Electrically programmable read-only memories and multistep manufacturing processes therefor

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H01L27/115

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/115Electrically programmable read-only memories and multistep manufacturing processes therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ephemeral storage elements, circuits, and systems
- Patent number 11,783,898
- Issue date Oct 10, 2023
- Jonker LLC
- John Nicholas Gross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-point memory array and related fabrication techniques
- Patent number 11,706,934
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and related methods of forming microelectro...
- Patent number 11,690,234
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,688,682
- Issue date Jun 27, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,682,677
- Issue date Jun 20, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input and digital output mechanisms for analog neural memory in a d...
- Patent number 11,683,933
- Issue date Jun 20, 2023
- Silicon Storage Technology, Inc.
- Hieu Van Tran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 11,682,581
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell including cell transistor including control gate and ch...
- Patent number 11,682,667
- Issue date Jun 20, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,682,736
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,683,934
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Young-Jin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and method of manufacturing the same
- Patent number 11,683,936
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including vertical stack structure and method of manu...
- Patent number 11,682,717
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Yumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wafer-to-wafer bonding structure and ma...
- Patent number 11,676,901
- Issue date Jun 13, 2023
- SK hynix Inc.
- Sung Lae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semiconductor chip hole geometry metrology
- Patent number 11,674,909
- Issue date Jun 13, 2023
- Yangtze Memory Technologies Co., Ltd.
- Le Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D flash memory with annular channel structure and array layout the...
- Patent number 11,678,486
- Issue date Jun 13, 2023
- MACRONIX INIERNATIONAL CO., LTD.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 11,678,485
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seok-Cheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory using SOI structures and methods
- Patent number 11,678,491
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,975
- Issue date Jun 13, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active protection circuits for semiconductor devices
- Patent number 11,676,917
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having stacked structures and method for manufact...
- Patent number 11,678,487
- Issue date Jun 13, 2023
- SK Hynix Inc.
- Ki Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,678,488
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of incorporating leaker devices into capacitor configuratio...
- Patent number 11,676,768
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Ashonita A. Chavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structures for capacitive sense NAND memory
- Patent number 11,678,482
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a staircase structure
- Patent number 11,678,481
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flash memory device including channel structures...
- Patent number 11,678,489
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, semiconductor device and manufacturing method of the...
- Patent number 11,678,492
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including ferroelectric layer
- Patent number 11,677,025
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Yunseong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,700
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Young-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,670,707
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240237338
- Publication date Jul 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Longxiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240234339
- Publication date Jul 11, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240237335
- Publication date Jul 11, 2024
- United Microelectronics Corp.
- Yu-Jen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234528
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Hitoshi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240215236
- Publication date Jun 27, 2024
- Yangtze Memory Technologies Co., Ltd.
- Beibei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240215238
- Publication date Jun 27, 2024
- Yangtze Memory Technologies Co., Ltd.
- Beibei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME
- Publication number 20240206164
- Publication date Jun 20, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, THREE-DIMENSIONAL MEMORY, MEMORY SYSTEM, A...
- Publication number 20240194606
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiajia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, MEMORY AND M...
- Publication number 20240194607
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qiangwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE CAPACITANCE FOR FERROELECTRIC CAPACITIVE MEMORY CELL
- Publication number 20240194236
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Takashi Ando
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240188292
- Publication date Jun 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Cuicui Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240179898
- Publication date May 30, 2024
- WINBOND ELECTRONICS CORP.
- Tzu-Yun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-volatile Memory Cell
- Publication number 20240179900
- Publication date May 30, 2024
- AMIC Technology Corporation
- Hsiao-Hua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240179903
- Publication date May 30, 2024
- WINBOND ELECTRONICS CORP.
- Frederick Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARCHITECTURE USING TRANSISTORS WITH DYNAMIC DUAL FUNCTIONAL...
- Publication number 20240172454
- Publication date May 23, 2024
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME
- Publication number 20240170389
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiajia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING SACRIFICIAL LAYERS OF A STACK OF A THREE-DIMENS...
- Publication number 20240172437
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, MEMORY AND M...
- Publication number 20240172446
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhaosong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BLOCK, MEMORY-CELL GROUP AND MEMORY DEVICE
- Publication number 20240172438
- Publication date May 23, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240170393
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20240164097
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jianquan JIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FERROELECTRIC FIELD EFFECT TRANSISTOR RANDOM ACCE...
- Publication number 20240164107
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240164112
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryo OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY, AND ME...
- Publication number 20240164095
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yonggang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240155843
- Publication date May 9, 2024
- UNITED MICROELECTRONICS CORP.
- Wang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES
- Publication number 20240147719
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240136305
- Publication date Apr 25, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136419
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Hitoshi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240138144
- Publication date Apr 25, 2024
- United Microelectronics Corp.
- Yu-Jen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240138148
- Publication date Apr 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Longxiang YAN
- H01 - BASIC ELECTRIC ELEMENTS

Electrically programmable read-only memories and multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ephemeral storage elements, circuits, and systems

Cross-point memory array and related fabrication techniques

Microelectronic devices and related methods of forming microelectro...

Semiconductor memory device and manufacturing method of the semicon...

Semiconductor device and method for manufacturing the same

Input and digital output mechanisms for analog neural memory in a d...

Memory device including self-aligned conductive contacts

Memory cell including cell transistor including control gate and ch...

Semiconductor device

Nonvolatile memory device and method for fabricating the same

Semiconductor memory structure and method of manufacturing the same

Memory device including vertical stack structure and method of manu...

Semiconductor device having wafer-to-wafer bonding structure and ma...

Systems and methods for semiconductor chip hole geometry metrology

3D flash memory with annular channel structure and array layout the...

Vertical memory devices

Embedded memory using SOI structures and methods

Semiconductor device

Semiconductor device

Active protection circuits for semiconductor devices

Electronic device having stacked structures and method for manufact...

Three-dimensional semiconductor memory device

Methods of incorporating leaker devices into capacitor configuratio...

Memory array structures for capacitive sense NAND memory

Methods of forming a staircase structure

Three-dimensional flash memory device including channel structures...

Memory device, semiconductor device and manufacturing method of the...

Electronic device including ferroelectric layer

Semiconductor device

Integrated assemblies and methods of forming integrated assemblies

Patents Applicationslast 30 patents

THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

FLASH MEMORY AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME

SEMICONDUCTOR STRUCTURE, THREE-DIMENSIONAL MEMORY, MEMORY SYSTEM, A...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, MEMORY AND M...

NEGATIVE CAPACITANCE FOR FERROELECTRIC CAPACITIVE MEMORY CELL

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

NON-VOLATILE MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME

Non-volatile Memory Cell

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

CIRCUIT ARCHITECTURE USING TRANSISTORS WITH DYNAMIC DUAL FUNCTIONAL...

THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME

METHOD FOR REMOVING SACRIFICIAL LAYERS OF A STACK OF A THREE-DIMENS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, MEMORY AND M...

MEMORY BLOCK, MEMORY-CELL GROUP AND MEMORY DEVICE

THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD

THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM

THREE-DIMENSIONAL FERROELECTRIC FIELD EFFECT TRANSISTOR RANDOM ACCE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY, AND ME...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

SEMICONDUCTOR DEVICE

FLASH MEMORY AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD