Electrical aspects

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G02B6/4274

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4274Electrical aspects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Yield enhancement techniques for photonic communications platform
- Patent number 12,130,484
- Issue date Oct 29, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Grant
Optical device and optical system
- Patent number 12,124,096
- Issue date Oct 22, 2024
- TDK Corporation
- Tetsuya Shibata
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide subassembly structures
- Patent number 12,099,236
- Issue date Sep 24, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,092,861
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 12,074,642
- Issue date Aug 27, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Mu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiband QAM interface for slab waveguide
- Patent number 12,062,629
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including photonic package and interposer having...
- Patent number 12,044,892
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Package structure having grating coupler and manufacturing method t...
- Patent number 12,007,611
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Transmissive metasurface lens integration
- Patent number 11,988,844
- Issue date May 21, 2024
- Metalenz, Inc.
- Gilbert N. Riley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaging with silicon photonics hybrid planar lightwave circuit
- Patent number 11,982,854
- Issue date May 14, 2024
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Grant
Optical device and optical system
- Patent number 11,953,742
- Issue date Apr 9, 2024
- TDK Corporation
- Tetsuya Shibata
- G02 - OPTICS
Information Patent Grant
POE power supply device, POE power supply system, and interface part
- Patent number 11,956,090
- Issue date Apr 9, 2024
- Huawei Technologies Co., Ltd.
- Jincan Cao
- G02 - OPTICS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 11,947,164
- Issue date Apr 2, 2024
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical integrated circuit structure including edge coupling protec...
- Patent number 11,940,659
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device having a light-emitting structure and a waveguide in...
- Patent number 11,927,819
- Issue date Mar 12, 2024
- Hewlett Packard Enterprise Development LP
- Sudharsanan Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote memory architectures enabled by monolithic in-package optica...
- Patent number 11,916,602
- Issue date Feb 27, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical integrated photonics chiplet for in-package optical interc...
- Patent number 11,899,251
- Issue date Feb 13, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid micro-modules with iLED and light conductor
- Patent number 11,890,890
- Issue date Feb 6, 2024
- X Display Company Technology Limited
- Mark Willner
- G02 - OPTICS
Information Patent Grant
Modular assembly for opto-electronic systems
- Patent number 11,874,502
- Issue date Jan 16, 2024
- II-VI DELAWARE, INC.
- Po Dong
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide structure
- Patent number 11,867,946
- Issue date Jan 9, 2024
- POET Technologies, Inc.
- William Ring
- G02 - OPTICS
Information Patent Grant
Electrical and optical cable device with shielding shell grounded t...
- Patent number 11,867,959
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Jin Sub Kim
- G02 - OPTICS
Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling
- Patent number 11,852,876
- Issue date Dec 26, 2023
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 11,841,541
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonics based fiber coupler
- Patent number 11,828,995
- Issue date Nov 28, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L Nagarajan
- G02 - OPTICS
Information Patent Grant
Optoelectronic device
- Patent number 11,740,416
- Issue date Aug 29, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- G02 - OPTICS
Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 11,709,327
- Issue date Jul 25, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
USB 2.0 photoelectric transmission system
- Patent number 11,704,268
- Issue date Jul 18, 2023
- SHENZHEN AFALIGHT CO., LTD.
- Junbin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pooled memory system enabled by monolithic in-package optical I/O
- Patent number 11,705,972
- Issue date Jul 18, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Multiband QAM Interface for Slab Waveguide
- Publication number 20240395738
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE DEVICE
- Publication number 20240385366
- Publication date Nov 21, 2024
- Shinko Electric Industries Co., Ltd.
- Kazunao YAMAMOTO
- G02 - OPTICS
Information Patent Application
Connector Module for Optical Communication
- Publication number 20240385399
- Publication date Nov 21, 2024
- Artilux, Inc.
- Chang-Lin Hsieh
- G02 - OPTICS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240361520
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASE...
- Publication number 20240345345
- Publication date Oct 17, 2024
- Intel Corporation
- Debendra Das Sharma
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240345343
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES
- Publication number 20240345344
- Publication date Oct 17, 2024
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...
- Publication number 20240337800
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...
- Publication number 20240319457
- Publication date Sep 26, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240302611
- Publication date Sep 12, 2024
- Huawei Technologies Co., Ltd
- Wenqi Zhang
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...
- Publication number 20240280765
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- G02 - OPTICS
Information Patent Application
CIRCUIT ARRANGEMENT, SEMICONDUCTOR MODULE, ELECTRICAL SYSTEM, AND M...
- Publication number 20240272391
- Publication date Aug 15, 2024
- ROBERT BOSCH GmbH
- Jonathan Winkler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT
- Publication number 20240264396
- Publication date Aug 8, 2024
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE
- Publication number 20240219644
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID OPTICAL-ELECTRICAL INTERCONNECTION DEVICE
- Publication number 20240219658
- Publication date Jul 4, 2024
- MO-LINK TECHNOLOGY LIMITED
- Hao WANG
- G02 - OPTICS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT STRUCTURE INCLUDING EDGE COUPLING PROTEC...
- Publication number 20240201458
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remote Memory Architectures Enabled by Monolithic In-Package Optica...
- Publication number 20240187110
- Publication date Jun 6, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20240176081
- Publication date May 30, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES
- Publication number 20240176066
- Publication date May 30, 2024
- Lightmatter, Inc
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...
- Publication number 20240168245
- Publication date May 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND OPTICAL SYSTEM
- Publication number 20240151919
- Publication date May 9, 2024
- TDK Corporation
- Tetsuya SHIBATA
- G02 - OPTICS
Information Patent Application
MICROSCALE MULTI-FUNCTIONAL OPTICAL STRUCTURE
- Publication number 20240151916
- Publication date May 9, 2024
- LESSENGERS Inc.
- Chongcook KIM
- G02 - OPTICS
Information Patent Application
Optical Coupling
- Publication number 20240118505
- Publication date Apr 11, 2024
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
PIC STRUCTURE WITH WIRE(S) BETWEEN Z-STOP SUPPORTS ON SIDE OF OPTIC...
- Publication number 20240103237
- Publication date Mar 28, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Application
MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS
- Publication number 20240103225
- Publication date Mar 28, 2024
- II-VI Delaware, Inc.
- Po DONG
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...
- Publication number 20240069291
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- G02 - OPTICS
Information Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240061194
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- G02 - OPTICS
Information Patent Application
PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240061195
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS

