Dynamic random-access memory [DRAM]

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CPC
H01L2924/1436

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1436Dynamic random-access memory [DRAM]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics processing unit and high bandwidth memory integration usin...
- Patent number 12,170,275
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,170,258
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-bonded memory stacks with copper-bonded interconnection memo...
- Patent number 12,166,027
- Issue date Dec 10, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
DRAM memory device with Xtacking architecture
- Patent number 12,159,849
- Issue date Dec 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Lei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Homogeneous chiplets configurable as a two-dimensional system or a...
- Patent number 12,148,707
- Issue date Nov 19, 2024
- Microsoft Technology Licensing, LLC
- Haohua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and memory cells...
- Patent number 12,144,190
- Issue date Nov 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with TSV inductor
- Patent number 12,142,633
- Issue date Nov 12, 2024
- Mediatek Inc.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,596
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission circuit, interface circuit, and memory
- Patent number 12,132,018
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Feng Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,127,393
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Non-volatile dynamic random access memory
- Patent number 12,113,054
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,080,665
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial through via with novel high isolation cross coupling method...
- Patent number 12,074,125
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421129
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421140
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421011
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- WanSun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240413068
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240413104
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE TECHNIQUES FOR STACKED MEMORY ARCHITECTURES
- Publication number 20240404581
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Ameen D. Akel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240395753
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Bong geun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DIE-BASED TECHNIQUES FOR DRAM ROW SEGMENTATION AND FINE-GRAIN...
- Publication number 20240395289
- Publication date Nov 28, 2024
- ADVANCED MICRO DEVICES, INC.
- Vignesh ADHINARAYANAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240387462
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...
- Publication number 20240389307
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING DEVICE AND COMPUTING SYSTEM INCLUDING THE SAME
- Publication number 20240389364
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Sangkil Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY C...
- Publication number 20240389366
- Publication date Nov 21, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20240387428
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20240380401
- Publication date Nov 14, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20240371824
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Yichen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK AND FABRICATION METHOD
- Publication number 20240363489
- Publication date Oct 31, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
- Publication number 20240363560
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE
- Publication number 20240355792
- Publication date Oct 24, 2024
- Intel Corporation
- Poh Boon Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347510
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347524
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS

Dynamic random-access memory [DRAM]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out wafer level package structure

Graphics processing unit and high bandwidth memory integration usin...

Memory devices having vertical transistors and methods for forming...

Integrated circuit assemblies with direct chip attach to circuit bo...

Copper-bonded memory stacks with copper-bonded interconnection memo...

Signal routing between memory die and logic die

DRAM memory device with Xtacking architecture

Homogeneous chiplets configurable as a two-dimensional system or a...

Semiconductor packages and methods of forming same

3D semiconductor device and structure with bonding and memory cells...

Semiconductor package with TSV inductor

Semiconductor package

Semiconductor structure and manufacturing method thereof

Integrated fan-out package and the methods of manufacturing

Transmission circuit, interface circuit, and memory

Memory devices having vertical transistors and methods for forming...

Semiconductor package including test bumps

Semiconductor device assemblies with molded support substrates

Semiconductor device packages, packaging methods, and packaged semi...

Memory device for wafer-on-wafer formed memory and logic

Non-volatile dynamic random access memory

Signal routing between memory die and logic die for mode based oper...

Method of forming semiconductor packages having through package vias

Offset interposers for large-bottom packages and large-die package-...

Semiconductor package and method of manufacturing the same

Method for forming package structure

Package structure and manufacturing method thereof

Memory devices having vertical transistors and methods for forming...

Coaxial through via with novel high isolation cross coupling method...

Multi-die fine grain integrated voltage regulation

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTERFACE TECHNIQUES FOR STACKED MEMORY ARCHITECTURES

SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

LOGIC DIE-BASED TECHNIQUES FOR DRAM ROW SEGMENTATION AND FINE-GRAIN...

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...

COMPUTING DEVICE AND COMPUTING SYSTEM INCLUDING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS, MEMORY C...

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP STACK AND FABRICATION METHOD

COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...

PACKAGE STRUCTURE

REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE