assemblies

Source or drain structures with high germanium concentration cappin...

Method of manufacturing semiconductor devices and semiconductor dev...

Carbon implantation for thicker gate silicide

Semiconductor device and method for forming the same

Method used in forming a memory array comprising strings of memory...

Ion implantation to reduce nanosheet gate length variation

Semiconductor device and method of fabricating the same

Transistor structure with gate over well boundary and related metho...

Process of forming an electronic device including a doped gate elec...

Semiconductor device including buried gate structure and method for...

High voltage semiconductor device including a doped gate electrode

Reduced ESR in trench capacitor

Etch method for interconnect structure

Semiconductor device and method

Co-integrated channel and gate formation scheme for nanosheet trans...

Semiconductor structure formation method and mask

Method for fabricating semiconductor devices

Semiconductor device and method for fabricating the same

Memory arrays and methods used in forming a memory array comprising...

Selective etching to increase threshold voltage spread

Cut metal gate process for reducing transistor spacing

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD

SELECTIVE ETCHING TO INCREASE THRESHOLD VOLTAGE SPREAD

SEMICONDUCTOR DEVICE WITH LOW CONCENTRATION OPPOSITE TYPE DOPING DR...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

ENHANCEMENT MOSFET AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Memory Array And Method Used In Forming A Memory Array Comprising S...

REDUCED ESR IN TRENCH CAPACITOR

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

PLASMA-DOPED TRENCHES FOR MEMORY

SEMICONDUCTOR DEVICE INCLUDING WORK FUNCTION LAYER AND METHOD FOR F...

SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

CUT METAL GATE PROCESS FOR REDUCING TRANSISTOR SPACING

Selective Etching to Increase Threshold Voltage Spread

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

CARBON IMPLANTATION FOR THICKER GATE SILICIDE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS FOR THE SAME

TRANSISTOR STRUCTURE WITH GATE OVER WELL BOUNDARY AND RELATED METHO...

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS FOR FORMING WORK FUNCTION MODULATING LAYERS

METHOD FOR MANUFACTURING GATE OF NAND FLASH

METHOD FOR FABRICATING CONTACT STRUCTURE AND CONTACT STRUCTURE

METHOD OF DEPOSITING LAYERS

ETCH METHOD FOR INTERCONNECT STRUCTURE

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME