Electrodes

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CPC
H01L28/60

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Current Industry

H01L28/60Electrodes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Capacitors with built-in electric fields
- Patent number 12,224,309
- Issue date Feb 11, 2025
- Intel Corporation
- Sou-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-on-chip with ferroelectric random access memory and tunable...
- Patent number 12,225,733
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,217,913
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,218,108
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via plug resistor
- Patent number 12,218,042
- Issue date Feb 4, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 12,211,838
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,952
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Gihee Cho
- G11 - INFORMATION STORAGE
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Regina Tien Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation processing with local oxidation of silicon
- Patent number 12,199,091
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Robert Martin Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 12,199,137
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jinho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in digitally tuning a capacitor in an...
- Patent number 12,199,599
- Issue date Jan 14, 2025
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable graduated capacitor structure and methods for forming the...
- Patent number 12,191,247
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitor
- Patent number 12,191,347
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- Yao-Chun Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric structure including a ferroelectric film having a fir...
- Patent number 12,176,413
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures pertaining to improved ferroelectric random-a...
- Patent number 12,171,104
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cerium-doped ferroelectric materials and related devices and methods
- Patent number 12,166,098
- Issue date Dec 10, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Paul C. McIntyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including ferroelectric materials
- Patent number 12,167,610
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Qian Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film laminate structure, integrated device including the same,...
- Patent number 12,166,066
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kiyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication stack for high integration density superconducting digi...
- Patent number 12,156,484
- Issue date Nov 26, 2024
- Trading Technologies International, Inc.
- Anna Yurievna Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and manufacturing method thereof, and memory
- Patent number 12,148,790
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yin Kuei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of capacitors, array of memory cells, methods of forming an a...
- Patent number 12,150,312
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Sameer Chhajed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and display device
- Patent number 12,148,842
- Issue date Nov 19, 2024
- Japan Display Inc.
- Masataka Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric memory device and method of manufacturing the same
- Patent number 12,137,572
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multinary bit cells for memory devices and network applications and...
- Patent number 12,136,457
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Katherine H. Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pumping capacitor and semiconductor memory device including the same
- Patent number 12,133,372
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Yooseok Yang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250056819
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20250048646
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...
- Publication number 20250046702
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250040158
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME
- Publication number 20250040159
- Publication date Jan 30, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF MIM CAPACITOR AND HEAT SINK
- Publication number 20250038103
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...
- Publication number 20250031393
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE GATE DRIVER INTEGRATED CIRCUIT USING GALVANIC ISOLATOR
- Publication number 20250015077
- Publication date Jan 9, 2025
- WELLANG CO., LTD.
- Jong Tae HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND ELECTRONIC DEVICE WITH THE CAPACITOR MOUNTED THEREON
- Publication number 20250014825
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC CAPACITOR WITH INSULATING THIN FILM
- Publication number 20250006434
- Publication date Jan 2, 2025
- Intel Corporation
- Chia-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN HAFNIUM-ZIRCONIUM OXIDE FILMS HAVING LARGE GRAIN SIZE FOR FERR...
- Publication number 20250006433
- Publication date Jan 2, 2025
- Intel Corporation
- Sarah Atanasov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE
- Publication number 20250006779
- Publication date Jan 2, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20250006778
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Haeryong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF, INTEGRATED CIR...
- Publication number 20250006833
- Publication date Jan 2, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Runtao Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR...
- Publication number 20240429233
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Naveen Tipirneni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240429267
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jeongil BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR
- Publication number 20240420889
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Sota YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED POLAR LAYERS AND SEMICONDUCTOR DEVICE INCORPORATING SAME
- Publication number 20240421229
- Publication date Dec 19, 2024
- Kepler Computing Inc.
- Ramesh Ramamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE
- Publication number 20240413192
- Publication date Dec 12, 2024
- NXP B.V.
- Paul Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240407214
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-SILICIDE CAPACITORS
- Publication number 20240395694
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kaochao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395696
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395695
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferroelectric Device and Methods of Fabrication Thereof
- Publication number 20240397730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FABRICATION OF PCM-BASED CAPACITOR BANK
- Publication number 20240397840
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240387608
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitors with built-in electric fields

System-on-chip with ferroelectric random access memory and tunable...

Chip parts

Package and manufacturing method thereof

Via plug resistor

Device including MIM capacitor and resistor

Semiconductor device

Method to create MIMcap designs across changing MIMcap structures

Shallow trench isolation processing with local oxidation of silicon

Integrated circuit devices and methods of manufacturing the same

Method and apparatus for use in digitally tuning a capacitor in an...

Variable graduated capacitor structure and methods for forming the...

High density metal insulator metal capacitor

Semiconductor package with dummy MIM capacitor die

Configurable metal—insulator—metal capacitor and devices

Ferroelectric structure including a ferroelectric film having a fir...

Method and structures pertaining to improved ferroelectric random-a...

Embedded metal insulator metal structure

Cerium-doped ferroelectric materials and related devices and methods

Semiconductor devices including ferroelectric materials

Thin film laminate structure, integrated device including the same,...

Fabrication stack for high integration density superconducting digi...

Capacitor structure and manufacturing method thereof, and memory

Array of capacitors, array of memory cells, methods of forming an a...

Semiconductor substrate and display device

Method of fabricating pedestal based memory devices using pocket in...

Through electrode substrate and semiconductor device

Ferroelectric memory device and method of manufacturing the same

Multinary bit cells for memory devices and network applications and...

Pumping capacitor and semiconductor memory device including the same

Patents Applicationslast 30 patents

CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM

SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...

MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME

STRUCTURE OF MIM CAPACITOR AND HEAT SINK

DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...

HIGH-VOLTAGE GATE DRIVER INTEGRATED CIRCUIT USING GALVANIC ISOLATOR

CAPACITOR AND ELECTRONIC DEVICE WITH THE CAPACITOR MOUNTED THEREON

FERROELECTRIC CAPACITOR WITH INSULATING THIN FILM

THIN HAFNIUM-ZIRCONIUM OXIDE FILMS HAVING LARGE GRAIN SIZE FOR FERR...

CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF, INTEGRATED CIR...

FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR...

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR

MIM Capacitor in IC Heterogenous Integration

DOPED POLAR LAYERS AND SEMICONDUCTOR DEVICE INCORPORATING SAME

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

ISOLATION STRUCTURE

DISPLAY DEVICE

METAL-INSULATOR-SILICIDE CAPACITORS

METAL INSULATOR METAL (MIM) CAPACITOR

METAL INSULATOR METAL (MIM) CAPACITOR

DOUBLE-SIDED STACKED DTC STRUCTURE

Ferroelectric Device and Methods of Fabrication Thereof

STRUCTURE AND FABRICATION OF PCM-BASED CAPACITOR BANK

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...