Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes

Industry

CPC
H05K2201/092

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/092Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating graphene into the skin depth region of high speed commu...
- Patent number 12,160,948
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current sensors for power converters
- Patent number 12,126,264
- Issue date Oct 22, 2024
- Apple Inc.
- Brandon Pierquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board including terminal, wiring module, a...
- Patent number 12,114,429
- Issue date Oct 8, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and probe card
- Patent number 12,114,423
- Issue date Oct 8, 2024
- Kyocera Corporation
- Youichiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
High-performance capacitor packaging for next generation power elec...
- Patent number 12,100,560
- Issue date Sep 24, 2024
- UT-Battelle, LLC
- Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, wiring module, flexible printed cir...
- Patent number 12,101,888
- Issue date Sep 24, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and electronic device having polarizer with conducti...
- Patent number 12,089,350
- Issue date Sep 10, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Dong Tian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Differential circuit board and semiconductor light emitting device
- Patent number 12,082,336
- Issue date Sep 3, 2024
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board configuration blocks and edge projections
- Patent number 12,082,342
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Branch coupler having U-shaped and L-shaped microstrip lines
- Patent number 12,069,799
- Issue date Aug 20, 2024
- Nanning FuLian FuGui Precision Industrial Co., Ltd.
- Yu-Chih Chueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadside coupled radio frequency interconnect
- Patent number 12,069,798
- Issue date Aug 20, 2024
- Lockheed Martin Corporation
- Thomas Henry Hand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with laminated magnetic core inductor and magnet...
- Patent number 12,048,097
- Issue date Jul 23, 2024
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,041,720
- Issue date Jul 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wetness pad assembly, system and method
- Patent number 12,029,631
- Issue date Jul 9, 2024
- Franklin Edward Ward
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 12,027,492
- Issue date Jul 2, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with touch panel having X, Y and dummy electrodes
- Patent number 12,026,337
- Issue date Jul 2, 2024
- PANELTOUCH TECHNOLOGIES LLC
- Shinya Hashimoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line power dividers and power combiners with matched p...
- Patent number 12,022,609
- Issue date Jun 25, 2024
- L3 Technologies, Inc.
- Brian Christopher Clark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring
- Patent number 12,014,012
- Issue date Jun 18, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Header and package with integrated cooler for electronic components
- Patent number 12,009,634
- Issue date Jun 11, 2024
- Schott AG
- Andreas Krause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and method for manufacturing the same
- Patent number 11,991,828
- Issue date May 21, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Point heat detectors based on surface mounted thermistors
- Patent number 11,990,015
- Issue date May 21, 2024
- Honeywell International Inc.
- Andrea Chiatti
- G08 - SIGNALLING

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240422900
- Publication date Dec 19, 2024
- KYOCERA CORPORATION
- Noriyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...
- Publication number 20240414848
- Publication date Dec 12, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POINT HEAT DETECTORS BASED ON SURFACE MOUNTED THERMISTORS
- Publication number 20240395123
- Publication date Nov 28, 2024
- Honeywell International Inc.
- Andrea Chiatti
- G08 - SIGNALLING
Information Patent Application
WIRING BOARD
- Publication number 20240397611
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Koji MIYAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389234
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...
- Publication number 20240388027
- Publication date Nov 21, 2024
- Japan Aviation Electronics Industry, Limited
- Kenta Ashibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit layout of printed circuit board
- Publication number 20240349421
- Publication date Oct 17, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- CHIA-LUNG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240334603
- Publication date Oct 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING BOARD
- Publication number 20240334607
- Publication date Oct 3, 2024
- Panasonic Automotive Systems Co., Ltd.
- Mitsunori HAYASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE
- Publication number 20240329090
- Publication date Oct 3, 2024
- SCHNEIDER ELECTRIC USA, INC.
- Adrian Abdala Rendon Hernandez
- G01 - MEASURING TESTING
Information Patent Application
TRANSMISSION LINE POWER DIVIDERS AND POWER COMBINERS WITH MATCHED P...
- Publication number 20240314925
- Publication date Sep 19, 2024
- L3 Technologies, Inc.
- Brian Christopher Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240314937
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Hee Jung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES
- Publication number 20240310945
- Publication date Sep 19, 2024
- Paneltouch Technologies LLC
- Shinya HASHIMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING
- Publication number 20240272754
- Publication date Aug 15, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND ELECTRICAL MODULE THEREOF
- Publication number 20240276641
- Publication date Aug 15, 2024
- Lextar Electronics Corporation
- Sheng-Ta WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION CABLE STRUCTURE
- Publication number 20240276644
- Publication date Aug 15, 2024
- ELKA INTERNATIONAL LTD.
- YI-CHIEH CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...
- Publication number 20240268033
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Florian Eichkorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT AND CORRESPONDING PROTECTION METHOD
- Publication number 20240260176
- Publication date Aug 1, 2024
- BULL SAS
- Sylvain DUCLOYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240260172
- Publication date Aug 1, 2024
- Honor Device Co., Ltd.
- Puwei BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240244751
- Publication date Jul 18, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
- Publication number 20240243496
- Publication date Jul 18, 2024
- CIENA CORPORATION
- Russell Mays
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...
- Publication number 20240235004
- Publication date Jul 11, 2024
- DAI NIPPON PRINTING CO., LTD.
- Kazuki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A POWER CONVERTER DEVICE AND A SYSTEM COMPRISING THE SAME
- Publication number 20240235412
- Publication date Jul 11, 2024
- Epinovatech AB
- Martin Andreas OLSSON
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board, producing method thereof, and wiring circuit...

High speed network device with orthogonal pluggable optics modules

Integrating graphene into the skin depth region of high speed commu...

Resetting different pair skew of printed circuit board traces

Wiring substrate and semiconductor device

Current sensors for power converters

Circuit board and preparation method thereof

Flexible printed circuit board including terminal, wiring module, a...

Circuit board and probe card

High-performance capacitor packaging for next generation power elec...

Flexible printed circuit board, wiring module, flexible printed cir...

Display device and electronic device having polarizer with conducti...

Differential circuit board and semiconductor light emitting device

Printed circuit board configuration blocks and edge projections

Multi-level printed circuit boards and memory modules including the...

Branch coupler having U-shaped and L-shaped microstrip lines

Broadside coupled radio frequency interconnect

Integrated circuit with laminated magnetic core inductor and magnet...

Display device and manufacturing method thereof

Wetness pad assembly, system and method

Semiconductor module and semiconductor device

Display device with touch panel having X, Y and dummy electrodes

Circuit structure and electrical junction box

Transmission line power dividers and power combiners with matched p...

Semiconductor chip module

Printed wiring

Ceramic-based circuit board assemblies formed using metal nanoparti...

Header and package with integrated cooler for electronic components

Display apparatus and method for manufacturing the same

Point heat detectors based on surface mounted thermistors

Patents Applicationslast 30 patents

WIRING BOARD AND MANUFACTURING METHOD FOR THE SAME

ELECTRONIC DEVICE

FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...

POINT HEAT DETECTORS BASED ON SURFACE MOUNTED THERMISTORS

WIRING BOARD

CIRCUIT MODULE

CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...

Circuit layout of printed circuit board

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

DISPLAY DEVICE

MOUNTING BOARD

REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE

TRANSMISSION LINE POWER DIVIDERS AND POWER COMBINERS WITH MATCHED P...

CIRCUIT BOARD

DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS

CIRCUIT STRUCTURE

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

PRINTED WIRING

Electronic device and manufacturing method thereof

LIGHT-EMITTING DEVICE AND ELECTRICAL MODULE THEREOF

TRANSMISSION CABLE STRUCTURE

FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

ELECTRONIC CIRCUIT AND CORRESPONDING PROTECTION METHOD

CIRCUIT BOARD AND ELECTRONIC DEVICE

DISPLAY APPARATUS

METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS

WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...

A POWER CONVERTER DEVICE AND A SYSTEM COMPRISING THE SAME