during, before or after processing of conductive layers

Industry

CPC
H01L21/02068

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02068during, before or after processing of conductive layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming conductive feature including cleaning step
- Patent number 11,955,329
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hafnium oxide corrosion inhibitor
- Patent number 11,946,148
- Issue date Apr 2, 2024
- VERSUM MATERIALS US, LLC
- Wen Dar Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-region diffusion barrier containing titanium, silicon and nit...
- Patent number 11,942,365
- Issue date Mar 26, 2024
- Eugenus, Inc.
- Vinayak Veer Vats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning machine and cleaning method
- Patent number 11,935,737
- Issue date Mar 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ning Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,935,738
- Issue date Mar 19, 2024
- Disco Corporation
- Takashi Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and a s...
- Patent number 11,929,250
- Issue date Mar 12, 2024
- Kioxia Corporation
- Katsuhiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching platinum-containing thin film using protective cap layer
- Patent number 11,929,423
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Sebastian Meier
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 11,915,976
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,908,680
- Issue date Feb 20, 2024
- Tokyo Electron Limited
- Akira Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of metal gate formation and structures formed by the same
- Patent number 11,908,749
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Jing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning liquid composition
- Patent number 11,905,490
- Issue date Feb 20, 2024
- Kanto Kagaku Kabushiki Kaisha
- Areji Takanaka
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Substrate treatment method and substrate treatment equipment
- Patent number 11,901,174
- Issue date Feb 13, 2024
- Organo Corporation
- Daisaku Yano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatment liquid, method for washing substrate, and method for remo...
- Patent number 11,899,369
- Issue date Feb 13, 2024
- FUJIFILM Corporation
- Tomonori Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,872,605
- Issue date Jan 16, 2024
- SCREEN Holdings Co., Ltd.
- Katsuya Akiyama
- B08 - CLEANING
Information Patent Grant
Methods of forming molybdenum contacts
- Patent number 11,869,806
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and manufacturing method of s...
- Patent number 11,862,484
- Issue date Jan 2, 2024
- Kioxia Corporation
- Tatsuhiko Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor method and device
- Patent number 11,854,901
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsiung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 11,855,085
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a substrate
- Patent number 11,854,829
- Issue date Dec 26, 2023
- LSR Engineering & Consulting Limited
- Marcus Elmar Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,848,217
- Issue date Dec 19, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming film
- Patent number 11,830,741
- Issue date Nov 28, 2023
- Tokyo Electron Limited
- Shinichi Ike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 11,830,732
- Issue date Nov 28, 2023
- ASM IP Holding B.V.
- Jan Willem Hub Maes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air-spacer
- Patent number 11,830,922
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning components and methods in a plating system
- Patent number 11,814,744
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Nolan Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an electrical contact on a silicon carbide su...
- Patent number 11,798,807
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid recovery in semiconductor processing
- Patent number 11,788,200
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Sam Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...
- Publication number 20240134284
- Publication date Apr 25, 2024
- FUJIFILM CORPORATION
- Tomonori TAKAHASHI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SEMICONDUCTOR DEVICE PRE-CLEANING
- Publication number 20240136226
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVA...
- Publication number 20240120195
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Keith T. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113113
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment Compositions and Methods
- Publication number 20240101929
- Publication date Mar 28, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Jieying Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
- Publication number 20240087879
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088041
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TSENG-CHIEH PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR CONTAINING TRANSITION METAL, ME...
- Publication number 20240055272
- Publication date Feb 15, 2024
- Tokuyama Corporation
- Yuki KIKKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20240047197
- Publication date Feb 8, 2024
- ASM IP HOLDING B.V.
- Jan Willem Hub Maes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION IN FEATURES
- Publication number 20240047269
- Publication date Feb 8, 2024
- LAM RESEARCH CORPORATION
- Jeong-Seok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE ETCHING OF DIELECTRIC MATERIALS
- Publication number 20240035196
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Yi-Chiau HUANG
- B08 - CLEANING
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240002725
- Publication date Jan 4, 2024
- FUJIFILM CORPORATION
- Moe NARITA
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230420294
- Publication date Dec 28, 2023
- Tokyo Electron Limited
- Makoto WADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WET CLEANING TOOL AND METHOD
- Publication number 20230415204
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu. Tung. Yen
- B08 - CLEANING
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230422566
- Publication date Dec 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with a Silicon Carbide Substrate
- Publication number 20230420257
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Stefan Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE PRECLEANING PRIOR TO METAL FILLING
- Publication number 20230411142
- Publication date Dec 21, 2023
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20230402275
- Publication date Dec 14, 2023
- FUJIFILM CORPORATION
- Atsushi MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230386892
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Peimeng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES
- Publication number 20230386913
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Air-Spacer
- Publication number 20230387247
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20230377880
- Publication date Nov 23, 2023
- SPHERA TECHNOLOGY GMBH
- Janine-Melanie POTRECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND SUBSTRATE WASHING METHOD
- Publication number 20230365902
- Publication date Nov 16, 2023
- FUJIFILM CORPORATION
- Atsushi MIZUTANI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method for Forming Source/Drain Contacts
- Publication number 20230369451
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING AND DEPOSITION OF MEMORY LAYERS TO PROVIDE CAPACI...
- Publication number 20230320062
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Ratndeep SRIVASTAVA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20230298881
- Publication date Sep 21, 2023
- Disco Corporation
- Takashi OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFEC...
- Publication number 20230295466
- Publication date Sep 21, 2023
- Resonac Corporation
- Hisato TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING SUBSTRATE
- Publication number 20230278077
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HAO-MING CHANG
- B08 - CLEANING
Information Patent Application
SELECTIVE THERMAL ETCHING METHODS OF METAL OR METAL-CONTAINING MATE...
- Publication number 20230274947
- Publication date Aug 31, 2023
- American Air Liquide, Inc.
- Rocio Alejandra ARTEAGA MULLER
- H01 - BASIC ELECTRIC ELEMENTS

during, before or after processing of conductive layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Selective cobalt deposition on copper surfaces

Method of forming conductive feature including cleaning step

Hafnium oxide corrosion inhibitor

Multi-region diffusion barrier containing titanium, silicon and nit...

Cleaning machine and cleaning method

Method of processing a wafer

Substrate processing apparatus, substrate processing method and a s...

Etching platinum-containing thin film using protective cap layer

Semiconductor device pre-cleaning

Substrate processing method and substrate processing apparatus

Method of metal gate formation and structures formed by the same

Cleaning liquid composition

Substrate treatment method and substrate treatment equipment

Treatment liquid, method for washing substrate, and method for remo...

Substrate processing method and substrate processing apparatus

Methods of forming molybdenum contacts

Semiconductor manufacturing apparatus and manufacturing method of s...

Integrate rinse module in hybrid bonding platform

Semiconductor method and device

Semiconductor structure cutting process and structures formed thereby

Method for structuring a substrate

Methods and apparatus for cleaning substrates

Method for forming film

Selective passivation and selective deposition

Semiconductor device with air-spacer

Substrate cleaning components and methods in a plating system

Method of forming copper interconnect structure with manganese barr...

Process for producing an electrical contact on a silicon carbide su...

Fluid recovery in semiconductor processing

Patents Applicationslast 30 patents

TREATMENT LIQUID, METHOD FOR WASHING SUBSTRATE, AND METHOD FOR REMO...

SEMICONDUCTOR DEVICE PRE-CLEANING

DIELECTRIC ON DIELECTRIC SELECTIVE DEPOSITION USING ANILINE PASSIVA...

Semiconductor Structure Cutting Process and Structures Formed Thereby

Surface Treatment Compositions and Methods

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR PROCESSING SEMICONDUCTOR CONTAINING TRANSITION METAL, ME...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

MOLYBDENUM DEPOSITION IN FEATURES

METHOD OF SELECTIVE ETCHING OF DIELECTRIC MATERIALS

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

COMPOSITION AND METHOD FOR TREATING SUBSTRATE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

WET CLEANING TOOL AND METHOD

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Chip with a Silicon Carbide Substrate

METAL OXIDE PRECLEANING PRIOR TO METAL FILLING

WASHING SOLUTION AND WASHING METHOD FOR SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES

Semiconductor Device with Air-Spacer

ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF

COMPOSITION AND SUBSTRATE WASHING METHOD

Method for Forming Source/Drain Contacts

SELECTIVE ETCHING AND DEPOSITION OF MEMORY LAYERS TO PROVIDE CAPACI...

METHOD OF PROCESSING A WAFER

POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, AND DEFEC...

METHOD FOR CLEANING SUBSTRATE

SELECTIVE THERMAL ETCHING METHODS OF METAL OR METAL-CONTAINING MATE...