Etching organic layers

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CPC
H01L21/31127

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/31127Etching organic layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Area selective organic material removal
- Patent number 12,230,506
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Mikko Ritala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 12,205,824
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,082,479
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Heesung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,051,571
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Kazuya Ichiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device chip manufacturing method
- Patent number 11,990,371
- Issue date May 21, 2024
- Disco Corporation
- Kazuki Higashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing vertical memory structure with air gaps
- Patent number 11,877,455
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yuan-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled degradation of a stimuli-responsive polymer film
- Patent number 11,862,473
- Issue date Jan 2, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 11,715,640
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective organic material removal
- Patent number 11,694,903
- Issue date Jul 4, 2023
- ASM IP Holding B.V.
- Mikko Ritala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element chip isolation method using laser grooving and plasma etching
- Patent number 11,688,641
- Issue date Jun 27, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidefumi Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imprint apparatus, imprint method, and article manufacturing method
- Patent number 11,450,533
- Issue date Sep 20, 2022
- Canon Kabushiki Kaisha
- Fumiaki Kitayama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Vertical memory structure with air gaps and method for preparing th...
- Patent number 11,411,019
- Issue date Aug 9, 2022
- NANYA TECHNOLOGY CORPORATION
- Yuan-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap filling composition and pattern forming method using compositio...
- Patent number 11,392,035
- Issue date Jul 19, 2022
- Merck Patent GmbH
- Xiaowei Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor structure with gate dielectric layer and fabrication...
- Patent number 11,302,534
- Issue date Apr 12, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 11,289,380
- Issue date Mar 29, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 11,251,052
- Issue date Feb 15, 2022
- Tokyo Electron Limited
- Naotsugu Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method, plasma processing apparatus, and processing system
- Patent number 11,244,804
- Issue date Feb 8, 2022
- Tokyo Electron Limited
- Daisuke Nishide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semicondcutor package
- Patent number 11,233,019
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with metal g...
- Patent number 11,201,060
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Christine Y Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-absorbing mask for hybrid laser scribing and plasma etch wafe...
- Patent number 11,158,540
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods for mandrel pull from spacers for multi-color...
- Patent number 11,127,594
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a fluorocarbon layer
- Patent number 11,081,478
- Issue date Aug 3, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device, vacuum processing appar...
- Patent number 11,056,349
- Issue date Jul 6, 2021
- Tokyo Electron Limited
- Koichi Yatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,050,045
- Issue date Jun 29, 2021
- Samsung Display Co., Ltd.
- Heesung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a polymer film by using a polymer composition
- Patent number 10,934,426
- Issue date Mar 2, 2021
- LG Chem, Ltd.
- Se Jin Ku
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of anisotropically etching adjacent lines with multi-color s...
- Patent number 10,937,659
- Issue date Mar 2, 2021
- Tokyo Electron Limited
- Shihsheng Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dielectric film forming composition
- Patent number 10,875,965
- Issue date Dec 29, 2020
- Fujifilm Electronic Materials U.S.A., Inc.
- Sanjay Malik
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cross-linkable fluorinated photopolymer
- Patent number 10,838,302
- Issue date Nov 17, 2020
- Orthogonal, Inc.
- Charles Warren Wright
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Pattern forming method, master template, and method of manufacturin...
- Patent number 10,809,615
- Issue date Oct 20, 2020
- TOSHIBA MEMORY CORPORATION
- Noriko Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching a carbon-containing feature
- Patent number 10,811,256
- Issue date Oct 20, 2020
- ASM IP Holding B.V.
- Mitsuya Utsuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES
- Publication number 20250006485
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION
- Publication number 20240427238
- Publication date Dec 26, 2024
- NISSAN CHEMICAL CORPORATION
- Tetsuya KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMI...
- Publication number 20240419073
- Publication date Dec 19, 2024
- NISSAN CHEMICAL CORPORATION
- Shuhei SHIGAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND S...
- Publication number 20240377745
- Publication date Nov 14, 2024
- NISSAN CHEMICAL CORPORATION
- Wataru SHIBAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE...
- Publication number 20240357821
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- YUAN-YUAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
- Publication number 20240194532
- Publication date Jun 13, 2024
- Google LLC
- Zhimin Jamie Yao
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF PATTERNING UNDERLYING STRUCTURE
- Publication number 20240145244
- Publication date May 2, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...
- Publication number 20230377897
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA SELECTIVE ORGANIC MATERIAL REMOVAL
- Publication number 20230307247
- Publication date Sep 28, 2023
- ASM IP HOLDING B.V.
- Mikko Ritala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PA...
- Publication number 20230268192
- Publication date Aug 24, 2023
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH ENERGY REM...
- Publication number 20230260799
- Publication date Aug 17, 2023
- NANYA TECHNOLOGY CORPORATION
- LI-HAN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD...
- Publication number 20230178364
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Gregory BLACHUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE OF A PHOTORESIST STRIPPER, TFT ARRAYS AND PREPA...
- Publication number 20220285408
- Publication date Sep 8, 2022
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Liu Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, PLASMA PROCESSING APPARATUS, AND PROCESSING SYSTEM
- Publication number 20220122802
- Publication date Apr 21, 2022
- TOKYO ELECTRON LIMITED
- Daisuke NISHIDE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20210343540
- Publication date Nov 4, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210273208
- Publication date Sep 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- Heesung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210020514
- Publication date Jan 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT CHIP MANUFACTURING METHOD
- Publication number 20200381304
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Hidefumi SAEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILLING COMPOSITION AND PATTERN FORMING METHOD USING COMPOSITIO...
- Publication number 20200319556
- Publication date Oct 8, 2020
- AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.a.r.l.
- Xiaowei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-LINKABLE FLUORINATED PHOTOPOLYMER
- Publication number 20200301276
- Publication date Sep 24, 2020
- Orthogonal, Inc.
- Charles Warren WRIGHT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE
- Publication number 20200303331
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20200258780
- Publication date Aug 13, 2020
- Applied Materials, Inc.
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING ELECTRICALLY NONCONDUCTIVE BLOCKS USING A POLYMER BRUSH...
- Publication number 20200243335
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20200243390
- Publication date Jul 30, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Semiconductor Device, Vacuum Processing Appar...
- Publication number 20200152475
- Publication date May 14, 2020
- TOKYO ELECTRON LIMITED
- Koichi YATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-PATTERN FORMING METHOD, CAPACITOR AND METHOD OF MANUFACTURING...
- Publication number 20200152638
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Soon-mok HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20200135669
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200127242
- Publication date Apr 23, 2020
- SAMSUNG DISPLAY CO., LTD.
- Heesung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ETCH RATE REFERENCE LAYER FOR ENHANCED ETCH TIME PRECISION
- Publication number 20200105628
- Publication date Apr 2, 2020
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS

Etching organic layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Area selective organic material removal

Patterning material including silicon-containing layer and method f...

Display device and method of manufacturing the same

Substrate processing method and substrate processing system

Device chip manufacturing method

Method for preparing vertical memory structure with air gaps

Controlled degradation of a stimuli-responsive polymer film

Patterning material including silicon-containing layer and method f...

Area selective organic material removal

Element chip isolation method using laser grooving and plasma etching

Imprint apparatus, imprint method, and article manufacturing method

Vertical memory structure with air gaps and method for preparing th...

Gap filling composition and pattern forming method using compositio...

Semiconductor structure with gate dielectric layer and fabrication...

Backside metal patterning die singulation systems and related methods

Plasma processing method and plasma processing apparatus

Etching method, plasma processing apparatus, and processing system

Manufacturing method of semicondcutor package

Structure and formation method of semiconductor device with metal g...

Light-absorbing mask for hybrid laser scribing and plasma etch wafe...

Manufacturing methods for mandrel pull from spacers for multi-color...

Interconnect structure having a fluorocarbon layer

Method of fabricating semiconductor device, vacuum processing appar...

Display device and method of manufacturing the same

Method for producing a polymer film by using a polymer composition

Method of anisotropically etching adjacent lines with multi-color s...

Dielectric film forming composition

Cross-linkable fluorinated photopolymer

Pattern forming method, master template, and method of manufacturin...

Method for etching a carbon-containing feature

Patents Applicationslast 30 patents

SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES

RESIST UNDERLAYER FILM-FORMING COMPOSITION

ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMI...

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND S...

VERTICAL MEMORY STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE...

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

METHOD OF PATTERNING UNDERLYING STRUCTURE

PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...

AREA SELECTIVE ORGANIC MATERIAL REMOVAL

IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PA...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH ENERGY REM...

REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD...

ISOLATION STRUCTURE OF A PHOTORESIST STRIPPER, TFT ARRAYS AND PREPA...

ETCHING METHOD, PLASMA PROCESSING APPARATUS, AND PROCESSING SYSTEM

LASER CONTACT ABLATION FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS

ELEMENT CHIP MANUFACTURING METHOD

GAP FILLING COMPOSITION AND PATTERN FORMING METHOD USING COMPOSITIO...

CROSS-LINKABLE FLUORINATED PHOTOPOLYMER

MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

FABRICATING ELECTRICALLY NONCONDUCTIVE BLOCKS USING A POLYMER BRUSH...

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS

Method of Fabricating Semiconductor Device, Vacuum Processing Appar...

MICRO-PATTERN FORMING METHOD, CAPACITOR AND METHOD OF MANUFACTURING...

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

EMBEDDED ETCH RATE REFERENCE LAYER FOR ENHANCED ETCH TIME PRECISION