Electrical connecting means

Industry

CPC
H01J37/32577

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32577Electrical connecting means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,255,049
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Koichi Nagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck device
- Patent number 12,249,492
- Issue date Mar 11, 2025
- Sumitomo Osaka Cement Co., Ltd.
- Masaki Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate support unit
- Patent number 12,249,491
- Issue date Mar 11, 2025
- Semes Co., Ltd.
- Hyoungkyu Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,243,716
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Taro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature RF connection with integral thermal choke
- Patent number 12,243,725
- Issue date Mar 4, 2025
- Lam Research Corporation
- Timothy S. Thomas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,243,723
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Yusuke Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing assembly using pulsed-voltage and radio-frequency...
- Patent number 12,237,148
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Leonid Dorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power cable for heated components in RF environment
- Patent number 12,217,944
- Issue date Feb 4, 2025
- Lam Research Corporation
- Seyed Jafar Jafarian-Tehrani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF tuning systems including tuning circuits having impedances for s...
- Patent number 12,217,939
- Issue date Feb 4, 2025
- Lam Research Corporation
- David French
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate support and plasma processing apparatus
- Patent number 12,198,906
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Hajime Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,191,121
- Issue date Jan 7, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazuyuki Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,191,124
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Tatsuo Matsudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,183,546
- Issue date Dec 31, 2024
- ASM IP Holding B.V.
- KiChul Um
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-frequency high-voltage waveguide device
- Patent number 12,176,595
- Issue date Dec 24, 2024
- TRUMPF Huettinger GmbH + Co. KG
- Christian Wangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting apparatus and substrate treating apparatus inc...
- Patent number 12,170,191
- Issue date Dec 17, 2024
- Semes Co., Ltd.
- Jong Gun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for releasing sample
- Patent number 12,148,633
- Issue date Nov 19, 2024
- HITACHI HIGH-TECH CORPORATION
- Masaki Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric plasma source to generate pie-shaped treatment
- Patent number 12,142,458
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 12,119,211
- Issue date Oct 15, 2024
- ASM IP Holding B.V.
- ChangMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support device
- Patent number 12,119,212
- Issue date Oct 15, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Masaki Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,087,556
- Issue date Sep 10, 2024
- Kioxia Corporation
- Yosuke Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Impedance match with an elongated RF strap
- Patent number 12,080,518
- Issue date Sep 3, 2024
- Lam Research Corporation
- Felix Leib Kozakevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,068,139
- Issue date Aug 20, 2024
- Tokyo Electron Limited
- Shin Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor having a variable coupling of low frequency RF power...
- Patent number 12,062,524
- Issue date Aug 13, 2024
- ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Kui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus and method for operating the same
- Patent number 12,046,451
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Nam Kyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter circuit and plasma processing apparatus
- Patent number 12,033,833
- Issue date Jul 9, 2024
- Tokyo Electron Limited
- Koji Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and high-frequency power application me...
- Patent number 12,027,347
- Issue date Jul 2, 2024
- Tokyo Electron Limited
- Naoki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining quartz pieces and quartz electrodes and other de...
- Patent number 12,020,971
- Issue date Jun 25, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck assembly for plasma processing apparatus
- Patent number 12,002,701
- Issue date Jun 4, 2024
- Mattson Technology, Inc.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage waveform generator, wafer processing apparatus and plasma p...
- Patent number 12,002,651
- Issue date Jun 4, 2024
- Samsung Electronics Co., Ltd.
- Hyunbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic susceptor
- Patent number 11,990,322
- Issue date May 21, 2024
- MiCo Ceramics Ltd.
- Haneum Bae
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250087460
- Publication date Mar 13, 2025
- ASM IP HOLDING B.V.
- KiChul Um
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20250079229
- Publication date Mar 6, 2025
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR
- Publication number 20250069858
- Publication date Feb 27, 2025
- ULVAC, Inc.
- Kenta DOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A WAFER CHUCK ASSEMBLY WITH THERMAL INSULATION FOR RF CONNECTIONS
- Publication number 20250054736
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Patrick G. BREILING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING DEVICE
- Publication number 20250037971
- Publication date Jan 30, 2025
- Advanced Micro-Fabrication Equipment Inc. China
- Tuqiang NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER PLATES WITH DISTRIBUTED PURGE CHANNELS, RF MESHES AND GROUND...
- Publication number 20250022694
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Pranav Vijay Gadre
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EDGE CAPACITIVELY COUPLED PLASMA CHAMBER STRUCTURE
- Publication number 20250006470
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT DEVICE
- Publication number 20240429032
- Publication date Dec 26, 2024
- Sumitomo Osaka Cement Co., Ltd.
- Masaki HIRAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE MATCH WITH AN ELONGATED RF STRAP
- Publication number 20240395504
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Felix Leib Kozakevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AFE (ACTIVE FAR EDGE) HEATER/BIPOLAR ESC WITH SIMPLIFIED AND OPTIMI...
- Publication number 20240387154
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Juan Carlos ROCHA-ALVAREZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION
- Publication number 20240387148
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240371609
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Shin MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240331974
- Publication date Oct 3, 2024
- HITACHI HIGH-TECH CORPORATION
- Isao Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT INCLUDING MULTIPLE RADIO FREQUENCY (RF) ELECTRODES
- Publication number 20240321560
- Publication date Sep 26, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yulin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240290587
- Publication date Aug 29, 2024
- Semes Co., Ltd.
- Dong Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSING POWER SUPPLY WITH POWERED CROWBAR
- Publication number 20240282552
- Publication date Aug 22, 2024
- EHT Ventures LLC
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic Chuck Assembly for Plasma Processing Apparatus
- Publication number 20240282614
- Publication date Aug 22, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATION
- Publication number 20240266202
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Miguel Benjamin Vasquez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240249922
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Ryota SAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS
- Publication number 20240249924
- Publication date Jul 25, 2024
- Applied Materials, Inc.
- Jian Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UPPER ELECTRODE STRUCTURE AND PLASMA PROCESSING APPARATUS
- Publication number 20240249907
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Tetsuji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240242943
- Publication date Jul 18, 2024
- NGK Insulators, Ltd.
- Tomohiro HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL METHOD AND DEVICE OF LOWER RADIO FREQUENCY POWER SUPP...
- Publication number 20240234088
- Publication date Jul 11, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Jing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK...
- Publication number 20240222118
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Peng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240162075
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Akira NAGAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT
- Publication number 20240105429
- Publication date Mar 28, 2024
- Lam Reseach Corporation
- Seyed Jafar JAFARIAN-TEHRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240079216
- Publication date Mar 7, 2024
- PSK INC.
- KWANG SUNG YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR GENERATING ATMOSPHERIC PRESSURE, LOW TEMP...
- Publication number 20240066161
- Publication date Feb 29, 2024
- TellaPure, LLC
- Edgar Bryan Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS COOLED HIGH POWER CONNECTION ROD
- Publication number 20240071729
- Publication date Feb 29, 2024
- Kumaresan NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WAFER BOW IN MULTIPLE STATIONS
- Publication number 20240055285
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Edward Augustyniak
- H01 - BASIC ELECTRIC ELEMENTS

Electrical connecting means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma processing apparatus and plasma processing method

Electrostatic chuck device

Substrate treating apparatus and substrate support unit

Plasma processing apparatus

High temperature RF connection with integral thermal choke

Plasma processing apparatus

Plasma processing assembly using pulsed-voltage and radio-frequency...

High power cable for heated components in RF environment

RF tuning systems including tuning circuits having impedances for s...

Substrate support and plasma processing apparatus

Plasma processing apparatus

Plasma processing apparatus and plasma processing method

Substrate processing apparatus

High-frequency high-voltage waveguide device

Substrate supporting apparatus and substrate treating apparatus inc...

Plasma processing apparatus and method for releasing sample

Symmetric plasma source to generate pie-shaped treatment

Substrate processing apparatus

Wafer support device

Plasma processing apparatus and plasma processing method

Impedance match with an elongated RF strap

Plasma processing apparatus

Plasma reactor having a variable coupling of low frequency RF power...

Plasma etching apparatus and method for operating the same

Filter circuit and plasma processing apparatus

Plasma processing apparatus and high-frequency power application me...

Method for joining quartz pieces and quartz electrodes and other de...

Electrostatic chuck assembly for plasma processing apparatus

Voltage waveform generator, wafer processing apparatus and plasma p...

Ceramic susceptor

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

WAFER PLACEMENT TABLE

PLASMA PROCESSING APPARATUS AND CONTROL METHOD THEREFOR

A WAFER CHUCK ASSEMBLY WITH THERMAL INSULATION FOR RF CONNECTIONS

PLASMA PROCESSING DEVICE

HEATER PLATES WITH DISTRIBUTED PURGE CHANNELS, RF MESHES AND GROUND...

EDGE CAPACITIVELY COUPLED PLASMA CHAMBER STRUCTURE

WAFER SUPPORT DEVICE

IMPEDANCE MATCH WITH AN ELONGATED RF STRAP

AFE (ACTIVE FAR EDGE) HEATER/BIPOLAR ESC WITH SIMPLIFIED AND OPTIMI...

TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION

PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS

SUBSTRATE SUPPORT INCLUDING MULTIPLE RADIO FREQUENCY (RF) ELECTRODES

APPARATUS AND METHOD FOR TREATING SUBSTRATE

PULSING POWER SUPPLY WITH POWERED CROWBAR

Electrostatic Chuck Assembly for Plasma Processing Apparatus

ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATION

PLASMA PROCESSING APPARATUS

BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS

UPPER ELECTRODE STRUCTURE AND PLASMA PROCESSING APPARATUS

WAFER PLACEMENT TABLE

POWER CONTROL METHOD AND DEVICE OF LOWER RADIO FREQUENCY POWER SUPP...

METHODS FOR FORMING SEMICONDUCTOR DEVICES USING MODIFIED PHOTOMASK...

SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE

HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

METHODS AND APPARATUS FOR GENERATING ATMOSPHERIC PRESSURE, LOW TEMP...

GAS COOLED HIGH POWER CONNECTION ROD

CONTROL OF WAFER BOW IN MULTIPLE STATIONS