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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,255,161
Issue date
Mar 18, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Secure semiconductor integration and method for making thereof
Patent number
12,255,189
Issue date
Mar 18, 2025
BroadPak Corporation
Farhang Yazdani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,243,765
Issue date
Mar 4, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Flexible electronic structure including a support element
Patent number
12,237,289
Issue date
Feb 25, 2025
PRAGMATIC SEMICONDUCTOR LIMITED
Brian Cobb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scalable large system based on organic interconnect
Patent number
12,237,269
Issue date
Feb 25, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with composite conductive features and method...
Patent number
12,218,087
Issue date
Feb 4, 2025
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor devices and structures with metal layers
Patent number
12,199,093
Issue date
Jan 14, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a curved part in the printed circuit board
Patent number
12,191,245
Issue date
Jan 7, 2025
Fuji Electric Co., Ltd.
Motohito Hori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-channel gate driver package with grounded shield metal
Patent number
12,191,259
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor apparatus and fabrication method for the same
Patent number
12,191,275
Issue date
Jan 7, 2025
Rohm Co., Ltd.
Takukazu Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,176,262
Issue date
Dec 24, 2024
Samsung Electronics Co., Ltd.
Eunseok Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-tier IC package including processor and high bandwidth memory
Patent number
12,154,890
Issue date
Nov 26, 2024
Huawei Technologies Co., Ltd.
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
12,154,823
Issue date
Nov 26, 2024
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor memory device and structure
Patent number
12,154,817
Issue date
Nov 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,148,737
Issue date
Nov 19, 2024
Mitsubishi Electric Corporation
Kazuto Mikami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
Patent number
12,143,077
Issue date
Nov 12, 2024
Skyworks Solutions, Inc.
Peter J. Zampardi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
12,136,562
Issue date
Nov 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,125,737
Issue date
Oct 22, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Coaxial probe
Patent number
12,111,343
Issue date
Oct 8, 2024
Xcerra Corporation
Yukang Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
Patent number
12,100,679
Issue date
Sep 24, 2024
Dialog Semiconductor (UK) Limited
Habeeb Mohiuddin Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
12,100,611
Issue date
Sep 24, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Doherty amplifier
Patent number
12,081,174
Issue date
Sep 3, 2024
Mitsubishi Electric Corporation
Katsuya Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device packages with uniform components and methods of forming the...
Patent number
12,074,149
Issue date
Aug 27, 2024
MACOM Technology Solutions Holdings, Inc.
Michael E. Watts
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D integrations and methods of making thereof
Patent number
12,068,231
Issue date
Aug 20, 2024
BroadPak Corporation
Farhang Yazdani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
12,068,235
Issue date
Aug 20, 2024
Rohm Co., Ltd.
Masaaki Matsuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
Patent number
12,068,187
Issue date
Aug 20, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Electrical, mechanical, computing, and/or other devices formed of e...
Patent number
12,063,874
Issue date
Aug 13, 2024
Ambature, Inc.
Douglas J. Gilbert
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information
Patent Grant
Chip package
Patent number
12,062,618
Issue date
Aug 13, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package design scheme for enabling high-speed low-loss signaling an...
Patent number
12,057,413
Issue date
Aug 6, 2024
Intel Corporation
Lijiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
12,057,426
Issue date
Aug 6, 2024
Rohm Co., Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
Publication number
20250105152
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Hansae Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
Publication number
20250096047
Publication date
Mar 20, 2025
Samsung Electronics Co., Ltd.
YEONGSEON KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20250098325
Publication date
Mar 20, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...
Publication number
20250096180
Publication date
Mar 20, 2025
Fujitsu Limited
Shirou OZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250096083
Publication date
Mar 20, 2025
INERGY TECHNOLOGY INC.
Li-Zheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250098289
Publication date
Mar 20, 2025
Kabushiki Kaisha Toshiba
Yusuke KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
Publication number
20250098551
Publication date
Mar 20, 2025
Ambature Inc.
Douglas J. GILBERT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTERNAL CONNECTION PAD APPARATUS AND SEMICONDUCTOR APPARATUS INCLU...
Publication number
20250079361
Publication date
Mar 6, 2025
SK HYNIX INC.
Yang Ho SUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
Publication number
20250079387
Publication date
Mar 6, 2025
Huawei Digital Power Technologies Co., Ltd.
Hui LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
Publication number
20250079300
Publication date
Mar 6, 2025
Intel Corporation
Aleksandar ALEKSOV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250069979
Publication date
Feb 27, 2025
Samsung Electronics Co., Ltd.
Eunseok CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250069995
Publication date
Feb 27, 2025
Realtek Semiconductor Corp.
Nai-Jen Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250054828
Publication date
Feb 13, 2025
Siliconware Precision Industries Co., Ltd.
Wei-Shen HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
Publication number
20250054844
Publication date
Feb 13, 2025
Realtek Semiconductor Corp.
Yu-Hsin Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20250056943
Publication date
Feb 13, 2025
Mitsubishi Electric Corporation
Chikara WATATANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20250046653
Publication date
Feb 6, 2025
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
Publication number
20250038104
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
Publication number
20250038091
Publication date
Jan 30, 2025
CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
Shuan Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250029923
Publication date
Jan 23, 2025
SOCIONEXT INC.
Masato NAKOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20250029902
Publication date
Jan 23, 2025
Realtek Semiconductor Corp.
Nai-Jen Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
Publication number
20250030386
Publication date
Jan 23, 2025
Skyworks Solutions, Inc.
Weimin Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL-BOND ARRANGEMENT
Publication number
20250015037
Publication date
Jan 9, 2025
Heraeus Materials Singapore Pte. Ltd.
Yee Weon LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OUTPUT MATCHING NETWORK TO REDUCE SELF AND MUTUAL INDUCTANCES OF OU...
Publication number
20250006688
Publication date
Jan 2, 2025
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Seiya TAKASHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20250006544
Publication date
Jan 2, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
Publication number
20240429086
Publication date
Dec 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE MEMORY DEVICE
Publication number
20240404580
Publication date
Dec 5, 2024
Rambus Inc.
Scott C. Best
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
Publication number
20240404866
Publication date
Dec 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
Publication number
20240395592
Publication date
Nov 28, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
Publication number
20240387419
Publication date
Nov 21, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Pawel Mrozek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
Publication number
20240387423
Publication date
Nov 21, 2024
NEXPERIA B.V.
Vasantha Kumar Vaddagere Nagaraju
H01 - BASIC ELECTRIC ELEMENTS