Membership
Tour
Register
Log in
Encapsulations
Follow
Industry
CPC
H01L21/56
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/56
Encapsulations
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,967,543
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,967,549
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jung Ho Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info packages including thermal dissipation blocks
Patent number
11,967,591
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tie bar removal for semiconductor device packaging
Patent number
11,967,507
Issue date
Apr 23, 2024
NXP USA, INC.
Richard Te Gan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
Patent number
11,967,546
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolated transformer with integrated shield topology for reduced EMI
Patent number
11,967,566
Issue date
Apr 23, 2024
Texas Instruments Incorporated
Vijaylaxmi Gumaste Khanolkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and measurement method for the package structure
Patent number
11,965,731
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including conductive structure and shielding...
Patent number
11,967,565
Issue date
Apr 23, 2024
Amkor Technology Japan, Inc.
Takahiro Yada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure with cavity substrate
Patent number
11,967,579
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
Patent number
11,967,567
Issue date
Apr 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Doo Soub Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and related methods
Patent number
11,961,775
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and package-on-package including the same
Patent number
11,961,795
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Bongken Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and fabricating method thereof
Patent number
11,961,867
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Optical lithography system and method of using the same
Patent number
11,960,211
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Efficient wave guide transition between package and PCB using solde...
Patent number
11,963,291
Issue date
Apr 16, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package, semiconductor package structure, and method for...
Patent number
11,961,831
Issue date
Apr 16, 2024
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
Patent number
11,961,764
Issue date
Apr 16, 2024
STATS ChipPAC Pte. Ltd.
Thomas J. Strothmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with nanotube particles for enhanced performance and met...
Patent number
11,961,781
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,961,813
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
Patent number
11,961,777
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with connector in package and method therefor
Patent number
11,961,776
Issue date
Apr 16, 2024
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,955,348
Issue date
Apr 9, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,955,459
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Hang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component apparatus having a first lead frame and a seco...
Patent number
11,955,410
Issue date
Apr 9, 2024
Shinko Electric Industries Co., Ltd.
Yukinori Hatori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
Patent number
11,955,415
Issue date
Apr 9, 2024
Infineon Technologies Austria AG
Thorsten Scharf
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
Publication number
20240136245
Publication date
Apr 25, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240136293
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Device and Chip Packaging Method
Publication number
20240136304
Publication date
Apr 25, 2024
Honor Device Co., Ltd.
Xueping Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240136242
Publication date
Apr 25, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Hyeon Gyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD RELATED TO A POWER MODULE USING A HYBRID SPACER
Publication number
20240136247
Publication date
Apr 25, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Liangbiao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
Publication number
20240136260
Publication date
Apr 25, 2024
STMicroelectronics S.r.l.
Cristiano Gianluca STELLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Publication number
20240136203
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURABLE COMPOSITION FOR INKJET AND AIR CAVITY FORMATION, ELECTRONIC...
Publication number
20240136239
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Yusuke FUJITA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
Publication number
20240136240
Publication date
Apr 25, 2024
INFINEON TECHNOLOGIES AG
Martin MAYER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136246
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Publication number
20240136280
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20240136292
Publication date
Apr 25, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Light Emitting Structure
Publication number
20240136345
Publication date
Apr 25, 2024
Apple Inc.
John A. Higginson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
Publication number
20240136256
Publication date
Apr 25, 2024
NXP B.V.
Frank.zy Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
InFO-POP Structures with TIVs Having Cavities
Publication number
20240136298
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Dp., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
Publication number
20240138071
Publication date
Apr 25, 2024
IBIDEN CO., LTD.
Shogo FUKUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUC...
Publication number
20240132714
Publication date
Apr 25, 2024
NAMICS CORPORATION
Yuki MATSUURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Publication number
20240136322
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Tae Sup CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
Publication number
20240136326
Publication date
Apr 25, 2024
Intel Corporation
Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
Publication number
20240136238
Publication date
Apr 25, 2024
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRIPS
Publication number
20240128094
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
CHIH-CHIEN HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
O-RING SEALS FOR FLUID SENSING
Publication number
20240128137
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Sebastian Meier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Manufacturing the Same
Publication number
20240128157
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE
Publication number
20240128167
Publication date
Apr 18, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Glenda Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240128173
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Ji-Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
Publication number
20240128185
Publication date
Apr 18, 2024
PANJIT INTERNATIONAL INC.
Chung Hsiung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS