Elastomer inlay

Follow

Industry

CPC
H01L2224/79315

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/79315Elastomer inlay

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for bending a substrate
- Patent number 10,600,658
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor substrate
- Patent number 10,475,668
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Bending a Substrate
- Publication number 20200027752
- Publication date Jan 23, 2020
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS