Electroless sublayer

Industry

CPC
H05K2201/0344

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0344Electroless sublayer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,729,912
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Kosuke Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive fabric and its preparation and applications
- Patent number 11,546,974
- Issue date Jan 3, 2023
- Formosa Taffeta Co., Ltd.
- Fang-Jong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass wiring board
- Patent number 11,516,907
- Issue date Nov 29, 2022
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plated laminate and printed circuit board
- Patent number 11,499,233
- Issue date Nov 15, 2022
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board
- Patent number 11,122,679
- Issue date Sep 14, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 10,952,321
- Issue date Mar 16, 2021
- Sumitomo Electric Industries, Ltd.
- Kenji Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit surface finish, method of use, and assemblies made...
- Patent number 10,902,967
- Issue date Jan 26, 2021
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 10,609,819
- Issue date Mar 31, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit surface finish, method of use, and assemblies made...
- Patent number 10,566,103
- Issue date Feb 18, 2020
- Kunal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for copper filling of a hole in a component carrier
- Patent number 10,455,704
- Issue date Oct 22, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ares Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,980,371
- Issue date May 22, 2018
- Ibiden Co., Ltd.
- Takayuki Katsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 9,699,906
- Issue date Jul 4, 2017
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate comprising surface interconnect and cavity compri...
- Patent number 9,609,751
- Issue date Mar 28, 2017
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 9,591,753
- Issue date Mar 7, 2017
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device housing package
- Patent number 9,408,307
- Issue date Aug 2, 2016
- Kyocera Corporation
- Mahiro Tsujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,320,153
- Issue date Apr 19, 2016
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film multi-layer micro-wire structure
- Patent number 9,288,901
- Issue date Mar 15, 2016
- Eastman Kodak Company
- Roger G. Markham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board with built-in electronic component and meth...
- Patent number 9,282,635
- Issue date Mar 8, 2016
- Ibiden Co., Ltd.
- Toyotaka Shimabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film based electromagnetic interference shielding with BBUL/co...
- Patent number 9,232,686
- Issue date Jan 5, 2016
- Intel Corporation
- Digvijay A. Raorane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for metallization and reinforcement of glass subs...
- Patent number 9,184,135
- Issue date Nov 10, 2015
- TRINTON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under ball metallurgy (UBM) for improved electromigration
- Patent number 9,142,501
- Issue date Sep 22, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct plating method and solution for palladium conductor layer fo...
- Patent number 8,992,756
- Issue date Mar 31, 2015
- C. Uyemura & Co., Ltd.
- Hisamitsu Yamamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,410,376
- Issue date Apr 2, 2013
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal clad laminate and method for manufacturing metal clad laminate
- Patent number 8,147,904
- Issue date Apr 3, 2012
- Furukawa Electric Co., Ltd.
- Satoru Zama
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 8,065,794
- Issue date Nov 29, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating process of electroplating an elecrically conductive...
- Patent number 7,827,680
- Issue date Nov 9, 2010
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and its manufacturing method
- Patent number 7,691,189
- Issue date Apr 6, 2010
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polyimide substrate and method of manufacturing printed wiring boar...
- Patent number 7,666,471
- Issue date Feb 23, 2010
- Mark Wojtaszek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing interconnect substrate
- Patent number 7,488,678
- Issue date Feb 10, 2009
- Seiko Epson Corporation
- Satoshi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240292533
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...
- Publication number 20240114630
- Publication date Apr 4, 2024
- Meta Platforms Technologies, LLC
- Cameron Elliot Glasscock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
- Publication number 20220377882
- Publication date Nov 24, 2022
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Louis Diamond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210212198
- Publication date Jul 8, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS WIRING BOARD
- Publication number 20210144847
- Publication date May 13, 2021
- Toppan Printing Co.,Ltd.
- Tetsuyuki TSUCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210127487
- Publication date Apr 29, 2021
- Sumitomo Electric Industries, Ltd.
- Kenichiro AIKAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED LAMINATE AND PRINTED CIRCUIT BOARD
- Publication number 20210017650
- Publication date Jan 21, 2021
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200107443
- Publication date Apr 2, 2020
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...
- Publication number 20170303401
- Publication date Oct 19, 2017
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20170013710
- Publication date Jan 12, 2017
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20150313009
- Publication date Oct 29, 2015
- ROGER G. MARKHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRI...
- Publication number 20150296616
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Houssam Wafic Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METH...
- Publication number 20150282305
- Publication date Oct 1, 2015
- IBIDEN CO., LTD.
- Toyotaka SHIMABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...
- Publication number 20150282395
- Publication date Oct 1, 2015
- Digvijay A. RAORANE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WATERMARKED CONDUCTIVE PATTERN
- Publication number 20150237720
- Publication date Aug 20, 2015
- Uni-Pixel Displays, Inc.
- Daniel Van Ostrand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...
- Publication number 20150181710
- Publication date Jun 25, 2015
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFAC...
- Publication number 20150163919
- Publication date Jun 11, 2015
- IBIDEN CO., LTD.
- Hisayuki NAKAGOME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150163901
- Publication date Jun 11, 2015
- IBIDEN CO., LTD.
- Hiroyuki NISHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150075851
- Publication date Mar 19, 2015
- IBIDEN CO., LTD.
- Masahiro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150068791
- Publication date Mar 12, 2015
- IBIDEN CO., LTD.
- Takenobu NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE HOUSING PACKAGE
- Publication number 20150016074
- Publication date Jan 15, 2015
- KYOCERA CORPORATION
- Mahiro Tsujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140339699
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GOLD THIN FILM AND PRINTED CIRCUIT BOARD
- Publication number 20140076618
- Publication date Mar 20, 2014
- Research & Business Foundation Sungkyunkwan University
- Seong Min CHO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140014521
- Publication date Jan 16, 2014
- Arakawa Chemical Industries, Ltd.
- Akihisa HAMAZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130164440
- Publication date Jun 27, 2013
- IBIDEN CO., LTD.
- Masahiro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CLAD LAMINATE AND METHOD FOR PRODUCTION OF METAL-CLAD LAMINATE
- Publication number 20120088120
- Publication date Apr 12, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Kimiko Fujisawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20120037405
- Publication date Feb 16, 2012
- ARAKAWA CHEMICAL INDUSTRIES, LTD.
- Akihisa Hamazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Electroless sublayer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer wiring board and method of producing the same

