Electromigration resistant metallization

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CPC
Y10S438/927

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

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Y10S438/927Electromigration resistant metallization

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,443,776
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,287,186
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of exposing conductive vias of semiconductor devices and as...
- Patent number 9,034,752
- Issue date May 19, 2015
- Micron Technology, Inc.
- Hongqi Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-forming, self-aligned barriers for back-end interconnects and...
- Patent number 8,461,683
- Issue date Jun 11, 2013
- Intel Corporation
- Hui Jae Yoo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solid state imaging device having wirings with diffusion prevention...
- Patent number 8,211,740
- Issue date Jul 3, 2012
- Sony Corporation
- Ikuhiro Yamamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dual liner capping layer interconnect structure
- Patent number 7,772,119
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, solid-state imaging apparatus and metho...
- Patent number 7,759,712
- Issue date Jul 20, 2010
- Sony Corporation
- Ikuhiro Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Addressable hierarchical metal wire test methodology
- Patent number 7,749,778
- Issue date Jul 6, 2010
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Dual liner capping layer interconnect structure
- Patent number 7,709,960
- Issue date May 4, 2010
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual liner capping layer interconnect structure and method
- Patent number 7,576,003
- Issue date Aug 18, 2009
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gating grid and method of manufacture
- Patent number 7,569,835
- Issue date Aug 4, 2009
- Stillwater Scientific Instruments
- Brian G. Frederick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,508,082
- Issue date Mar 24, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for determining thermal cycle reliability
- Patent number 7,388,224
- Issue date Jun 17, 2008
- International Business Machines Corporation
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,327,031
- Issue date Feb 5, 2008
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wiring layer of damascene structure a...
- Patent number 7,235,882
- Issue date Jun 26, 2007
- Kabushiki Kaisha Toshiba
- Hiroyuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross diffusion barrier layer in polysilicon
- Patent number 7,214,613
- Issue date May 8, 2007
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, solid-state imaging apparatus and metho...
- Patent number 7,196,365
- Issue date Mar 27, 2007
- Sony Corporation
- Ikuhiro Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross diffusion barrier layer in polysilicon
- Patent number 7,166,896
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wiring layer of damascene structure a...
- Patent number 7,163,894
- Issue date Jan 16, 2007
- Kabushiki Kaisha Toshiba
- Hiroyuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite tantalum nitride/tantalum copper capping layer
- Patent number 7,157,795
- Issue date Jan 2, 2007
- Advanced Micro Devices, Inc.
- Darrell M. Erb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 7,098,054
- Issue date Aug 29, 2006
- International Business Machines Corporation
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film transistor having copper alloy wire and method of manufac...
- Patent number 7,052,993
- Issue date May 30, 2006
- LG.Philips LCD Co., Ltd.
- Jae Gab Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wiring layer of damascene structure a...
- Patent number 6,906,419
- Issue date Jun 14, 2005
- Kabushiki Kaisha Toshiba
- Hiroyuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming multilayered conductive layers for semiconductor...
- Patent number 6,777,328
- Issue date Aug 17, 2004
- Oki Electric Industry Co., Ltd.
- Tetsuo Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,750,108
- Issue date Jun 15, 2004
- Sharp Kabushiki Kaisha
- Takashi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor having a copper alloy wire
- Patent number 6,686,661
- Issue date Feb 3, 2004
- LG.Philips LCD Co., Ltd.
- Jae Gab Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a seed layer with annealed region for integ...
- Patent number 6,649,511
- Issue date Nov 18, 2003
- Advanced Micro Devices, Inc.
- Krishnashree Achuthan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of membrane properties to reduce residual stress in an interlay...
- Patent number 6,614,065
- Issue date Sep 2, 2003
- Intel Corporation
- Dawai Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of membrane properties to reduce residual stress in an interlay...
- Patent number 6,596,614
- Issue date Jul 22, 2003
- Intel Corporation
- Dawei Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Via formation in integrated circuit interconnects
- Patent number 6,531,780
- Issue date Mar 11, 2003
- Advanced Micro Devices, Inc.
- Christy Mei-Chu Woo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...
- Publication number 20210183697
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Hongqi Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND AS...
- Publication number 20140183740
- Publication date Jul 3, 2014
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20130260553
- Publication date Oct 3, 2013
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20120248608
- Publication date Oct 4, 2012
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND METHO...
- Publication number 20100136738
- Publication date Jun 3, 2010
- SONY CORPORATION
- Ikuhiro Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE
- Publication number 20080290519
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE
- Publication number 20080293257
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
- Publication number 20080224135
- Publication date Sep 18, 2008
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDRESSABLE HIERARCHICAL METAL WIRE TEST METHODOLOGY
- Publication number 20080160656
- Publication date Jul 3, 2008
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE
- Publication number 20080122045
- Publication date May 29, 2008
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080017993
- Publication date Jan 24, 2008
- NEC Electronics Corporation
- Toshiyuki TAKEWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gating grid and method of manufacture
- Publication number 20070272875
- Publication date Nov 29, 2007
- Brian G. Frederick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross diffusion barrier layer in gate structure
- Publication number 20070102753
- Publication date May 10, 2007
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device, solid-state imaging apparatus and metho...
- Publication number 20070075343
- Publication date Apr 5, 2007
- Sony Corporation
- Ikuhiro Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for determining thermal cycle reliability
- Publication number 20060273460
- Publication date Dec 7, 2006
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having a wiring layer of damascene structure a...
- Publication number 20050206002
- Publication date Sep 22, 2005
- KABUSHIKI KAISHA TOSHIBA
- Hiroyuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for determining thermal cycle reliability
- Publication number 20050186689
- Publication date Aug 25, 2005
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050067700
- Publication date Mar 31, 2005
- NEC ELECTRONICS CORPORATION
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross diffusion barrier layer in polysilicon
- Publication number 20050032316
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a wiring layer of damascene structure a...
- Publication number 20050023696
- Publication date Feb 3, 2005
- KABUSHIKI KAISHA TOSHIBA
- Hiroyuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film transistor having copper alloy wire and method of manufac...
- Publication number 20040142516
- Publication date Jul 22, 2004
- LG. Philips LCD Co., Ltd.
- Jae Gab Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross diffusion barrier layer in polysilicon
- Publication number 20040036119
- Publication date Feb 26, 2004
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device, solid-state imaging apparatus and metho...
- Publication number 20040000669
- Publication date Jan 1, 2004
- Ikuhiro Yamamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming multilayered conductive layers for semiconductor...
- Publication number 20030235977
- Publication date Dec 25, 2003
- Tetsuo Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of membrane properties to reduce residual stress in an interlay...
- Publication number 20030022463
- Publication date Jan 30, 2003
- Dawai Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Use of membrane properties to reduce residual stress in an interlay...
- Publication number 20030021971
- Publication date Jan 30, 2003
- Dawai Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20020119630
- Publication date Aug 29, 2002
- Takashi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for manufacturing a semiconductor device with three eleme...
- Publication number 20020074662
- Publication date Jun 20, 2002
- Soon Sung Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a wiring layer of damascene structure a...
- Publication number 20010054764
- Publication date Dec 27, 2001
- Hiroyuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS

Electromigration resistant metallization

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and structure for determining thermal cycle reliability

Method and structure for determining thermal cycle reliability

Methods of exposing conductive vias of semiconductor devices and as...

Self-forming, self-aligned barriers for back-end interconnects and...

Solid state imaging device having wirings with diffusion prevention...

Dual liner capping layer interconnect structure

Solid-state imaging device, solid-state imaging apparatus and metho...

Addressable hierarchical metal wire test methodology

Dual liner capping layer interconnect structure

Dual liner capping layer interconnect structure and method

Gating grid and method of manufacture

Semiconductor device and method of manufacturing the same

Structure for determining thermal cycle reliability

Semiconductor device and method of manufacturing the same

Semiconductor device having a wiring layer of damascene structure a...

Cross diffusion barrier layer in polysilicon

Solid-state imaging device, solid-state imaging apparatus and metho...

Cross diffusion barrier layer in polysilicon

Semiconductor device having a wiring layer of damascene structure a...

Composite tantalum nitride/tantalum copper capping layer

Method and structure for determining thermal cycle reliability

Thin film transistor having copper alloy wire and method of manufac...

Semiconductor device having a wiring layer of damascene structure a...

Method of forming multilayered conductive layers for semiconductor...

Method for manufacturing a semiconductor device

Thin film transistor having a copper alloy wire

Method of manufacturing a seed layer with annealed region for integ...

Use of membrane properties to reduce residual stress in an interlay...

Use of membrane properties to reduce residual stress in an interlay...

Via formation in integrated circuit interconnects

Patents Applicationslast 30 patents

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND AS...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING APPARATUS AND METHO...

DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE

DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE

METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

ADDRESSABLE HIERARCHICAL METAL WIRE TEST METHODOLOGY

DUAL LINER CAPPING LAYER INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Gating grid and method of manufacture

Cross diffusion barrier layer in gate structure

Solid-state imaging device, solid-state imaging apparatus and metho...

Method and structure for determining thermal cycle reliability

Semiconductor device having a wiring layer of damascene structure a...

Method and structure for determining thermal cycle reliability

Semiconductor device and method of manufacturing the same

Cross diffusion barrier layer in polysilicon

Semiconductor device having a wiring layer of damascene structure a...

Thin film transistor having copper alloy wire and method of manufac...

Cross diffusion barrier layer in polysilicon

Solid-state imaging device, solid-state imaging apparatus and metho...

Method of forming multilayered conductive layers for semiconductor...

Use of membrane properties to reduce residual stress in an interlay...

Use of membrane properties to reduce residual stress in an interlay...

Method for manufacturing a semiconductor device

Substrate for manufacturing a semiconductor device with three eleme...

Semiconductor device having a wiring layer of damascene structure a...