Electrical aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor package

Yield enhancement techniques for photonic communications platform

Optical device and optical system

Optical dielectric waveguide subassembly structures

Photonic semiconductor device and method of manufacture

Optical module

Multiband QAM interface for slab waveguide

Package structure including photonic package and interposer having...

Package structure having grating coupler and manufacturing method t...

Transmissive metasurface lens integration

Co-packaging with silicon photonics hybrid planar lightwave circuit

Optical device and optical system

POE power supply device, POE power supply system, and interface part

Photonic wafer communication systems and related packages

Optical integrated circuit structure including edge coupling protec...

Optical device having a light-emitting structure and a waveguide in...

Remote memory architectures enabled by monolithic in-package optica...

Vertical integrated photonics chiplet for in-package optical interc...

Rigid micro-modules with iLED and light conductor

Modular assembly for opto-electronic systems

Optical dielectric waveguide structure

Electrical and optical cable device with shielding shell grounded t...

Package structure and optical signal transmitter

Optical coupling

Package assembly and manufacturing method thereof

Silicon photonics based fiber coupler

Optoelectronic device

Fanout module integrating a photonic integrated circuit

USB 2.0 photoelectric transmission system

Pooled memory system enabled by monolithic in-package optical I/O

Patents Applicationslast 30 patents

Multiband QAM Interface for Slab Waveguide

OPTICAL WAVEGUIDE DEVICE

Connector Module for Optical Communication

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASE...

ELECTRONIC DEVICE

OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...

UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...

PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...

CIRCUIT ARRANGEMENT, SEMICONDUCTOR MODULE, ELECTRICAL SYSTEM, AND M...

CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE

HYBRID OPTICAL-ELECTRICAL INTERCONNECTION DEVICE

OPTICAL INTEGRATED CIRCUIT STRUCTURE INCLUDING EDGE COUPLING PROTEC...

Remote Memory Architectures Enabled by Monolithic In-Package Optica...

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES

INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...

OPTICAL DEVICE AND OPTICAL SYSTEM

MICROSCALE MULTI-FUNCTIONAL OPTICAL STRUCTURE

Optical Coupling

PIC STRUCTURE WITH WIRE(S) BETWEEN Z-STOP SUPPORTS ON SIDE OF OPTIC...

MODULAR ASSEMBLY FOR OPTO-ELECTRONIC SYSTEMS

PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...

PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES

PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF