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Elemental semiconductors

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  • CPC
  • H01L2924/10251
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10251Elemental semiconductors
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method for applying a bonding layer
    • Patent number 10,438,925
    • Issue date Oct 8, 2019
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Method for applying a bonding layer
    • Patent number 9,627,349
    • Issue date Apr 18, 2017
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR APPLYING A BONDING LAYER
    • Publication number 20160190092
    • Publication date Jun 30, 2016
    • EV GROUP E. THALLNER GMBH
    • Markus WIMPLINGER
    • B81 - MICRO-STRUCTURAL TECHNOLOGY