Wiring substrate and method for manufacturing wiring substrate

Conductive fabric and its preparation and applications

Glass wiring board

Plated laminate and printed circuit board

Printed circuit board

Printed circuit board

Printed circuit surface finish, method of use, and assemblies made...

Hybrid printed circuit assembly with low density main core and embe...

Printed circuit surface finish, method of use, and assemblies made...

Method for copper filling of a hole in a component carrier

Printed wiring board

Hybrid printed circuit assembly with low density main core and embe...

Package substrate comprising surface interconnect and cavity compri...

Circuit board and manufacturing method thereof

Device housing package

Printed wiring board and method for manufacturing the same

Thin-film multi-layer micro-wire structure

Multilayer wiring board with built-in electronic component and meth...

Thin film based electromagnetic interference shielding with BBUL/co...

System and method for metallization and reinforcement of glass subs...

Under ball metallurgy (UBM) for improved electromigration

Direct plating method and solution for palladium conductor layer fo...

Printed wiring board and method for manufacturing the same

Metal clad laminate and method for manufacturing metal clad laminate

Printed wiring board and its manufacturing method

Electroplating process of electroplating an elecrically conductive...

Printed wiring board and its manufacturing method

Polyimide substrate and method of manufacturing printed wiring boar...

Method of manufacturing interconnect substrate

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

WIRING BOARD

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORM...

TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD

GLASS WIRING BOARD

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

PLATED LAMINATE AND PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

THIN-FILM MULTI-LAYER MICRO-WIRE STRUCTURE

PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRI...

MULTILAYER WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METH...

THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...

WATERMARKED CONDUCTIVE PATTERN

HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...

SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFAC...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

DEVICE HOUSING PACKAGE

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

METHOD OF FORMING GOLD THIN FILM AND PRINTED CIRCUIT BOARD

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METAL-CLAD LAMINATE AND METHOD FOR PRODUCTION OF METAL-CLAD LAMINATE

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME