Electrical aspects

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CPC
G02B6/4274

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4274Electrical aspects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical communication module substrate
- Patent number 12,369,251
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical integrated circuit structure including edge coupling protec...
- Patent number 12,353,034
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 12,345,935
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling
- Patent number 12,321,021
- Issue date Jun 3, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure including grating coupler with optofluidic grating channels
- Patent number 12,306,442
- Issue date May 20, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packages having photon integrated circuit (PIC) chips
- Patent number 12,300,680
- Issue date May 13, 2025
- Micron Technology, Inc.
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GaN) integrated circuit technology with optical co...
- Patent number 12,292,608
- Issue date May 6, 2025
- Intel Corporation
- Han Wui Then
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical package
- Patent number 12,292,607
- Issue date May 6, 2025
- STMicroelectronics (Alps) SAS
- Deborah Cogoni
- G02 - OPTICS
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC structure with wire(s) between z-stop supports on side of optic...
- Patent number 12,292,603
- Issue date May 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- G02 - OPTICS
Information Patent Grant
Optical connection systems and methods thereof
- Patent number 12,287,520
- Issue date Apr 29, 2025
- Bard Access Systems, Inc.
- Steffan Sowards
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 12,276,850
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photonics and processor package with redistribution laye...
- Patent number 12,266,608
- Issue date Apr 1, 2025
- Intel Corporation
- Susheel Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid micro-modules with iLED and light conductor
- Patent number 12,240,262
- Issue date Mar 4, 2025
- X Display Company Technology Limited
- Mark Willner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling
- Patent number 12,189,195
- Issue date Jan 7, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Yield enhancement techniques for photonic communications platform
- Patent number 12,130,484
- Issue date Oct 29, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Grant
Optical device and optical system
- Patent number 12,124,096
- Issue date Oct 22, 2024
- TDK Corporation
- Tetsuya Shibata
- G02 - OPTICS
Information Patent Grant
Optical dielectric waveguide subassembly structures
- Patent number 12,099,236
- Issue date Sep 24, 2024
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,092,861
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 12,074,642
- Issue date Aug 27, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Mu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multiband QAM interface for slab waveguide
- Patent number 12,062,629
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including photonic package and interposer having...
- Patent number 12,044,892
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Package structure having grating coupler and manufacturing method t...
- Patent number 12,007,611
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Wei Kuo
- G02 - OPTICS
Information Patent Grant
Transmissive metasurface lens integration
- Patent number 11,988,844
- Issue date May 21, 2024
- Metalenz, Inc.
- Gilbert N. Riley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaging with silicon photonics hybrid planar lightwave circuit
- Patent number 11,982,854
- Issue date May 14, 2024
- Intel Corporation
- Sang Yup Kim
- G02 - OPTICS
Information Patent Grant
Optical device and optical system
- Patent number 11,953,742
- Issue date Apr 9, 2024
- TDK Corporation
- Tetsuya Shibata
- G02 - OPTICS
Information Patent Grant
POE power supply device, POE power supply system, and interface part
- Patent number 11,956,090
- Issue date Apr 9, 2024
- Huawei Technologies Co., Ltd.
- Jincan Cao
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY WITH OPTICAL CO...
- Publication number 20250231358
- Publication date Jul 17, 2025
- Intel Corporation
- Han Wui THEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250204074
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD...
- Publication number 20250172774
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih LIN
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...
- Publication number 20250167188
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Shougo MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER MODULE AND SYSTEMS USING THE SAME
- Publication number 20250164720
- Publication date May 22, 2025
- Xscape Photonics Inc.
- Hyundai Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...
- Publication number 20250147251
- Publication date May 8, 2025
- Corning Research & Development Corporation
- Lars Martin Otfried Brusberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH PHOTONIC INTEGRATED CIRCUIT CHIP AND ME...
- Publication number 20250138258
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT DEVICE FACILITATING SAME-SIDE OPTICAL AND ELECTR...
- Publication number 20250123450
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR AN OPTICAL INTERPOSER WITH ACTUATOR BEAMS
- Publication number 20250110294
- Publication date Apr 3, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
- Publication number 20250110301
- Publication date Apr 3, 2025
- Intel Corporation
- Saeed Fathololoumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Coupling
- Publication number 20250085492
- Publication date Mar 13, 2025
- Teramount Ltd.
- Hesham Taha
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087541
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION
- Publication number 20250054929
- Publication date Feb 13, 2025
- SAMTEC, INC.
- Marc EPITAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250044532
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM
- Publication number 20250028130
- Publication date Jan 23, 2025
- Lightmatter, Inc
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Application
OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES
- Publication number 20250012972
- Publication date Jan 9, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Application
Multiband QAM Interface for Slab Waveguide
- Publication number 20240395738
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE DEVICE
- Publication number 20240385366
- Publication date Nov 21, 2024
- Shinko Electric Industries Co., Ltd.
- Kazunao YAMAMOTO
- G02 - OPTICS
Information Patent Application
Connector Module for Optical Communication
- Publication number 20240385399
- Publication date Nov 21, 2024
- Artilux, Inc.
- Chang-Lin Hsieh
- G02 - OPTICS
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240361520
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASE...
- Publication number 20240345345
- Publication date Oct 17, 2024
- Intel Corporation
- Debendra Das Sharma
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240345343
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES
- Publication number 20240345344
- Publication date Oct 17, 2024
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...
- Publication number 20240337800
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...
- Publication number 20240319457
- Publication date Sep 26, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240302611
- Publication date Sep 12, 2024
- Huawei Technologies Co., Ltd
- Wenqi Zhang
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...
- Publication number 20240280765
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- G02 - OPTICS

Electrical aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical communication module substrate

Optical integrated circuit structure including edge coupling protec...

Package assembly and manufacturing method thereof

Optical coupling

Photonic wafer communication systems and related packages

Structure including grating coupler with optofluidic grating channels

Semiconductor packages having photon integrated circuit (PIC) chips

Gallium nitride (GaN) integrated circuit technology with optical co...

Optical package

Siliconized heterogeneous optical engine

PIC structure with wire(s) between z-stop supports on side of optic...

Optical connection systems and methods thereof

Fanout module integrating a photonic integrated circuit

Semiconductor package and method of forming the same

Integrated photonics and processor package with redistribution laye...

Rigid micro-modules with iLED and light conductor

Optical coupling

Manufacturing method of semiconductor package

Yield enhancement techniques for photonic communications platform

Optical device and optical system

Optical dielectric waveguide subassembly structures

Photonic semiconductor device and method of manufacture

Optical module

Multiband QAM interface for slab waveguide

Package structure including photonic package and interposer having...

Package structure having grating coupler and manufacturing method t...

Transmissive metasurface lens integration

Co-packaging with silicon photonics hybrid planar lightwave circuit

Optical device and optical system

POE power supply device, POE power supply system, and interface part

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

GALLIUM NITRIDE (GAN) INTEGRATED CIRCUIT TECHNOLOGY WITH OPTICAL CO...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PHOTONIC SYSTEM WITH REMOVABLE FIBER ARRAY UNIT ASSEMBLY AND METHOD...

OPTICAL WAVEGUIDE BOARD, OPTICAL WAVEGUIDE PACKAGE, AND LIGHT SOURC...

LASER MODULE AND SYSTEMS USING THE SAME

OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...

CHIP PACKAGE STRUCTURE WITH PHOTONIC INTEGRATED CIRCUIT CHIP AND ME...

INTEGRATED CIRCUIT DEVICE FACILITATING SAME-SIDE OPTICAL AND ELECTR...

TECHNOLOGIES FOR AN OPTICAL INTERPOSER WITH ACTUATOR BEAMS

TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE

Optical Coupling

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM

OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES

Multiband QAM Interface for Slab Waveguide

OPTICAL WAVEGUIDE DEVICE

Connector Module for Optical Communication

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASE...

ELECTRONIC DEVICE

OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES

PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING...

UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...

PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD T...