Erbium [Er]

Industry

CPC
H01L2924/01068

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01068Erbium [Er]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,784,082
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,735,462
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,615,977
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with s...
- Patent number 11,610,802
- Issue date Mar 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,569,117
- Issue date Jan 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with high-k metal gate transi...
- Patent number 11,521,888
- Issue date Dec 6, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,508,605
- Issue date Nov 22, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with at least two single-cr...
- Patent number 11,495,484
- Issue date Nov 8, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor memory device comprising c...
- Patent number 11,482,439
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 11,482,438
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with a built-in test circuit...
- Patent number 11,482,440
- Issue date Oct 25, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,443,971
- Issue date Sep 13, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing 3D semiconductor memory device and structure...
- Patent number 11,355,380
- Issue date Jun 7, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,355,381
- Issue date Jun 7, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 11,342,214
- Issue date May 24, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20210343570
- Publication date Nov 4, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200303340
- Publication date Sep 24, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266166
- Publication date Aug 20, 2020
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200165124
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200024130
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200013751
- Publication date Jan 9, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...
- Publication number 20190148275
- Publication date May 16, 2019
- Intel Corporation
- Sriram MUTHUKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20190006222
- Publication date Jan 3, 2019
- MonolithIC 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...
- Publication number 20180012858
- Publication date Jan 11, 2018
- IQE, plc
- Andrew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Solder Deposits
- Publication number 20170320155
- Publication date Nov 9, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317244
- Publication date Nov 2, 2017
- Sharp Kabushiki Kaisha
- Masahiro KONISHI
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140339594
- Publication date Nov 20, 2014
- SHARP KABUSHIKI KAISHA
- Masahiro KONISHI
- F21 - LIGHTING
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20140300004
- Publication date Oct 9, 2014
- Eun-Kyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284668
- Publication date Sep 25, 2014
- Takuya TSURUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20140284819
- Publication date Sep 25, 2014
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140239468
- Publication date Aug 28, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Yoshihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSORS AND METHODS
- Publication number 20140239426
- Publication date Aug 28, 2014
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217620
- Publication date Aug 7, 2014
- DENSO CORPORATION
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE
- Publication number 20140218019
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING HIGH VOLTAGE DEVICE
- Publication number 20140197488
- Publication date Jul 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Erbium [Er]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Methods for producing a 3D semiconductor memory device and structure

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with metal layers and memory...

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding and DRAM memory...

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding

3D semiconductor device and structure with memory

3D semiconductor device and structure with single-crystal layers

Method for producing a 3D semiconductor device and structure with m...

Methods for producing a 3D semiconductor device and structure with...

Semiconductor device

3D semiconductor device and structure with bonding

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor device and structure with bonding

3D semiconductor device and structure with single-crystal layers

3D semiconductor memory device and structure

Method for producing a 3D semiconductor device and structure with s...

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with high-k metal gate transi...

3D semiconductor memory device and structure

3D semiconductor devices and structures with at least two single-cr...

Methods for producing a 3D semiconductor memory device comprising c...

Methods for producing a 3D semiconductor memory device and structure

3D semiconductor device and structure with a built-in test circuit...

3D semiconductor device and structure with memory

Methods for producing 3D semiconductor memory device and structure...

3D semiconductor memory device and structure

Methods for producing a 3D semiconductor memory device and structure

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

METHOD FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF A...

3D SEMICONDUCTOR DEVICE AND STRUCTURE

RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...

Method for Forming Solder Deposits

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

SEMICONDUCTOR DEVICE

CURRENT SENSORS AND METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE

METHOD OF FORMING HIGH VOLTAGE DEVICE

SENSOR PACKAGE