Dual damascene with different via-level and trench-level dielectrics

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H01L2221/1036

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/1036Dual damascene with different via-level and trench-level dielectrics

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with damascene structur...
- Patent number 12,142,518
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with fine patte...
- Patent number 11,776,813
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,658,112
- Issue date May 23, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,574,840
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Takaaki Suzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned via
- Patent number 11,437,274
- Issue date Sep 6, 2022
- Micromaterials LLC
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 11,348,872
- Issue date May 31, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with fine patterns at different leve...
- Patent number 11,315,786
- Issue date Apr 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,171,042
- Issue date Nov 9, 2021
- Fuji Electric Co., Ltd.
- Takaaki Suzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,171,041
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 10,978,393
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-formed liner for interconnect structures
- Patent number 10,930,520
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced BEOL interconnect architecture
- Patent number 10,672,649
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,593,594
- Issue date Mar 17, 2020
- Micromaterials LLC
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having a graphene barrier layer
- Patent number 10,535,559
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating metal-insulator-metal capacitors with air gap process flow
- Patent number 10,373,905
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect formation process using wire trench etch prior to via...
- Patent number 10,347,528
- Issue date Jul 9, 2019
- GLOBALFOUNDRIES Inc.
- Sunil K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having a graphene barrier layer
- Patent number 10,319,632
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 10,312,136
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-formed liner for interconnect structures
- Patent number 10,304,695
- Issue date May 28, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact scheme for landing on different contact area levels
- Patent number 10,157,774
- Issue date Dec 18, 2018
- GLOBALFOUNDRIES Inc.
- Carsten K. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,068,796
- Issue date Sep 4, 2018
- TOSHIBA MEMORY CORPORATION
- Toshiyuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating metal-insulator-metal capacitors with air gap process flow
- Patent number 10,032,711
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and interconnecting integrated circuit devices
- Patent number 9,960,080
- Issue date May 1, 2018
- Imec VZW
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 9,786,549
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum interconnection apparatus
- Patent number 9,607,891
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, and photoelectric conver...
- Patent number 9,559,136
- Issue date Jan 31, 2017
- Canon Kabushiki Kaisha
- Aiko Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum interconnection apparatus
- Patent number 9,455,184
- Issue date Sep 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical breakdown protection layer
- Patent number 9,362,239
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379437
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING
- Publication number 20240290651
- Publication date Aug 29, 2024
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240087895
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240071924
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230386842
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE
- Publication number 20230307288
- Publication date Sep 28, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...
- Publication number 20230307289
- Publication date Sep 28, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES
- Publication number 20230163024
- Publication date May 25, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230062825
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20220059404
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Via
- Publication number 20210090952
- Publication date Mar 25, 2021
- Micromaterials LLC.
- Regina Freed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIELECTRIC SCHEME FOR VARYING LINER THICKNESS AND MANGANESE...
- Publication number 20200091079
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20190279896
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure Having a Graphene Barrier Layer
- Publication number 20190259658
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMED LINER FOR INTERCONNECT STRUCTURES
- Publication number 20190237340
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH AIR GAP PROCESS FLOW
- Publication number 20180233446
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A GRAPHENE BARRIER LAYER
- Publication number 20180166333
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180090369
- Publication date Mar 29, 2018
- Toshiba Memory Corporation
- Toshiyuki SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20180033684
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH AIR GAP PROCESS FLOW
- Publication number 20180025974
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DEVICE LEVEL CONTACT STRUCTURES
- Publication number 20170207122
- Publication date Jul 20, 2017
- GLOBALFOUNDRIES INC.
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES
- Publication number 20170005000
- Publication date Jan 5, 2017
- IMEC vzw
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20150235894
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECT WITH AIR GAP
- Publication number 20150162277
- Publication date Jun 11, 2015
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Interconnection Apparatus
- Publication number 20140295663
- Publication date Oct 2, 2014
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20140264880
- Publication date Sep 18, 2014
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE
- Publication number 20140151899
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Douglas D. COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140131873
- Publication date May 15, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takahiro Kouno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT
- Publication number 20140117561
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Interconnection Apparatus
- Publication number 20140061913
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Dual damascene with different via-level and trench-level dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Method for fabricating semiconductor device with damascene structur...

Etch damage and ESL free dual damascene metal interconnect

Method for preparing semiconductor device structure with fine patte...

Semiconductor structure and fabrication method thereof

Semiconductor device and method of manufacturing semiconductor device

Fully self-aligned via

Hybrid dielectric scheme for varying liner thickness and manganese...

Semiconductor device structure with fine patterns at different leve...

Semiconductor device and method of manufacturing semiconductor device

Etch damage and ESL free dual damascene metal interconnect

Hybrid dielectric scheme for varying liner thickness and manganese...

Self-formed liner for interconnect structures

Advanced BEOL interconnect architecture

Selectively etched self-aligned via processes

Semiconductor interconnect structure having a graphene barrier layer

Integrating metal-insulator-metal capacitors with air gap process flow

Interconnect formation process using wire trench etch prior to via...

Semiconductor interconnect structure having a graphene barrier layer

Etch damage and ESL free dual damascene metal interconnect

Self-formed liner for interconnect structures

Contact scheme for landing on different contact area levels

Semiconductor device manufacturing method

Integrating metal-insulator-metal capacitors with air gap process flow

Method for bonding and interconnecting integrated circuit devices

Etch damage and ESL free dual damascene metal interconnect

Aluminum interconnection apparatus

Semiconductor device manufacturing method, and photoelectric conver...

Aluminum interconnection apparatus

Vertical breakdown protection layer

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE

SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...

REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

Fully Self-Aligned Via

HYBRID DIELECTRIC SCHEME FOR VARYING LINER THICKNESS AND MANGANESE...

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

Semiconductor Interconnect Structure Having a Graphene Barrier Layer

SELF-FORMED LINER FOR INTERCONNECT STRUCTURES

INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH AIR GAP PROCESS FLOW

SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A GRAPHENE BARRIER LAYER

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH AIR GAP PROCESS FLOW

SELF-ALIGNED DEVICE LEVEL CONTACT STRUCTURES

METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES

Interconnect Structure and Method of Forming the Same

ADVANCED INTERCONNECT WITH AIR GAP

Aluminum Interconnection Apparatus

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

DUAL-DAMASCENE PROCESS TO FABRICATE THICK WIRE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ETCH DAMAGE AND ESL FREE DUAL DAMASCENE METAL INTERCONNECT

Aluminum Interconnection Apparatus