TREA

Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead

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Industry

  • CPC
  • H05K2201/10931
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10931Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20240040702
    • Publication date Feb 1, 2024
    • HITACHI,ASTEMO, LTD.
    • Takeshi TOKUYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20230309229
    • Publication date Sep 28, 2023
    • TDK Corporation
    • Takeshi OOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATED SEMICONDUCTOR DEVICES
    • Publication number 20230163050
    • Publication date May 25, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Sreenivasan Kalyani Koduri
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230113302
    • Publication date Apr 13, 2023
    • LG Innotek Co., Ltd.
    • Yong Han JEON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230105635
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE MODULE
    • Publication number 20210410288
    • Publication date Dec 30, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Mok JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20180007777
    • Publication date Jan 4, 2018
    • Hyundai Motor Company
    • Jeong Min Son
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20160007467
    • Publication date Jan 7, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung-Eun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOLD MODULE UTILIZED AS POWER UNIT OF ELECTRIC POWER STEERING APPAR...
    • Publication number 20140151146
    • Publication date Jun 5, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Daisuke Tanaka
    • B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
  • Information Patent Application

    Non-Pull Back Pad Package with an Additional Solder Standoff
    • Publication number 20100006623
    • Publication date Jan 14, 2010
    • TEXAS INSTRUMENTS INCORPORATED
    • Bernhard P. Lange
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MOUNTING METHOD THEREOF
    • Publication number 20090121362
    • Publication date May 14, 2009
    • Samsung SDI Co., Ltd
    • Young-Cheol JANG
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    ARRANGEMENT FOR SURFACE MOUNTING AN ELECTRICAL COMPONENT BY SOLDERI...
    • Publication number 20080128255
    • Publication date Jun 5, 2008
    • COACTIVE TECHNOLOGIES, INC.
    • Jean-Christophe Villain
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Non-Pull Back Pad Package with an Additional Solder Standoff
    • Publication number 20080102563
    • Publication date May 1, 2008
    • TEXAS INSTRUMENTS INCORPORATED
    • Bernhard P. Lange
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Circuit board and electronic assembly
    • Publication number 20070158797
    • Publication date Jul 12, 2007
    • Sheng-Yuan Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Package frame and semiconductor package using the same
    • Publication number 20070034994
    • Publication date Feb 15, 2007
    • Fairchild Korea Semiconductor, Ltd.
    • Yoon-hwa Choi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Method of surface mounting a semiconductor device
    • Publication number 20050189627
    • Publication date Sep 1, 2005
    • Fujio Ito
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Method of soldering electrical connection
    • Publication number 20050156012
    • Publication date Jul 21, 2005
    • Ted Ju
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Light-emitting diode lamp
    • Publication number 20050030762
    • Publication date Feb 10, 2005
    • Toyoda Gosei Co., Ltd.
    • Hideaki Kato
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Semiconductor device and its manufacturing method
    • Publication number 20050012187
    • Publication date Jan 20, 2005
    • Koujiro Kameyama
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Stackable integrated circuit package and method therefor
    • Publication number 20040251523
    • Publication date Dec 16, 2004
    • SanDisk Corporation
    • Hem P. Takiar
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    METHOD OF MOUNTING AN EXPOSED-PAD TYPE OF SEMICONDUCTOR DEVICE OVER...
    • Publication number 20020146863
    • Publication date Oct 10, 2002
    • Chieh-Yuan Lin
    • H01 - BASIC ELECTRIC ELEMENTS