Encapsulation comprising more than one layer

Industry

CPC
H05K2203/1322

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1322Encapsulation comprising more than one layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Shielded hearing device components and related methods
- Patent number 11,943,589
- Issue date Mar 26, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mouth guard having low-profile printed circuit board for sensing an...
- Patent number 11,826,169
- Issue date Nov 28, 2023
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mouth guard having low-profile printed circuit board for sensing an...
- Patent number 11,819,341
- Issue date Nov 21, 2023
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protective coating
- Patent number 11,786,930
- Issue date Oct 17, 2023
- Shailendra Vikram Singh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic component module and manufacturing method of electronic...
- Patent number 11,744,005
- Issue date Aug 29, 2023
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 11,729,915
- Issue date Aug 15, 2023
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes interconnected circuit boards
- Patent number 11,688,958
- Issue date Jun 27, 2023
- Microsoft Technology Licensing, LLC
- Julian Arlo Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mouth guard having low-profile printed circuit board for sensing an...
- Patent number 11,607,171
- Issue date Mar 21, 2023
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Process for conformal coating of multi-row surface-mount components...
- Patent number 11,570,903
- Issue date Jan 31, 2023
- Advanced Micro Devices, Inc.
- Chiaken Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing mouth guard having internal components for...
- Patent number 11,510,618
- Issue date Nov 29, 2022
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Liquid metal-based flexible electronic device and preparation metho...
- Patent number 11,490,524
- Issue date Nov 1, 2022
- Harbin Institute of Technology
- Liang Feng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mouth guard having low-profile printed circuit board for sensing an...
- Patent number 11,432,767
- Issue date Sep 6, 2022
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for forming circuit
- Patent number 11,439,025
- Issue date Sep 6, 2022
- FUJI CORPORATION
- Yoshitaka Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 11,389,113
- Issue date Jul 19, 2022
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module and method for manufacturing the same
- Patent number 11,342,280
- Issue date May 24, 2022
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and manufacturing method thereof
- Patent number 11,337,346
- Issue date May 17, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chul Hwan Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer thin-film coatings for system-in-package assemblies in...
- Patent number 11,266,010
- Issue date Mar 1, 2022
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device and method of manufacturing electronic ci...
- Patent number 11,189,571
- Issue date Nov 30, 2021
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing mouth guard having internal components for...
- Patent number 11,179,104
- Issue date Nov 23, 2021
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G01 - MEASURING TESTING
Information Patent Grant
Electrical node, method for manufacturing electrical node and multi...
- Patent number 11,166,363
- Issue date Nov 2, 2021
- TACTOTEK OY
- Antti Keränen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical node, method for manufacturing electrical node and multi...
- Patent number 11,166,364
- Issue date Nov 2, 2021
- TACTOTEK OY
- Antti Keränen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics encapsulation through hotmelt lamination
- Patent number 11,064,613
- Issue date Jul 13, 2021
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High-frequency module
- Patent number 10,952,310
- Issue date Mar 16, 2021
- Murata Manufacturing Co., Ltd.
- Syuichi Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and manufacturing method thereof
- Patent number 10,820,456
- Issue date Oct 27, 2020
- Samsung EIectro-Mechanics Co., Ltd.
- Chul Hwan Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiP module and manufacturing method of the SiP module
- Patent number 10,798,814
- Issue date Oct 6, 2020
- Universal Scientific Industrial (Shanghai) Co., Ltd.
- Jing Cao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component-containing module
- Patent number 10,707,403
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yoshiharu Suemori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Formable shielding film
- Patent number 10,652,996
- Issue date May 12, 2020
- 3M Innovative Properties Company
- Chun-Ming Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical node, method for manufacturing electrical node and multi...
- Patent number 10,645,796
- Issue date May 5, 2020
- TACTOTEK OY
- Antti Keränen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent power module and manufacturing method thereof
- Patent number 10,615,155
- Issue date Apr 7, 2020
- Yuxiang Feng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flexible conductive track arrangement and manufacturing method
- Patent number 10,492,701
- Issue date Dec 3, 2019
- Koninklijke Philips N.V.
- Franciscus Theodorus Agricola
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20230345687
- Publication date Oct 26, 2023
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL N...
- Publication number 20230309242
- Publication date Sep 28, 2023
- TactoTek Oy
- Tomi SIMULA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Resin Embedding
- Publication number 20230300992
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Ewald Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230144540
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Tetsuya ODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEDAL ASSEMBLY HAVING MULTI-LAYERS OF DIFFERENT TYPES OF OVERMOLD M...
- Publication number 20230086166
- Publication date Mar 23, 2023
- KSR IP Holdings, LLC
- Matthew Vyskocil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES INTERCONNECTED CIRCUIT BOARDS
- Publication number 20220376412
- Publication date Nov 24, 2022
- Microsoft Technology Licensing, LLC
- Julian Arlo BINDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220256722
- Publication date Aug 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUDIO DEVICE, ELECTRONIC CIRCUIT, AND RELATED METHODS OF MANUFATURING
- Publication number 20220232742
- Publication date Jul 21, 2022
- GN Hearing A/S
- Thorvaldur Oli BODVARSSON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SHIELDED HEARING DEVICE COMPONENTS AND RELATED METHODS
- Publication number 20220132257
- Publication date Apr 28, 2022
- GN Hearing A/S
- Thorvaldur Oli BODVARSSON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROCESS FOR CONFORMAL COATING OF MULTI-ROW SURFACE-MOUNT COMPONENTS...
- Publication number 20210120679
- Publication date Apr 22, 2021
- ADVANCED MICRO DEVICES, INC.
- Chiaken Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20210007250
- Publication date Jan 7, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Chul Hwan JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD OF MANUFACTURING ELECTRONIC CI...
- Publication number 20210005555
- Publication date Jan 7, 2021
- RISING TECHNOLOGIES CO., LTD.
- Shuzo AKEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION
- Publication number 20200344891
- Publication date Oct 29, 2020
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTI...
- Publication number 20200229296
- Publication date Jul 16, 2020
- TactoTek Oy
- Antti KERÄNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTI...
- Publication number 20200229295
- Publication date Jul 16, 2020
- TactoTek Oy
- Antti KERÄNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method Of Manufacturing Mouth Guard Having Internal Components For...
- Publication number 20200196947
- Publication date Jun 25, 2020
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20200154561
- Publication date May 14, 2020
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20200093041
- Publication date Mar 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Chul Hwan JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiP MODULE AND MANUFACTURING METHOD OF THE SiP MODULE
- Publication number 20190387610
- Publication date Dec 19, 2019
- Universal Scientific Industrial (Shanghai) Co., Ltd.
- JING CAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190090358
- Publication date Mar 21, 2019
- Semblant Limited
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190037705
- Publication date Jan 31, 2019
- Semblant Limited
- Shailendra Vikram SINGH
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BASE BOARD AND MOBILE TERMINAL
- Publication number 20190037701
- Publication date Jan 31, 2019
- Huawei Technologies Co., Ltd
- Kuanming BAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING MOLD FOR ELECTRIC AND MAGNETIC EMI MITIGATION
- Publication number 20180263107
- Publication date Sep 13, 2018
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20180220525
- Publication date Aug 2, 2018
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTELLIGENT POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047714
- Publication date Feb 15, 2018
- GD MIDEA AIRCONDITIONING EQUIPMENT CO., LTD.
- Yuxiang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Circuit Module, And Production Method Therefor
- Publication number 20170347462
- Publication date Nov 30, 2017
- Meiko Electronics Co., Ltd.
- Satoru MIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coated Electrical Assembly
- Publication number 20170245374
- Publication date Aug 24, 2017
- Semblant Limited
- Elizabeth Williams-Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART TEXTILE PRODUCT AND METHOD FOR FABRICATING THE SAME
- Publication number 20170231089
- Publication date Aug 10, 2017
- IMEC vzw
- Bjorn Van Keymeulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC TERMINAL EQUIPMENT AND METHOD FOR ASSEMBLING SAME
- Publication number 20170090532
- Publication date Mar 30, 2017
- Kaneka Corporation
- Aki Koukami
- G06 - COMPUTING CALCULATING COUNTING

