Etching

Industry

CPC
H01J2237/334

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/334Etching

Industries

Patents Grantslast 30 patents

Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,198,937
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Koki Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,198,938
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Takatoshi Orui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma resistant arc preventative coatings for manufacturing equipm...
- Patent number 12,198,903
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Joseph Frederick Sommers
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Monolithic modular microwave source with integrated process gas dis...
- Patent number 12,191,118
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- James Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer coating for corrosion resistance
- Patent number 12,191,120
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Amir H. Tavakoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with spatially tunable RF coupling to a wafer
- Patent number 12,191,122
- Issue date Jan 7, 2025
- Lam Research Corporation
- John Drewery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method using perfluoroisopropyl vinyl ether
- Patent number 12,191,141
- Issue date Jan 7, 2025
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor reaction chamber and atomic layer plasma etching appa...
- Patent number 12,191,114
- Issue date Jan 7, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Xingfei Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,191,116
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Kazushi Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas nozzle, manufacturing method of gas nozzle, and plasma treatmen...
- Patent number 12,183,551
- Issue date Dec 31, 2024
- Kyocera Corporation
- Yukio Noguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Bottom and middle edge rings
- Patent number 12,183,554
- Issue date Dec 31, 2024
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage waveform generator for plasma assisted processing apparatuses
- Patent number 12,183,547
- Issue date Dec 31, 2024
- PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
- Jordi Everts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning ion beam deposition and etch
- Patent number 12,176,178
- Issue date Dec 24, 2024
- Plasma-Therm NES LLC
- Sarpangala Hariharakeshava Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate using plasma
- Patent number 12,176,185
- Issue date Dec 24, 2024
- Semes Co., Ltd.
- Min Sung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method and plasma processing apparatus
- Patent number 12,176,187
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling a recess formed within a substrate...
- Patent number 12,176,243
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Viljami Pore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,176,236
- Issue date Dec 24, 2024
- Kioxia Corporation
- Wu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma abatement system utilizing water vapor and oxygen reagent
- Patent number 12,170,192
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Colin John Dickinson
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Ceramic sintered body and member for plasma processing apparatus
- Patent number 12,165,853
- Issue date Dec 10, 2024
- Kyocera Corporation
- Manpei Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,854
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Nobutaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical diagnostics of semiconductor process using hyperspectral im...
- Patent number 12,165,937
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-frequency, direct-drive inductively coupled plasma source
- Patent number 12,165,841
- Issue date Dec 10, 2024
- Lam Research Corporation
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniformity control circuit for impedance match
- Patent number 12,165,844
- Issue date Dec 10, 2024
- Lam Research Corporation
- Alexei M. Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method for manufacturing semiconductor structure
- Patent number 12,165,851
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate processing apparatus, and me...
- Patent number 12,165,848
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Kenichi Oyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for etching a material layer for semiconductor applications
- Patent number 12,165,877
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Zhigang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20250022724
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Masanori TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FIXING DEVICE
- Publication number 20250022741
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Yuma Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND APPARATUS
- Publication number 20250022688
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Barton Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY
- Publication number 20250022697
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Costel BILOIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
- Publication number 20250022738
- Publication date Jan 16, 2025
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250022682
- Publication date Jan 16, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Shogo OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...
- Publication number 20250022691
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Shang-I CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM
- Publication number 20250022690
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Chiuan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER
- Publication number 20250014868
- Publication date Jan 9, 2025
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20250014877
- Publication date Jan 9, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hisao NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
- Publication number 20250014867
- Publication date Jan 9, 2025
- PSK INC.
- Sung Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250014872
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...
- Publication number 20250006469
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Miguel Benjamin VASQUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHOWERHEAD WITH IMPROVED HOLE PATTERN FOR DELIVERING RAD...
- Publication number 20250003074
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Rachel E. BATZER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS ANALYSIS DEVICE AND CONTROL METHOD
- Publication number 20250006476
- Publication date Jan 2, 2025
- ATONARP INC.
- Hirofumi NAGAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240429027
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Noriyuki SAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BLOCK, METHOD FOR PRODUCING SAME, AND PLASMA-RESISTANT MEMBER
- Publication number 20240425407
- Publication date Dec 26, 2024
- AGC Inc.
- Shuhei OGAWA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
PLASMA TREATMENT APPARATUS
- Publication number 20240429030
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Kazuya EMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSITION CONTROL IN A BIAS SUPPLY
- Publication number 20240429023
- Publication date Dec 26, 2024
- Advanced Energy Industries, Inc.
- Hien Minh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS
- Publication number 20240429062
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Alok Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
- Publication number 20240429070
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE RING LIFTING SOLUTION
- Publication number 20240429088
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Michael R. RICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Publication number 20240420962
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Doreen Wei Ying Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...
- Publication number 20240420963
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- He Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SHIELD ASSEMBLY AND PLASMA PROCESSING APPARATUS INCLUDING TH...
- Publication number 20240420928
- Publication date Dec 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Eun Chan LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE...
- Publication number 20240420929
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Rajesh Dorai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT
- Publication number 20240420932
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yogananda Sarode Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CHAMBER HAVING SWIRL MOTION SIDE GAS FEED
- Publication number 20240420925
- Publication date Dec 19, 2024
- NYSEPLASMA CORP.
- Nam Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etching method and plasma processing apparatus

Etching method

Plasma resistant arc preventative coatings for manufacturing equipm...

Monolithic modular microwave source with integrated process gas dis...

Multilayer coating for corrosion resistance

Electrostatic chuck with spatially tunable RF coupling to a wafer

Plasma etching method using perfluoroisopropyl vinyl ether

Semiconductor reaction chamber and atomic layer plasma etching appa...

Plasma processing apparatus and plasma processing method

Wafer treatment system and method of treating wafer

Gas nozzle, manufacturing method of gas nozzle, and plasma treatmen...

Bottom and middle edge rings

Remote source pulsing with advanced pulse control

Voltage waveform generator for plasma assisted processing apparatuses

Scanning ion beam deposition and etch

Apparatus and method for processing substrate using plasma

Cleaning method and plasma processing apparatus

Method and apparatus for filling a recess formed within a substrate...

Semiconductor manufacturing apparatus and method for manufacturing...

Plasma abatement system utilizing water vapor and oxygen reagent

Ceramic sintered body and member for plasma processing apparatus

Substrate support and substrate processing apparatus

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Optical diagnostics of semiconductor process using hyperspectral im...

Dual-frequency, direct-drive inductively coupled plasma source

Uniformity control circuit for impedance match

Plasma processing method for manufacturing semiconductor structure

Substrate processing method, substrate processing apparatus, and me...

Methods for etching a material layer for semiconductor applications

Patents Applicationslast 30 patents

SUBSTRATE SUPPORT

SUBSTRATE FIXING DEVICE

PLASMA PROCESSING METHOD AND APPARATUS

PLASMA SYSTEM HAVING RESIDENCE TIME TUNING ASSEMBLY

ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

GAS CLUSTER ASSISTED PLASMA PROCESSING

PLASMA PROCESSING APPARATUS

WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...

RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

MANIFOLD FOR SUPPLYING COOLANT TO COMPONENTS OF SUBSTRATE PROCESSIN...

INTEGRATED SHOWERHEAD WITH IMPROVED HOLE PATTERN FOR DELIVERING RAD...

GAS ANALYSIS DEVICE AND CONTROL METHOD

PLASMA PROCESSING APPARATUS

GLASS BLOCK, METHOD FOR PRODUCING SAME, AND PLASMA-RESISTANT MEMBER

PLASMA TREATMENT APPARATUS

TRANSITION CONTROL IN A BIAS SUPPLY

INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS

SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE

WAFER EDGE RING LIFTING SOLUTION

METHODS OF SELECTIVELY ETCHING SILICON NITRIDE

MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...

PLASMA SHIELD ASSEMBLY AND PLASMA PROCESSING APPARATUS INCLUDING TH...

EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE...

SUBSTRATE SUPPORT

PLASMA CHAMBER HAVING SWIRL MOTION SIDE GAS FEED