Electrodes

Industry

CPC
H01J37/32532

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32532Electrodes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus and method for releasing sample
- Patent number 12,148,633
- Issue date Nov 19, 2024
- HITACHI HIGH-TECH CORPORATION
- Masaki Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric plasma source to generate pie-shaped treatment
- Patent number 12,142,458
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma generating apparatus, plasma processing apparatus, and plasm...
- Patent number 12,131,889
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Takeshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate treating method
- Patent number 12,125,682
- Issue date Oct 22, 2024
- Semes Co., Ltd.
- Shant Arakelyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening automation apparatus for upper electrode
- Patent number 12,119,210
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Joohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,112,925
- Issue date Oct 8, 2024
- HITACHI HIGH-TECH CORPORATION
- Masaki Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition apparatus and method with EM radiation
- Patent number 12,110,587
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tze-Liang Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, plurality of electrodes and method...
- Patent number 12,094,735
- Issue date Sep 17, 2024
- Kokusai Electric Corporation
- Tsuyoshi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,094,690
- Issue date Sep 17, 2024
- Tokyo Electron Limited
- Koki Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for indirect atmospheric pressure plasma processing
- Patent number 12,080,525
- Issue date Sep 3, 2024
- Vito N.V.
- Annick Vanhulsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density plasma enhanced process chamber
- Patent number 12,080,516
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Zheng John Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor substrate bevel cleaning
- Patent number 12,068,152
- Issue date Aug 20, 2024
- Lam Research Corporation
- Saravanapriyan Sriraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,062,522
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Keiji Kitagaito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sample preparation system and method for electron microscope observ...
- Patent number 11,990,314
- Issue date May 21, 2024
- SANYU ELECTRON CO., LTD.
- Shinsuke Shibata
- G01 - MEASURING TESTING
Information Patent Grant
Plasma processing apparatus
- Patent number 11,984,300
- Issue date May 14, 2024
- Tokyo Electron Limited
- Takehiro Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 11,961,718
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Shojiro Yahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-controlled chemical processing reactor
- Patent number 11,923,176
- Issue date Mar 5, 2024
- LytEn, Inc.
- Michael W. Stowell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support unit and substrate treating apparatus including the same
- Patent number 11,915,905
- Issue date Feb 27, 2024
- Semes Co., Ltd.
- Hyoungkyu Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and systems useful for producing aluminum ions
- Patent number 11,881,376
- Issue date Jan 23, 2024
- Entegris, Inc.
- Ying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of processing a substrate
- Patent number 11,837,496
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Jong Woo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control system for plasma chamber having controllable valve
- Patent number 11,821,089
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Shuo Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck for use in semiconductor processing
- Patent number 11,817,341
- Issue date Nov 14, 2023
- Lam Research Corporation
- Troy Alan Gomm
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of processing a substrate
- Patent number 11,791,194
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jong Woo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seal for lower electrode assembly
- Patent number 11,781,650
- Issue date Oct 10, 2023
- Lam Research Corporation
- David Schaefer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field emission device and field emission method
- Patent number 11,776,785
- Issue date Oct 3, 2023
- Meidensha Corporation
- Hayato Ochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, electrostatic attraction method, and e...
- Patent number 11,764,038
- Issue date Sep 19, 2023
- Tokyo Electron Limited
- Shoichiro Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 11,756,808
- Issue date Sep 12, 2023
- Tokyo Electron Limited
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing table and plasma processing apparatus
- Patent number 11,743,973
- Issue date Aug 29, 2023
- Tokyo Electron Limited
- Dai Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method and plasma processing apparatus
- Patent number 11,742,181
- Issue date Aug 29, 2023
- Tokyo Electron Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method and plasma processing apparatus
- Patent number 11,742,182
- Issue date Aug 29, 2023
- Tokyo Electron Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEPOSITION APPARATUS AND METHOD WITH EM RADIATION
- Publication number 20240384409
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tze-Liang Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA SOURCE
- Publication number 20240331980
- Publication date Oct 3, 2024
- NISSIN ION EQUIPMENT CO., LTD.
- Honoka WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEMS USEFUL FOR PRODUCING ALUMINUM IONS
- Publication number 20240136145
- Publication date Apr 25, 2024
- Entegris, Inc.
- Ying TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND RF SYSTEM
- Publication number 20240087846
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Toshiharu WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY
- Publication number 20240077138
- Publication date Mar 7, 2024
- LAM RESEARCH CORPORATION
- David SCHAEFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDI...
- Publication number 20240038492
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- HYUNGJOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240038505
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Donghyeon Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK FOR USE IN SEMICONDUCTOR PROCESSING
- Publication number 20240038568
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Troy Alan Gomm
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRODE STRUCTURE, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANU...
- Publication number 20240006164
- Publication date Jan 4, 2024
- Kokusai Electric Corporation
- Tsuyoshi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Equipment and Method for Improved Edge Uniformity of Plasma Process...
- Publication number 20230402255
- Publication date Dec 14, 2023
- TOKYO ELECTRON LIMITED
- Barton Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Apparatus and Method with EM Radiation
- Publication number 20230383403
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Tze-Liang Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROL METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230377843
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Chishio KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230343647
- Publication date Oct 26, 2023
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA TREATMENT APPARATUS, PLASMA TREATMENT METHOD, AND ORIGINAL P...
- Publication number 20230290619
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Takeharu MOTOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA POTENTIAL MEASURING DEVICE AND MEASURING METHOD
- Publication number 20230282463
- Publication date Sep 7, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroshi SHIROUZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20230282453
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- HAKYOUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE, AND MEMBER FOR SEMICONDUCTOR MANUFACTURING A...
- Publication number 20230238258
- Publication date Jul 27, 2023
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20230238219
- Publication date Jul 27, 2023
- TOKYO ELECTRON LIMITED
- Eiki KAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...
- Publication number 20230215698
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Inhwa Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EMISSION DEVICE AND FIELD EMISSION METHOD
- Publication number 20230197394
- Publication date Jun 22, 2023
- MEIDENSHA CORPORATION
- Hayato OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PLASMA ENHANCED PROCESS CHAMBER
- Publication number 20230162947
- Publication date May 25, 2023
- Applied Materials, Inc.
- Zheng John YE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHOWER HEAD ELECTRODE ASSEMBLY AND PLASMA PROCESSING APPARATUS
- Publication number 20230158517
- Publication date May 25, 2023
- TOKYO ELECTRON LIMITED
- Ryosuke KUMAGAI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20230160061
- Publication date May 25, 2023
- SEMES CO., LTD.
- Ban Seok YOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Deposition Apparatus and Method
- Publication number 20230151489
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tze-Liang Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20230143049
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Seunghan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA EDGE RING, PLASMA ETCHING APPARATUS INCLUDING THE SAME, AND...
- Publication number 20230142436
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Hyunjoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZING REFLECTED POWER IN A TUNABLE EDGE SHEATH SYSTEM
- Publication number 20230102487
- Publication date Mar 30, 2023
- LAM RESEARCH CORPORATION
- David Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND ETCHING METHOD
- Publication number 20230091584
- Publication date Mar 23, 2023
- TOKYO ELECTRON LIMITED
- Natsumi TORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230077330
- Publication date Mar 16, 2023
- JUSUNG ENGINEERING CO., LTD.
- ChulJoo HWANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC EDGE RING MOUNTING SYSTEM FOR SUBSTRATE PROCESSING
- Publication number 20230075462
- Publication date Mar 9, 2023
- LAM RESEARCH CORPORATION
- Alexander MATYUSHKIN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma processing apparatus and method for releasing sample

Symmetric plasma source to generate pie-shaped treatment

Plasma generating apparatus, plasma processing apparatus, and plasm...

Substrate treating apparatus and substrate treating method

Fastening automation apparatus for upper electrode

Plasma processing apparatus

Deposition apparatus and method with EM radiation

Substrate processing apparatus, plurality of electrodes and method...

Plasma processing apparatus

Apparatus for indirect atmospheric pressure plasma processing

High density plasma enhanced process chamber

Semiconductor substrate bevel cleaning

Plasma etching method and plasma etching apparatus

Sample preparation system and method for electron microscope observ...

Plasma processing apparatus

Plasma processing method and plasma processing apparatus

Temperature-controlled chemical processing reactor

Support unit and substrate treating apparatus including the same

Method and systems useful for producing aluminum ions

Substrate processing apparatus and method of processing a substrate

Control system for plasma chamber having controllable valve

Electrostatic chuck for use in semiconductor processing

Substrate processing apparatus and method of processing a substrate

Edge seal for lower electrode assembly

Field emission device and field emission method

Plasma processing apparatus, electrostatic attraction method, and e...

Plasma processing apparatus

Placing table and plasma processing apparatus

Control method and plasma processing apparatus

Control method and plasma processing apparatus

Patents Applicationslast 30 patents

DEPOSITION APPARATUS AND METHOD WITH EM RADIATION

PLASMA SOURCE

METHOD AND SYSTEMS USEFUL FOR PRODUCING ALUMINUM IONS

PLASMA PROCESSING APPARATUS AND RF SYSTEM

EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY

SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDI...

PLASMA PROCESSING APPARATUS

ELECTROSTATIC CHUCK FOR USE IN SEMICONDUCTOR PROCESSING

ELECTRODE STRUCTURE, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANU...

Equipment and Method for Improved Edge Uniformity of Plasma Process...

Deposition Apparatus and Method with EM Radiation

CONTROL METHOD AND PLASMA PROCESSING APPARATUS

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

PLASMA TREATMENT APPARATUS, PLASMA TREATMENT METHOD, AND ORIGINAL P...

PLASMA POTENTIAL MEASURING DEVICE AND MEASURING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

WAFER PLACEMENT TABLE, AND MEMBER FOR SEMICONDUCTOR MANUFACTURING A...

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...

FIELD EMISSION DEVICE AND FIELD EMISSION METHOD

HIGH DENSITY PLASMA ENHANCED PROCESS CHAMBER

SHOWER HEAD ELECTRODE ASSEMBLY AND PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

Deposition Apparatus and Method

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

PLASMA EDGE RING, PLASMA ETCHING APPARATUS INCLUDING THE SAME, AND...

MINIMIZING REFLECTED POWER IN A TUNABLE EDGE SHEATH SYSTEM

PLASMA PROCESSING APPARATUS AND ETCHING METHOD

SUBSTRATE PROCESSING APPARATUS

ELECTROSTATIC EDGE RING MOUNTING SYSTEM FOR SUBSTRATE PROCESSING