Encapsulation comprising more than one layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shielded hearing device components and related methods

Mouth guard having low-profile printed circuit board for sensing an...

Mouth guard having low-profile printed circuit board for sensing an...

Protective coating

Electronic component module and manufacturing method of electronic...

Method for manufacturing a number of electrical nodes, electrical n...

Electronic assembly that includes interconnected circuit boards

Mouth guard having low-profile printed circuit board for sensing an...

Process for conformal coating of multi-row surface-mount components...

Method of manufacturing mouth guard having internal components for...

Liquid metal-based flexible electronic device and preparation metho...

Mouth guard having low-profile printed circuit board for sensing an...

Method for forming circuit

Mouth guard having user-notification feature of impact force

Module and method for manufacturing the same

Electronic component module and manufacturing method thereof

Multi-layer thin-film coatings for system-in-package assemblies in...

Electronic circuit device and method of manufacturing electronic ci...

Method of manufacturing mouth guard having internal components for...

Electrical node, method for manufacturing electrical node and multi...

Electrical node, method for manufacturing electrical node and multi...

Electronics encapsulation through hotmelt lamination

High-frequency module

Electronic component module and manufacturing method thereof

SiP module and manufacturing method of the SiP module

Electronic component-containing module

Formable shielding film

Electrical node, method for manufacturing electrical node and multi...

Intelligent power module and manufacturing method thereof

Flexible conductive track arrangement and manufacturing method

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL N...

Direct Resin Embedding

MODULE

PEDAL ASSEMBLY HAVING MULTI-LAYERS OF DIFFERENT TYPES OF OVERMOLD M...

ELECTRONIC ASSEMBLY THAT INCLUDES INTERCONNECTED CIRCUIT BOARDS

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

AUDIO DEVICE, ELECTRONIC CIRCUIT, AND RELATED METHODS OF MANUFATURING

SHIELDED HEARING DEVICE COMPONENTS AND RELATED METHODS

PROCESS FOR CONFORMAL COATING OF MULTI-ROW SURFACE-MOUNT COMPONENTS...

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

ELECTRONIC CIRCUIT DEVICE AND METHOD OF MANUFACTURING ELECTRONIC CI...

ELECTRONICS ENCAPSULATION THROUGH HOTMELT LAMINATION

ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTI...

ELECTRICAL NODE, METHOD FOR MANUFACTURING ELECTRICAL NODE AND MULTI...

Method Of Manufacturing Mouth Guard Having Internal Components For...

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF

SiP MODULE AND MANUFACTURING METHOD OF THE SiP MODULE

COATED ELECTRICAL ASSEMBLY

COATED ELECTRICAL ASSEMBLY

BASE BOARD AND MOBILE TERMINAL

SHIELDING MOLD FOR ELECTRIC AND MAGNETIC EMI MITIGATION

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

INTELLIGENT POWER MODULE AND MANUFACTURING METHOD THEREOF

Encapsulated Circuit Module, And Production Method Therefor

Coated Electrical Assembly

SMART TEXTILE PRODUCT AND METHOD FOR FABRICATING THE SAME

ELECTRONIC TERMINAL EQUIPMENT AND METHOD FOR ASSEMBLING SAME