electrically connecting two or more layers of a stacked or rolled capacitor

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Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240145174
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Young Ghyu AHN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multilayer Capacitor

    • Publication number 20240145176
    • Publication date May 2, 2024
    • KYOCERA AVX Components Corporation
    • Marianne Berolini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CAPACITOR HAVING INTERNAL ELECTRODE WITH DOUBLE BOTTLENE...

    • Publication number 20240145167
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Ho Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING MU...

    • Publication number 20240145168
    • Publication date May 2, 2024
    • Murata Manufacturing Co., Ltd.
    • Daisuke HAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multilayer Capacitor

    • Publication number 20240145172
    • Publication date May 2, 2024
    • KYOCERA AVX Components Corporation
    • Marianne Berolini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multilayer Capacitor

    • Publication number 20240145169
    • Publication date May 2, 2024
    • KYOCERA AVX Components Corporation
    • Marianne Berolini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT

    • Publication number 20240145171
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Uk Cha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MULTILA...

    • Publication number 20240145173
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ji Hyeon LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240136122
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Satoshi YOKOMIZO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CERAMIC ELECTRONIC COMPONENT

    • Publication number 20240128022
    • Publication date Apr 18, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Woo Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240112860
    • Publication date Apr 4, 2024
    • TDK Corporation
    • Naoki HAYAKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240112863
    • Publication date Apr 4, 2024
    • TDK Corporation
    • Atsushi WATANABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYERED CAPACITOR

    • Publication number 20240112859
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyukjin Hong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20240105391
    • Publication date Mar 28, 2024
    • Murata Manufacturing Co., Ltd.
    • Keita KITAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240105386
    • Publication date Mar 28, 2024
    • Murata Manufacturing Co., Ltd.
    • Mitsuru IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240096524
    • Publication date Mar 21, 2024
    • Murata Manufacturing Co., Ltd.
    • Kojiro TOKIEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20240096554
    • Publication date Mar 21, 2024
    • Murata Manufacturing Co., Ltd.
    • Ryota ASO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUS CAPACITOR AND AUTOMOBILE

    • Publication number 20240096555
    • Publication date Mar 21, 2024
    • BYD COMPANY LIMITED
    • Bing HAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240096556
    • Publication date Mar 21, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuuta HOSHINO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20240096557
    • Publication date Mar 21, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sung Hyun CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT

    • Publication number 20240087812
    • Publication date Mar 14, 2024
    • TDK Corporation
    • Toshihiro IGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS

    • Publication number 20240087811
    • Publication date Mar 14, 2024
    • AmRad Manufacturing, LLC
    • Robert M. Stockman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20240087814
    • Publication date Mar 14, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuta KUROSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240079182
    • Publication date Mar 7, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Yoona Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR STRUCTURE AND SEMICONDUCTOR STRUCTURE

    • Publication number 20240071901
    • Publication date Feb 29, 2024
    • Powerchip Semiconductor Manufacturing Corporation
    • Wei-Yu Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT

    • Publication number 20240062966
    • Publication date Feb 22, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Yang-Seok PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR INTEGRATED STRUCTURE AND CAPACITOR UNIT

    • Publication number 20240062957
    • Publication date Feb 22, 2024
    • Powerchip Semiconductor Manufacturing Corporation
    • WEI-YU LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT

    • Publication number 20240062960
    • Publication date Feb 22, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Han KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR

    • Publication number 20240062965
    • Publication date Feb 22, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuji KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYERED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

    • Publication number 20240055188
    • Publication date Feb 15, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kyeongjun Kim
    • H01 - BASIC ELECTRIC ELEMENTS