equal to or larger than 100 microns

Industry

CPC
H01L2924/2076

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/2076equal to or larger than 100 microns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Sensor package structure
- Patent number 10,692,917
- Issue date Jun 23, 2020
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 10,665,565
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fan-out in ball grid array (BGA) package
- Patent number 10,249,596
- Issue date Apr 2, 2019
- Juniper Networks, Inc.
- Valery Kugel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 10,192,848
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Post-passivation interconnect structure and method of forming same
- Patent number 9,859,242
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low on resistance
- Patent number 9,824,996
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder ball
- Patent number 9,780,055
- Issue date Oct 3, 2017
- Senju Metal Industry Co., Ltd.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming package assembly
- Patent number 9,780,064
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball, manufacturing method thereof, and semiconductor device
- Patent number 9,780,056
- Issue date Oct 3, 2017
- ChipMOS Technologies Inc.
- Tung-Bao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder ball
- Patent number 9,700,963
- Issue date Jul 11, 2017
- Senju Metal Industry Co., Ltd.
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with inductive bond wires
- Patent number 9,646,947
- Issue date May 9, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Justin P. Bandholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder ball, semiconductor package using the same, semico...
- Patent number 9,597,752
- Issue date Mar 21, 2017
- Mediatek Inc.
- Tao Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,490,200
- Issue date Nov 8, 2016
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure having bonding wire
- Patent number 9,484,315
- Issue date Nov 1, 2016
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method for production
- Patent number 9,368,447
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating equal height metal pillars of different diam...
- Patent number 9,324,557
- Issue date Apr 26, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave wafer level chip scale packaging (WLCSP) device
- Patent number 9,236,361
- Issue date Jan 12, 2016
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,165,901
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave wafer level chip scale packaging (WLCSP) device and...
- Patent number 9,159,692
- Issue date Oct 13, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,147,666
- Issue date Sep 29, 2015
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,129,946
- Issue date Sep 8, 2015
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240335901
- Publication date Oct 10, 2024
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT
- Publication number 20240196539
- Publication date Jun 13, 2024
- MEDIATEK INC.
- Chun-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
- Publication number 20230335530
- Publication date Oct 19, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
- Publication number 20230013769
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Ryo OISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20190123016
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
"Lead-Free Solder Ball"
- Publication number 20190088611
- Publication date Mar 21, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190019834
- Publication date Jan 17, 2019
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
- Publication number 20180123006
- Publication date May 3, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20180012860
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20180005970
- Publication date Jan 4, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Post-Passivation Interconnect Structure and Method of Forming Same
- Publication number 20170141060
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20160339543
- Publication date Nov 24, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Tsukasa Ohnishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20160284661
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICO...
- Publication number 20160263709
- Publication date Sep 15, 2016
- MEDIATEK INC.
- Tao Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP STRUCTURE HAVING BONDING WIRE
- Publication number 20160163665
- Publication date Jun 9, 2016
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Fabricating Equal Height Metal Pillars of Different Diam...
- Publication number 20150262950
- Publication date Sep 17, 2015
- LSI Corporation
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE ASSEMBLY
- Publication number 20150249066
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20150221606
- Publication date Aug 6, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE
- Publication number 20150035145
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332866
- Publication date Nov 13, 2014
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
- Publication number 20140328039
- Publication date Nov 6, 2014
- Paul J. Koep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...
- Publication number 20140231992
- Publication date Aug 21, 2014
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

equal to or larger than 100 microns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple plated via arrays of different wire heights on a same subs...

Sensor package structure

Package assembly

Multiple plated via arrays of different wire heights on same substrate

Multiple bond via arrays of different wire heights on a same substrate

Fan-out in ball grid array (BGA) package

Package assembly

Heavy-wire bond arrangement and method for producing same

Aluminum coated copper bond wire and method of making the same

Post-passivation interconnect structure and method of forming same

Semiconductor device having low on resistance

Lead-free solder ball

Method of forming package assembly

Solder ball, manufacturing method thereof, and semiconductor device

Electronic device and method for production

Lead-free solder ball

Integrated circuit with inductive bond wires

Composite solder ball, semiconductor package using the same, semico...

Semiconductor device

Chip structure having bonding wire

Module comprising a semiconductor chip

Electronic device and method for production

Method for fabricating equal height metal pillars of different diam...

Millimeter wave wafer level chip scale packaging (WLCSP) device

Core-jacket bonding wire

Semiconductor arrangement, semiconductor module, and method for con...

Semiconductor device

Millimeter wave wafer level chip scale packaging (WLCSP) device and...

Semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

Lead-Free Solder Ball

WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT

AI WIRING MATERIAL

MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

PACKAGE ASSEMBLY

"Lead-Free Solder Ball"

SENSOR PACKAGE STRUCTURE

Multiple bond via arrays of different wire heights on a same substrate

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

PACKAGE ASSEMBLY

Lead-Free Solder Ball

Post-Passivation Interconnect Structure and Method of Forming Same

Lead-Free Solder Ball

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICO...

CHIP STRUCTURE HAVING BONDING WIRE

SEMICONDUCTOR DEVICE

Method for Fabricating Equal Height Metal Pillars of Different Diam...

METHOD OF FORMING PACKAGE ASSEMBLY

Lead-Free Solder Ball

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...