Dummy metallization

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CPC
Y10S438/926

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

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Y10S438/926Dummy metallization

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating transistor with thinned channel
- Patent number 11,978,799
- Issue date May 7, 2024
- Tahoe Research, LTD.
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating transistor with thinned channel
- Patent number 10,937,907
- Issue date Mar 2, 2021
- Intel Corporation
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,930,635
- Issue date Feb 23, 2021
- Seiko Epson Corporation
- Katsumi Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 10,679,979
- Issue date Jun 9, 2020
- Seiko Epson Corporation
- Katsumi Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating transistor with thinned channel
- Patent number 10,367,093
- Issue date Jul 30, 2019
- Justin K. Brask
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,263,005
- Issue date Apr 16, 2019
- Renesas Electronics Corporation
- Keisuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures employing strained material layers with de...
- Patent number 10,164,015
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, method for manufacturing the same, method for...
- Patent number 9,978,737
- Issue date May 22, 2018
- Seiko Epson Corporation
- Katsumi Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structures employing strained material layers with de...
- Patent number 9,923,057
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating transistor with thinned channel
- Patent number 9,806,195
- Issue date Oct 31, 2017
- Intel Corporation
- Justin K. Brask
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 9,799,667
- Issue date Oct 24, 2017
- Renesas Electronics Corporation
- Keisuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, method for...
- Patent number 9,455,223
- Issue date Sep 27, 2016
- Seiko Epson Corporation
- Katsumi Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structures employing strained material layers with de...
- Patent number 9,281,376
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, method for manufacturing the same, method for...
- Patent number 8,984,466
- Issue date Mar 17, 2015
- Seiko Epson Corporation
- Katsumi Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
PMOS transistors and fabrication method
- Patent number 8,980,718
- Issue date Mar 17, 2015
- Semiconductor Manufacturing International Corp
- Yong Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,951,869
- Issue date Feb 10, 2015
- Renesas Electronics Corporation
- Keisuke Tsukamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having ring-shaped gate electrode, design appa...
- Patent number 8,901,673
- Issue date Dec 2, 2014
- PS4 Luxco S.A.R.L.
- Takamitsu Onda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods of manufacturing metal-silicide features
- Patent number 8,791,528
- Issue date Jul 29, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Tung Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor structures employing strained material layers with de...
- Patent number 8,722,495
- Issue date May 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 8,704,287
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Hideaki Maekawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, method for manufacturing the same, method for...
- Patent number 8,637,950
- Issue date Jan 28, 2014
- Seiko Epson Corporation
- Katsumi Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having ring-shaped gate electrode, design appa...
- Patent number 8,552,510
- Issue date Oct 8, 2013
- Elpida Memory, Inc.
- Takamitsu Onda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 8,525,249
- Issue date Sep 3, 2013
- Kabushiki Kaisha Toshiba
- Hideaki Maekawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,507,991
- Issue date Aug 13, 2013
- Institute of Microelectronics, Chinese Academy of Sciences
- Wenwu Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having dummy pattern and the method for fabric...
- Patent number 8,486,822
- Issue date Jul 16, 2013
- SK hynix Inc.
- Byung Ho Nam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carrier mobility enhanced channel devices and method of manufacture
- Patent number 8,461,625
- Issue date Jun 11, 2013
- International Business Machines Corporation
- Kangguo Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, method for manufacturing the same, method for...
- Patent number 8,418,114
- Issue date Apr 9, 2013
- Seiko Epson Corporation
- Katsumi Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chemical mechanical polishing (CMP) method for gate last process
- Patent number 8,390,072
- Issue date Mar 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Chuang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal gate transistors with raised source and drain regions formed...
- Patent number 8,344,452
- Issue date Jan 1, 2013
- Intel Corporation
- Nick Lindert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor structures employing strained material layers with de...
- Patent number 8,344,355
- Issue date Jan 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL
- Publication number 20210135007
- Publication date May 6, 2021
- Intel Corporation
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200258877
- Publication date Aug 13, 2020
- SEIKO EPSON CORPORATION
- Katsumi MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL
- Publication number 20190371940
- Publication date Dec 5, 2019
- Intel Corporation
- Justin K. Brask
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190035776
- Publication date Jan 31, 2019
- SEIKO EPSON CORPORATION
- Katsumi MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Structures Employing Strained Material Layers with De...
- Publication number 20180197954
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL
- Publication number 20180047846
- Publication date Feb 15, 2018
- Intel Corporation
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180006048
- Publication date Jan 4, 2018
- Renesas Electronics Corporation
- Keisuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140227843
- Publication date Aug 14, 2014
- RENESAS ELECTRONICS CORPORATION
- Keisuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures Employing Strained Material Layers with De...
- Publication number 20140220755
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...
- Publication number 20140110853
- Publication date Apr 24, 2014
- SEIKO EPSON CORPORATION
- Katsumi MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PMOS TRANSISTORS AND FABRICATION METHOD
- Publication number 20140048891
- Publication date Feb 20, 2014
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING RING-SHAPED GATE ELECTRODE, DESIGN APPA...
- Publication number 20140015022
- Publication date Jan 16, 2014
- Elpida Memory, Inc.
- Takamitsu ONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...
- Publication number 20130187282
- Publication date Jul 25, 2013
- SEIKO EPSON CORPORATION
- Katsumi MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20130147006
- Publication date Jun 13, 2013
- KABUSHIKI KAISHA TOSHIBA
- Hideaki MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures Employing Strained Material Layers with De...
- Publication number 20130040433
- Publication date Feb 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120261761
- Publication date Oct 18, 2012
- Institute of Microelectronics, Chinese Academy of Sciences
- Wenwu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...
- Publication number 20120246603
- Publication date Sep 27, 2012
- SEIKO EPSON CORPORATION
- Katsumi MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Structures Employing Strained Material Layers with De...
- Publication number 20120086047
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120061742
- Publication date Mar 15, 2012
- Hideaki MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110254093
- Publication date Oct 20, 2011
- Institute of Microelectronics, Chinese Academy of Sciences
- Wenwu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...
- Publication number 20110239170
- Publication date Sep 29, 2011
- SEIKO EPSON CORPORATION
- Katsumi MORI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) METHOD FOR GATE LAST PROCESS
- Publication number 20110233683
- Publication date Sep 29, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Dummy Pattern and the Method for Fabric...
- Publication number 20110212619
- Publication date Sep 1, 2011
- Hynix Semiconductor Inc.
- Byung Ho Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING RING-SHAPED GATE ELECTRODE, DESIGN APPA...
- Publication number 20110199126
- Publication date Aug 18, 2011
- ELPIDA MEMORY, INC.
- Takamitsu ONDA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CARRIER MOBILITY ENHANCED CHANNEL DEVICES AND METHOD OF MANUFACTURE
- Publication number 20110180853
- Publication date Jul 28, 2011
- International Business Machines Corporation
- KANGGUO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20110183511
- Publication date Jul 28, 2011
- Hideaki MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF CHANNEL WRAPAROUND GATE STRUCTURE FOR FIELD-EFFECT T...
- Publication number 20110156145
- Publication date Jun 30, 2011
- Marko Radosavljevic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures Employing Strained Material Layers with De...
- Publication number 20110095363
- Publication date Apr 28, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Matthew Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL
- Publication number 20110062520
- Publication date Mar 17, 2011
- Justin K. Brask
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20100327463
- Publication date Dec 30, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Dummy metallization

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating transistor with thinned channel

Method for fabricating transistor with thinned channel

Semiconductor device

Semiconductor device

Method for fabricating transistor with thinned channel

Method of manufacturing a semiconductor device

Semiconductor structures employing strained material layers with de...

Semiconductor device, method for manufacturing the same, method for...

Semiconductor structures employing strained material layers with de...

Method for fabricating transistor with thinned channel

Method of manufacturing a semiconductor device

Semiconductor device, method for manufacturing the same, method for...

Semiconductor structures employing strained material layers with de...

Semiconductor device, method for manufacturing the same, method for...

PMOS transistors and fabrication method

Method of manufacturing a semiconductor device

Semiconductor device having ring-shaped gate electrode, design appa...

Methods of manufacturing metal-silicide features

Semiconductor structures employing strained material layers with de...

Semiconductor memory device and method of fabricating the same

Semiconductor device, method for manufacturing the same, method for...

Semiconductor device having ring-shaped gate electrode, design appa...

Semiconductor memory device and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device having dummy pattern and the method for fabric...

Carrier mobility enhanced channel devices and method of manufacture

Semiconductor device, method for manufacturing the same, method for...

Chemical mechanical polishing (CMP) method for gate last process

Metal gate transistors with raised source and drain regions formed...

Semiconductor structures employing strained material layers with de...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL

SEMICONDUCTOR DEVICE

Semiconductor Structures Employing Strained Material Layers with De...

METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor Structures Employing Strained Material Layers with De...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...

PMOS TRANSISTORS AND FABRICATION METHOD

SEMICONDUCTOR DEVICE HAVING RING-SHAPED GATE ELECTRODE, DESIGN APPA...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor Structures Employing Strained Material Layers with De...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...

Semiconductor Structures Employing Strained Material Layers with De...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR...

CHEMICAL MECHANICAL POLISHING (CMP) METHOD FOR GATE LAST PROCESS

Semiconductor Device Having Dummy Pattern and the Method for Fabric...

SEMICONDUCTOR DEVICE HAVING RING-SHAPED GATE ELECTRODE, DESIGN APPA...

CARRIER MOBILITY ENHANCED CHANNEL DEVICES AND METHOD OF MANUFACTURE

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

FABRICATION OF CHANNEL WRAPAROUND GATE STRUCTURE FOR FIELD-EFFECT T...

Semiconductor Structures Employing Strained Material Layers with De...

METHOD FOR FABRICATING TRANSISTOR WITH THINNED CHANNEL

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES