Electrically programmable read-only memories and multistep manufacturing processes therefor

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H01L27/115

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/115Electrically programmable read-only memories and multistep manufacturing processes therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ephemeral storage elements, circuits, and systems
- Patent number 11,783,898
- Issue date Oct 10, 2023
- Jonker LLC
- John Nicholas Gross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-point memory array and related fabrication techniques
- Patent number 11,706,934
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and related methods of forming microelectro...
- Patent number 11,690,234
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,688,682
- Issue date Jun 27, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,682,677
- Issue date Jun 20, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 11,682,581
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input and digital output mechanisms for analog neural memory in a d...
- Patent number 11,683,933
- Issue date Jun 20, 2023
- Silicon Storage Technology, Inc.
- Hieu Van Tran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory cell including cell transistor including control gate and ch...
- Patent number 11,682,667
- Issue date Jun 20, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,682,736
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,683,934
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Young-Jin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and method of manufacturing the same
- Patent number 11,683,936
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including vertical stack structure and method of manu...
- Patent number 11,682,717
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Yumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wafer-to-wafer bonding structure and ma...
- Patent number 11,676,901
- Issue date Jun 13, 2023
- SK hynix Inc.
- Sung Lae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semiconductor chip hole geometry metrology
- Patent number 11,674,909
- Issue date Jun 13, 2023
- Yangtze Memory Technologies Co., Ltd.
- Le Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D flash memory with annular channel structure and array layout the...
- Patent number 11,678,486
- Issue date Jun 13, 2023
- MACRONIX INIERNATIONAL CO., LTD.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 11,678,485
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seok-Cheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory using SOI structures and methods
- Patent number 11,678,491
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having stacked structures and method for manufact...
- Patent number 11,678,487
- Issue date Jun 13, 2023
- SK Hynix Inc.
- Ki Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,678,488
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active protection circuits for semiconductor devices
- Patent number 11,676,917
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,975
- Issue date Jun 13, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structures for capacitive sense NAND memory
- Patent number 11,678,482
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of incorporating leaker devices into capacitor configuratio...
- Patent number 11,676,768
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Ashonita A. Chavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a staircase structure
- Patent number 11,678,481
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flash memory device including channel structures...
- Patent number 11,678,489
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, semiconductor device and manufacturing method of the...
- Patent number 11,678,492
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including ferroelectric layer
- Patent number 11,677,025
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Yunseong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including separated epitaxial layers
- Patent number 11,672,121
- Issue date Jun 6, 2023
- Renesas Electronics Corporation
- Tadashi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including at least one channel post wit...
- Patent number 11,672,122
- Issue date Jun 6, 2023
- SK hynix Inc.
- Sung Wook Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20240164097
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jianquan JIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FERROELECTRIC FIELD EFFECT TRANSISTOR RANDOM ACCE...
- Publication number 20240164107
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240164112
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryo OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY, AND ME...
- Publication number 20240164095
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yonggang YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240155843
- Publication date May 9, 2024
- UNITED MICROELECTRONICS CORP.
- Wang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES
- Publication number 20240147719
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240136305
- Publication date Apr 25, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136419
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Hitoshi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240138144
- Publication date Apr 25, 2024
- United Microelectronics Corp.
- Yu-Jen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240138148
- Publication date Apr 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Longxiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130129
- Publication date Apr 18, 2024
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METH...
- Publication number 20240130121
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130130
- Publication date Apr 18, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS
- Publication number 20240130128
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Yongjun Hu
- G11 - INFORMATION STORAGE
Information Patent Application
CIRCUITS HAVING ENHANCED ELECTRICAL ISOLATION
- Publication number 20240120371
- Publication date Apr 11, 2024
- ALLEGRO MICROSYSTEMS, LLC
- James McClay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATE FERROELECTRIC-RAM WITH STACKED CAPACITORS
- Publication number 20240121966
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240121954
- Publication date Apr 11, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...
- Publication number 20240114693
- Publication date Apr 4, 2024
- Intel Corporation
- Christopher M. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-...
- Publication number 20240112714
- Publication date Apr 4, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240114683
- Publication date Apr 4, 2024
- WINBOND ELECTRONICS CORP.
- Tsung-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITORS WITH 3D NON-VOLATILE ARRAY
- Publication number 20240114685
- Publication date Apr 4, 2024
- Western Digital Technologies, Inc.
- Liang Li
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240114688
- Publication date Apr 4, 2024
- United Microelectronics Corp.
- Chia-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENDURANCE SUPER-LATTICE ANTI-FERROELECTRIC CAPACITORS
- Publication number 20240114695
- Publication date Apr 4, 2024
- Intel Corporation
- Sou-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECT...
- Publication number 20240114697
- Publication date Apr 4, 2024
- Intel Corporation
- Shriram SHIVARAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS
- Publication number 20240114692
- Publication date Apr 4, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE
Information Patent Application
IMPROVED REPLACEMENT ELECTRODE PROCESS FOR 3D FERROELECTRIC MEMORY
- Publication number 20240114696
- Publication date Apr 4, 2024
- Intel Corporation
- Christopher Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240113012
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC CAPACITOR WITHIN BACKSIDE INTERCONNECT
- Publication number 20240114694
- Publication date Apr 4, 2024
- Intel Corporation
- Sourav Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...
- Publication number 20240107758
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OXIDE-NITRIDE-OXIDE STACK OF NON-VOLATILE MEMORY...
- Publication number 20240107771
- Publication date Mar 28, 2024
- Infineon Technologies LLC
- Michael ALLEN
- H01 - BASIC ELECTRIC ELEMENTS

Electrically programmable read-only memories and multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ephemeral storage elements, circuits, and systems

Cross-point memory array and related fabrication techniques

Microelectronic devices and related methods of forming microelectro...

Semiconductor memory device and manufacturing method of the semicon...

Semiconductor device and method for manufacturing the same

Memory device including self-aligned conductive contacts

Input and digital output mechanisms for analog neural memory in a d...

Memory cell including cell transistor including control gate and ch...

Semiconductor device

Nonvolatile memory device and method for fabricating the same

Semiconductor memory structure and method of manufacturing the same

Memory device including vertical stack structure and method of manu...

Semiconductor device having wafer-to-wafer bonding structure and ma...

Systems and methods for semiconductor chip hole geometry metrology

3D flash memory with annular channel structure and array layout the...

Semiconductor device

Vertical memory devices

Embedded memory using SOI structures and methods

Electronic device having stacked structures and method for manufact...

Three-dimensional semiconductor memory device

Active protection circuits for semiconductor devices

Semiconductor device

Memory array structures for capacitive sense NAND memory

Methods of incorporating leaker devices into capacitor configuratio...

Methods of forming a staircase structure

Three-dimensional flash memory device including channel structures...

Memory device, semiconductor device and manufacturing method of the...

Electronic device including ferroelectric layer

Semiconductor memory device including separated epitaxial layers

Semiconductor memory device including at least one channel post wit...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM

THREE-DIMENSIONAL FERROELECTRIC FIELD EFFECT TRANSISTOR RANDOM ACCE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY, AND ME...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

SEMICONDUCTOR DEVICE

FLASH MEMORY AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD

THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...

MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METH...

THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...

SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS

CIRCUITS HAVING ENHANCED ELECTRICAL ISOLATION

MULTI-STATE FERROELECTRIC-RAM WITH STACKED CAPACITORS

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...

SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-...

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

CONFIGURABLE CAPACITORS WITH 3D NON-VOLATILE ARRAY

MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF

HIGH ENDURANCE SUPER-LATTICE ANTI-FERROELECTRIC CAPACITORS

GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECT...

INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS

IMPROVED REPLACEMENT ELECTRODE PROCESS FOR 3D FERROELECTRIC MEMORY

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

FERROELECTRIC CAPACITOR WITHIN BACKSIDE INTERCONNECT

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...

METHOD OF FORMING OXIDE-NITRIDE-OXIDE STACK OF NON-VOLATILE MEMORY...