Etching temporary metallic carrier substrate

Industry

CPC
H05K2203/0376

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0376Etching temporary metallic carrier substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing method for printed circuit board
- Patent number 10,893,613
- Issue date Jan 12, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong-Guk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate
- Patent number 10,820,426
- Issue date Oct 27, 2020
- Unimicron Technology Corp.
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,791,631
- Issue date Sep 29, 2020
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning of graphene circuits on flexible substrates
- Patent number 10,362,680
- Issue date Jul 23, 2019
- Compass Technology Company, Limited
- Kelvin Po Leung Pun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,251,283
- Issue date Apr 2, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 10,117,336
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board structure
- Patent number 10,080,284
- Issue date Sep 18, 2018
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,907,164
- Issue date Feb 27, 2018
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 9,860,984
- Issue date Jan 2, 2018
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate and manufacturing method thereof
- Patent number 9,661,761
- Issue date May 23, 2017
- Unimicron Technology Corp.
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,572,250
- Issue date Feb 14, 2017
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,497,853
- Issue date Nov 15, 2016
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,433,109
- Issue date Aug 30, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,258,899
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,210,808
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating wiring board
- Patent number 9,084,379
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board with metal bump
- Patent number 9,021,693
- Issue date May 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Yong An
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having columnar protruding part
- Patent number 9,018,538
- Issue date Apr 28, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having bump
- Patent number 8,986,555
- Issue date Mar 24, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji-Eun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a laminate circuit board
- Patent number 8,875,390
- Issue date Nov 4, 2014
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing the same, and semiconductor d...
- Patent number 8,749,073
- Issue date Jun 10, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of making interconnect element having metal tr...
- Patent number 8,736,064
- Issue date May 27, 2014
- Invensas Corporation
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing coreless substrate
- Patent number 8,555,494
- Issue date Oct 15, 2013
- Intel Corporation
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring substrate
- Patent number 8,535,546
- Issue date Sep 17, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board having metal bumps
- Patent number 8,464,423
- Issue date Jun 18, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259115
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20180077799
- Publication date Mar 15, 2018
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170171973
- Publication date Jun 15, 2017
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332252
- Publication date Nov 13, 2014
- Unimicron Technology Corp.
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING METAL BUMPS
- Publication number 20140202748
- Publication date Jul 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD
- Publication number 20140115889
- Publication date May 1, 2014
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140118977
- Publication date May 1, 2014
- Murata Manufacturing Co., Ltd.
- Satoshi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140069705
- Publication date Mar 13, 2014
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140060893
- Publication date Mar 6, 2014
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140054069
- Publication date Feb 27, 2014
- LG Innotek Co., Ltd.
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART
- Publication number 20130250533
- Publication date Sep 26, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20130134127
- Publication date May 30, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WIRING BOARD
- Publication number 20130097856
- Publication date Apr 25, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130075145
- Publication date Mar 28, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE WITH BUILT-IN COMPONENT
- Publication number 20130058055
- Publication date Mar 7, 2013
- Murata Manufacturing Co., Ltd.
- Yuki YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH METAL BUMP
- Publication number 20120231155
- Publication date Sep 13, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jin Yong An
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING WIRING BOARD
- Publication number 20120174391
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE
- Publication number 20120145666
- Publication date Jun 14, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD
- Publication number 20120134125
- Publication date May 31, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Byoung-Chan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...
- Publication number 20120124828
- Publication date May 24, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woon-Chun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having metal bumps
- Publication number 20120061132
- Publication date Mar 15, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing a printed circuit board having metal bumps
- Publication number 20120060365
- Publication date Mar 15, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...
- Publication number 20110304016
- Publication date Dec 15, 2011
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD THEREOF
- Publication number 20110168438
- Publication date Jul 14, 2011
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Jung-Chien Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP
- Publication number 20110100952
- Publication date May 5, 2011
- Samsung Electro-Mechanics CO., LTD.
- Ji-Eun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20110056614
- Publication date Mar 10, 2011
- Samsung Electro-Mechanics CO., LTD.
- Jin-Yong AN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure And Method Of Making Interconnect Element Having Metal Tr...
- Publication number 20110057324
- Publication date Mar 10, 2011
- Tessera Interconnect Materials, Inc.
- Hideki Kotake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART
- Publication number 20100263923
- Publication date Oct 21, 2010
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100147560
- Publication date Jun 17, 2010
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Etching temporary metallic carrier substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Catalyzed metal foil and uses thereof

Fluororesin base material, printed wiring board, and circuit module

Manufacturing method for printed circuit board

Carrier substrate

Surface treated copper foil, copper foil with carrier, laminate, me...

Patterning of graphene circuits on flexible substrates

Carrier-attached copper foil, laminate, method for producing printe...

Method of manufacturing a wiring substrate

Circuit board structure

Printed circuit board and method for manufacturing the same

Circuit board structure and manufacturing method thereof

Carrier substrate and manufacturing method thereof

Printed circuit board and method for manufacturing the same

Printed circuit board and method for manufacturing the same

Wiring substrate and semiconductor package

Method of fabricating a wiring board

Method of fabricating a wiring board

Wiring board and method for manufacturing the same

Wiring substrate and method of manufacturing the same

Method of fabricating a wiring board

Process for fabricating wiring board

Method of manufacturing printed circuit board with metal bump

Wiring substrate having columnar protruding part

Method of manufacturing printed circuit board having bump

Method of manufacturing a laminate circuit board

Wiring board, method of manufacturing the same, and semiconductor d...

Structure and method of making interconnect element having metal tr...

Method of manufacturing coreless substrate

Method of manufacturing multilayer wiring substrate

Method of manufacturing a printed circuit board having metal bumps

Patents Applicationslast 30 patents

CATALYZED METAL FOIL AND USES THEREOF

CIRCUIT BOARD STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD HAVING METAL BUMPS

METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD

WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART

WIRING BOARD AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING A WIRING BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE WITH BUILT-IN COMPONENT

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH METAL BUMP

PROCESS FOR FABRICATING WIRING BOARD

METHOD OF MANUFACTURING MULTILAYER WIRING SUBSTRATE

METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...

Printed circuit board having metal bumps

Method of manufacturing a printed circuit board having metal bumps

WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR D...

INTERCONNECTION STRUCTURE AND METHOD THEREOF

METHOD OF MANUFACTURING A WIRING BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP

MANUFACTURING METHOD OF CIRCUIT BOARD

Structure And Method Of Making Interconnect Element Having Metal Tr...

WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME