Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes

Industry

CPC
H05K2201/0919

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and method for manufacturing the same
- Patent number 11,653,442
- Issue date May 16, 2023
- Lumentum Japan, Inc.
- Daisuke Noguchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interconnection including a hybrid cable assembly and a circuit boa...
- Patent number 11,482,766
- Issue date Oct 25, 2022
- MD Elektronik GmbH
- Martin Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing the same
- Patent number 11,342,280
- Issue date May 24, 2022
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to metallization of ceramic substrates for shieldin...
- Patent number 11,277,901
- Issue date Mar 15, 2022
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication module
- Patent number 11,206,731
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Bo Hyun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method for manufacturing the same
- Patent number 11,134,563
- Issue date Sep 28, 2021
- Lumentum Japan, Inc.
- Daisuke Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing same
- Patent number 11,075,224
- Issue date Jul 27, 2021
- AU OPTRONICS CORPORATION
- Hao-An Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral end face attachment of exposed copper layers of a first...
- Patent number 11,026,326
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Todd E. Takken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded lateral connector
- Patent number 10,971,836
- Issue date Apr 6, 2021
- Amazon Technologies, Inc.
- William Mische
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 10,729,001
- Issue date Jul 28, 2020
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module assembly structure
- Patent number 10,709,008
- Issue date Jul 7, 2020
- OTO TECHNOLOGY CORP.
- Tung-Jung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redirection of electromagnetic signals using substrate structures
- Patent number 10,651,559
- Issue date May 12, 2020
- Keyssa, Inc.
- Emilio Sovero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing same
- Patent number 10,622,385
- Issue date Apr 14, 2020
- AU OPTRONICS CORPORATION
- Hao-An Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) with three-dimensional interconnects to...
- Patent number 10,617,000
- Issue date Apr 7, 2020
- Intel Corporation
- Daqiao Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with embedded lateral connector
- Patent number 10,476,188
- Issue date Nov 12, 2019
- Amazon Technologies, Inc.
- William Mische
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 10,383,210
- Issue date Aug 13, 2019
- Murata Manufacturing Co., Ltd.
- Takanori Uejima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flexible flat cable
- Patent number 10,319,498
- Issue date Jun 11, 2019
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Xiaoyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable connection structure and endoscope device
- Patent number 10,312,566
- Issue date Jun 4, 2019
- Olympus Corporation
- Junya Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding structure
- Patent number 10,306,816
- Issue date May 28, 2019
- Samsung Electronics Co., Ltd.
- Il-ju Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shield structure for electronic device
- Patent number 10,292,317
- Issue date May 14, 2019
- Samsung Electronics Co., Ltd.
- Jung-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method of package structure
- Patent number 10,256,180
- Issue date Apr 9, 2019
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency signal line and manufacturing method thereof
- Patent number 10,158,157
- Issue date Dec 18, 2018
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission line cable
- Patent number 10,153,534
- Issue date Dec 11, 2018
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for connecting board and connector, board, and method for...
- Patent number 10,148,027
- Issue date Dec 4, 2018
- Hirose Electric Co., Ltd.
- Teppei Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure
- Patent number 10,090,256
- Issue date Oct 2, 2018
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 10,064,267
- Issue date Aug 28, 2018
- LG Display Co., Ltd.
- UnSeung Pyun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission component and electronic device
- Patent number 10,038,231
- Issue date Jul 31, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210385949
- Publication date Dec 9, 2021
- Murata Manufacturing Co., Ltd.
- Masato NOMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION MODULE
- Publication number 20210298166
- Publication date Sep 23, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Bo Hyun SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200229297
- Publication date Jul 16, 2020
- Lumentum Japan, Inc.
- Daisuke NOGUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWER MODULE ASSEMBLY STRUCTURE
- Publication number 20190289709
- Publication date Sep 19, 2019
- OTO TECHNOLOGY CORP.
- TUNG-JUNG LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20190008032
- Publication date Jan 3, 2019
- Murata Manufacturing Co., Ltd.
- Takanori UEJIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTROMAGNETIC SHIELD STRUCTURE FOR ELECTRONIC DEVICE
- Publication number 20180228061
- Publication date Aug 9, 2018
- Samsung Electronics Co., Ltd.
- Jung-Sik PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE
- Publication number 20180123206
- Publication date May 3, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20150201485
- Publication date Jul 16, 2015
- Shinko Electric Industries Co., Ltd.
- Tatsuaki DENDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...
- Publication number 20140376196
- Publication date Dec 25, 2014
- Volodymyr Karpovych
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR FOR MULTI-LAYERED BOARD
- Publication number 20140295697
- Publication date Oct 2, 2014
- Molex Incorporated
- Toshihiro NIITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20140264788
- Publication date Sep 18, 2014
- Fujitsu Limited
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE
- Publication number 20140174803
- Publication date Jun 26, 2014
- Jyun Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20140177177
- Publication date Jun 26, 2014
- NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
- Chien-Yi Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Comprising An Electrode Configuration Of A Ca...
- Publication number 20140139240
- Publication date May 22, 2014
- NIPPON SHOKUBAI CO., LTD
- Stefan Burger
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC MODULE AND METHOD FOR SAME
- Publication number 20140085857
- Publication date Mar 27, 2014
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- JEN-CHUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD FOR WIRING BOARD, AND IMAGE PICK...
- Publication number 20140003018
- Publication date Jan 2, 2014
- OLYMPUS CORPORATION
- Noriyuki FUJIMORI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WIRING BOARD
- Publication number 20140000940
- Publication date Jan 2, 2014
- KYOCERA CORPORATION
- Yurie Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Golden Finger and Board Edge Interconnecting Device
- Publication number 20140004720
- Publication date Jan 2, 2014
- Huawei Technologies Co., Ltd
- Kai Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD ASSEMBLY AND RELATED METHODS
- Publication number 20130319746
- Publication date Dec 5, 2013
- Harris Corporation
- ANDERS P. PEDERSEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20130313003
- Publication date Nov 28, 2013
- WAKA MANUFACTURING CO., LTD.
- Hiroshi Okayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDIRECTION OF ELECTROMAGNETIC SIGNALS USING SUBSTRATE STRUCTURES
- Publication number 20130257670
- Publication date Oct 3, 2013
- Emilio Sovero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20130133940
- Publication date May 30, 2013
- Askey Computer Corporation
- Chi-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Boards with Embedded Components
- Publication number 20130077813
- Publication date Mar 28, 2013
- Apple Inc.
- Jahan Minoo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT
- Publication number 20130063914
- Publication date Mar 14, 2013
- Apple Inc.
- Gloria Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20120320540
- Publication date Dec 20, 2012
- FUJITSU COMPONENT LIMITED
- Osamu Daikuhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCH STRUCTURE ON SIDEWALL OF CIRCUIT BOARD FOR ELECTRONIC DEVICE...
- Publication number 20120228100
- Publication date Sep 13, 2012
- Chih-Feng Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARD EDGE CONNECTOR
- Publication number 20120225588
- Publication date Sep 6, 2012
- Tyco Electronics Corporation
- John Eugene Westman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND PROCESS FOR PRODUCTION THEREOF
- Publication number 20120168214
- Publication date Jul 5, 2012
- PANASONIC CORPORATION
- Takafumi Kashiwagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD
- Publication number 20120063110
- Publication date Mar 15, 2012
- PANASONIC CORPORATION
- Masahiro TAKATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to metallization of ceramic substrates...

Electronic component

Optical module and method for manufacturing the same

Interconnection including a hybrid cable assembly and a circuit boa...

Module and method for manufacturing the same

Methods related to metallization of ceramic substrates for shieldin...

Communication module

Optical module and method for manufacturing the same

Display device and method for manufacturing same

Peripheral end face attachment of exposed copper layers of a first...

Printed circuit board with embedded lateral connector

Integrated circuit chip packaging including a heat sink topped cavity

Devices and methods related to metallization of ceramic substrates...

Power module assembly structure

Redirection of electromagnetic signals using substrate structures

Display device and method for manufacturing same

Printed circuit board (PCB) with three-dimensional interconnects to...

Printed circuit board with embedded lateral connector

High-frequency module

Flexible flat cable

Cable connection structure and endoscope device

EMI shielding structure

Electromagnetic shield structure for electronic device

Package structure and manufacturing method of package structure

High-frequency signal line and manufacturing method thereof

Transmission line cable

Structure for connecting board and connector, board, and method for...

Semiconductor structure

Printed circuit board and display device including the same

Signal transmission component and electronic device

Patents Applicationslast 30 patents

MODULE

ELECTRONIC COMPONENT

COMMUNICATION MODULE

OPTICAL MODULE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE ASSEMBLY STRUCTURE

HIGH-FREQUENCY MODULE

ELECTROMAGNETIC SHIELD STRUCTURE FOR ELECTRONIC DEVICE

SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE

WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...

CONNECTOR FOR MULTI-LAYERED BOARD

HIGH-FREQUENCY MODULE

WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE

ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF

Printed Circuit Board Comprising An Electrode Configuration Of A Ca...

ELECTRONIC MODULE AND METHOD FOR SAME

WIRING BOARD, MANUFACTURING METHOD FOR WIRING BOARD, AND IMAGE PICK...

WIRING BOARD

Golden Finger and Board Edge Interconnecting Device

PRINTED WIRING BOARD ASSEMBLY AND RELATED METHODS

MULTILAYER WIRING BOARD

REDIRECTION OF ELECTROMAGNETIC SIGNALS USING SUBSTRATE STRUCTURES

SYSTEM IN PACKAGE MODULE AND METHOD OF FABRICATING THE SAME

Printed Circuit Boards with Embedded Components

SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

SWITCH STRUCTURE ON SIDEWALL OF CIRCUIT BOARD FOR ELECTRONIC DEVICE...

CARD EDGE CONNECTOR

MODULE AND PROCESS FOR PRODUCTION THEREOF

MODULE BOARD