Edge terminals

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CPC
H05K2201/1034

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/1034Edge terminals

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component, substrate and an optical s...
- Patent number 12,114,434
- Issue date Oct 8, 2024
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor unit for vehicles
- Patent number 12,070,988
- Issue date Aug 27, 2024
- Valeo Schalter und Sensoren GmbH
- Bohuslav Coufal
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Wiring board, electronic component package, and electronic apparatus
- Patent number 11,889,618
- Issue date Jan 30, 2024
- Kyocera Corporation
- Toshihiko Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector attached multi-conductor cable
- Patent number 11,784,438
- Issue date Oct 10, 2023
- Sumitomo Electric Industries, Ltd.
- Naoshige Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expansion card with mezzanine level connector
- Patent number 11,778,743
- Issue date Oct 3, 2023
- Xilinx, Inc.
- Ieuan James Mackereth Marshall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage monitoring module
- Patent number 11,754,632
- Issue date Sep 12, 2023
- Nippon Mektron, Ltd.
- Hajime Gyotoku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,483,928
- Issue date Oct 25, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Yoshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated multilayer structure and a method for manufacturing a mu...
- Patent number 11,309,676
- Issue date Apr 19, 2022
- TACTOTEK OY
- Ilpo Hänninen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductivity for integrated circuit packaging
- Patent number 11,147,153
- Issue date Oct 12, 2021
- Intel Corporation
- Brian J. Long
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 11,129,277
- Issue date Sep 21, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Electronic display with mount-accessible components
- Patent number 11,042,183
- Issue date Jun 22, 2021
- Manufacturing Resources International, Inc.
- William Dunn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microchips for downhole data collection
- Patent number 10,999,946
- Issue date May 4, 2021
- Saudi Arabian Oil Company
- Bodong Li
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting a contact surface on a flexible circuit with...
- Patent number 10,886,644
- Issue date Jan 5, 2021
- VITESCO TECHNOLOGIES GERMANY GMBH
- Nikolaus Taschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Golden finger design methodology for high speed differential signal...
- Patent number 10,784,607
- Issue date Sep 22, 2020
- Quanta Computer Inc.
- Cheng-Hsien Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductivity for integrated circuit packaging
- Patent number 10,729,000
- Issue date Jul 28, 2020
- Intel Corporation
- Brian J. Long
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive driver board for light bulb
- Patent number 10,655,795
- Issue date May 19, 2020
- Technical Consumer Products, Inc.
- George J. Uhler
- F21 - LIGHTING
Information Patent Grant
Printed circuit board, a terminal and a method of assembling a prin...
- Patent number 10,617,007
- Issue date Apr 7, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Igor Perez-Uria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of printed circuit board and card edge connector for memor...
- Patent number 10,522,926
- Issue date Dec 31, 2019
- Sung-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor connection structure of laminated wiring body
- Patent number 10,511,111
- Issue date Dec 17, 2019
- Yazaki Corporation
- Masahiro Ito
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Grounding structure for circuit board
- Patent number 10,512,154
- Issue date Dec 17, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Manabu Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor connection structure of laminated wiring body
- Patent number 10,454,192
- Issue date Oct 22, 2019
- Yazaki Corporation
- Masahiro Ito
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System and method of identifying a module in a stack light
- Patent number 10,422,821
- Issue date Sep 24, 2019
- Rockwell Automation Technologies, Inc.
- Will J. Preischel
- G01 - MEASURING TESTING
Information Patent Grant
Adjustable impedance high speed data connector, and methods of asse...
- Patent number 10,418,767
- Issue date Sep 17, 2019
- J.S.T. Corporation
- Vikas Azad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly having vibration-proof fixing structure for circui...
- Patent number 10,406,890
- Issue date Sep 10, 2019
- MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
- Shunsuke Yakushiji
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated connector for electronic device
- Patent number 10,355,384
- Issue date Jul 16, 2019
- Intel Corporation
- Kit Chew Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY CARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240377866
- Publication date Nov 14, 2024
- ASUS GLOBAL PTE. LTD.
- Jingwen Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device
- Publication number 20240162637
- Publication date May 16, 2024
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Prototyping
- Publication number 20230389175
- Publication date Nov 30, 2023
- Microsoft Technology Licensing, LLC
- Stephen Edward HODGES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MEMORY SYSTEM
- Publication number 20230309234
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Expansion card with mezzanine level connector
- Publication number 20230284384
- Publication date Sep 7, 2023
- Xilinx, Inc.
- Ieuan James Mackereth MARSHALL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL COMMUNICATION MODULE SUBSTRATE
- Publication number 20230254973
- Publication date Aug 10, 2023
- NITTO DENKO CORPORATION
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING SUBMERSION DETECTION CIRCUIT, OPERATING ME...
- Publication number 20230240006
- Publication date Jul 27, 2023
- HL MANDO CORPORATION
- Su Min LEE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DOUBLE-SIDED PLASTIC PACKAGE POWER SUPPLY PRODUCT
- Publication number 20230209712
- Publication date Jun 29, 2023
- MORNSUN GUANGZHOU SCIENCE & TECHNOLOGY CO., LTD.
- Youyuan TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE
- Publication number 20220311189
- Publication date Sep 29, 2022
- Sumitomo Electric Industries, Ltd.
- Naoshige YOKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Publication number 20220295641
- Publication date Sep 15, 2022
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE MONITORING MODULE
- Publication number 20220236332
- Publication date Jul 28, 2022
- NIPPON MEKTRON, LTD.
- Hajime GYOTOKU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...
- Publication number 20220223506
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Xuanwei FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS
- Publication number 20220217834
- Publication date Jul 7, 2022
- KYOCERA CORPORATION
- Toshihiko KITAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR UNIT FOR VEHICLES
- Publication number 20220194172
- Publication date Jun 23, 2022
- VALEO Schalter und Sensoren GmbH
- Bohuslav Coufal
- B60 - VEHICLES IN GENERAL
Information Patent Application
MEMORY MODULE AND CONNECTOR FORM FACTOR TO REDUCE CROSSTALK
- Publication number 20210408704
- Publication date Dec 30, 2021
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20210368622
- Publication date Nov 25, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AN INTEGRATED MULTILAYER STRUCTURE AND A METHOD FOR MANUFACTURING A...
- Publication number 20210359481
- Publication date Nov 18, 2021
- TactoTek Oy
- Ilpo HÄNNINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT, SUBSTRATE AND AN OPTICAL S...
- Publication number 20210212217
- Publication date Jul 8, 2021
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MICROCHIPS FOR DOWNHOLE DATA COLLECTION
- Publication number 20200367378
- Publication date Nov 19, 2020
- Saudi Arabian Oil Company
- Bodong Li
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
GOLDEN FINGER DESIGN METHODOLOGY FOR HIGH SPEED DIFFERENTIAL SIGNAL...
- Publication number 20200212610
- Publication date Jul 2, 2020
- QUANTA COMPUTER INC.
- Cheng-Hsien LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200214129
- Publication date Jul 2, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Yoshiro ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board for Interconnecting Electrical Control Wires
- Publication number 20190348778
- Publication date Nov 14, 2019
- Rodney Preston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF PRINTED CIRCUIT BOARD AND CARD EDGE CONNECTOR FOR MEMOR...
- Publication number 20190348783
- Publication date Nov 14, 2019
- SUNG-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVITY FOR INTEGRATED CIRCUIT PACKAGING
- Publication number 20190200446
- Publication date Jun 27, 2019
- Intel Corporation
- Brian J. Long
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE DRIVER BOARD FOR LIGHT BULB
- Publication number 20190101247
- Publication date Apr 4, 2019
- TECHNICAL CONSUMER PRODUCTS, INC.
- George J. UHLER
- F21 - LIGHTING
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20180376595
- Publication date Dec 27, 2018
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CONNECTOR FOR ELECTRONIC DEVICE
- Publication number 20180233841
- Publication date Aug 16, 2018
- Intel Corporation
- Kit Chew Chee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180153032
- Publication date May 31, 2018
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Mitsumasa Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC TILE PACKAGING
- Publication number 20180116052
- Publication date Apr 26, 2018
- Northrop Grumman Systems Corporation
- Steven J. Mass
- H01 - BASIC ELECTRIC ELEMENTS

Edge terminals

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate and memory system

Method of mounting electronic component, substrate and an optical s...

Sensor unit for vehicles

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Resilient micro lattice electrical interconnection assembly

Wiring board, electronic component package, and electronic apparatus

Lead frame, packaged integrated circuit board, power chip, and circ...

Connector attached multi-conductor cable

Expansion card with mezzanine level connector

Voltage monitoring module

Flexible printed circuit board

Integrated multilayer structure and a method for manufacturing a mu...

Thermal conductivity for integrated circuit packaging

Resilient micro lattice electrical interconnection assembly

Electronic display with mount-accessible components

Microchips for downhole data collection

Low-cost superior performance coinless RF power amplifier

Method for contacting a contact surface on a flexible circuit with...

Golden finger design methodology for high speed differential signal...

Thermal conductivity for integrated circuit packaging

Conductive driver board for light bulb

Printed circuit board, a terminal and a method of assembling a prin...

Assembly of printed circuit board and card edge connector for memor...

Conductor connection structure of laminated wiring body

Grounding structure for circuit board

Conductor connection structure of laminated wiring body

System and method of identifying a module in a stack light

Adjustable impedance high speed data connector, and methods of asse...

Circuit assembly having vibration-proof fixing structure for circui...

Integrated connector for electronic device

Patents Applicationslast 30 patents

DISPLAY CARD MODULE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD GROUNDING

Electronic Device

Electronic Prototyping

SUBSTRATE AND MEMORY SYSTEM

Expansion card with mezzanine level connector

OPTICAL COMMUNICATION MODULE SUBSTRATE

ELECTRONIC DEVICE HAVING SUBMERSION DETECTION CIRCUIT, OPERATING ME...

DOUBLE-SIDED PLASTIC PACKAGE POWER SUPPLY PRODUCT

CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE

Method for producing a metal-ceramic substrate, and metal-ceramic s...

VOLTAGE MONITORING MODULE

LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...

WIRING BOARD, ELECTRONIC COMPONENT PACKAGE, AND ELECTRONIC APPARATUS

SENSOR UNIT FOR VEHICLES

MEMORY MODULE AND CONNECTOR FORM FACTOR TO REDUCE CROSSTALK

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

AN INTEGRATED MULTILAYER STRUCTURE AND A METHOD FOR MANUFACTURING A...

METHOD OF MOUNTING ELECTRONIC COMPONENT, SUBSTRATE AND AN OPTICAL S...

MICROCHIPS FOR DOWNHOLE DATA COLLECTION

GOLDEN FINGER DESIGN METHODOLOGY FOR HIGH SPEED DIFFERENTIAL SIGNAL...

FLEXIBLE PRINTED CIRCUIT BOARD

Printed Circuit Board for Interconnecting Electrical Control Wires

ASSEMBLY OF PRINTED CIRCUIT BOARD AND CARD EDGE CONNECTOR FOR MEMOR...

THERMAL CONDUCTIVITY FOR INTEGRATED CIRCUIT PACKAGING

CONDUCTIVE DRIVER BOARD FOR LIGHT BULB

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

INTEGRATED CONNECTOR FOR ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC TILE PACKAGING