Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes

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CPC
H05K2201/092

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/092Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 12,369,248
- Issue date Jul 22, 2025
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel
- Patent number 12,363,824
- Issue date Jul 15, 2025
- Yungu (Gu'an) Technology Co., Ltd.
- Hongrui Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connectors for linear lighting
- Patent number 12,345,398
- Issue date Jul 1, 2025
- Elemental LED, Inc.
- Kenneth A. Afan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit mounting structures
- Patent number 12,342,448
- Issue date Jun 24, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device
- Patent number 12,342,452
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body and harness
- Patent number 12,334,659
- Issue date Jun 17, 2025
- Japan Aviation Electronics Industry, Limited
- Kentaro Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and power conversion apparatus
- Patent number 12,336,094
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Ryoga Kiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating member arrangement structure and electronic device inclu...
- Patent number 12,328,811
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Wooram Ki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device
- Patent number 12,328,813
- Issue date Jun 10, 2025
- Japan Display Inc.
- Masatomo Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 12,309,930
- Issue date May 20, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multistage capacitive crosstalk compensation arrangement
- Patent number 12,308,573
- Issue date May 20, 2025
- CommScope Technologies LLC
- David Patrick Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catheter-deployable soft robotic sensor arrays and processing of fl...
- Patent number 12,285,260
- Issue date Apr 29, 2025
- Cornell University
- Simon Dunham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave absorber
- Patent number 12,279,363
- Issue date Apr 15, 2025
- Sony Group Corporation
- Takashi Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module, display apparatus, and method of manufacturing the...
- Patent number 12,278,225
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,274,000
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Sang Hun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component sub-mount and electronic device using the same
- Patent number 12,267,960
- Issue date Apr 1, 2025
- Lextar Electronics Corporation
- Ming-Jing Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic module, and electronic apparatus
- Patent number 12,267,947
- Issue date Apr 1, 2025
- Canon Kabushiki Kaisha
- Makoto Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Point heat detectors based on surface mounted thermistors
- Patent number 12,260,724
- Issue date Mar 25, 2025
- Honeywell International Inc.
- Andrea Chiatti
- G08 - SIGNALLING
Information Patent Grant
Illuminating circuit structure
- Patent number 12,259,112
- Issue date Mar 25, 2025
- Darfon Electronics Corp.
- Hsin-Cheng Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package board, antenna package including the same and image display...
- Patent number 12,255,414
- Issue date Mar 18, 2025
- Dongwoo Fine-Chem Co., Ltd.
- Na Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Decoupled PCB structure to parallel power transistors
- Patent number 12,237,760
- Issue date Feb 25, 2025
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board
- Patent number 12,232,253
- Issue date Feb 18, 2025
- ITABASHI SEIKI CO., LTD.
- Tetsuya Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental hazard risk mitigation system, method and computer pr...
- Patent number 12,232,232
- Issue date Feb 18, 2025
- Lighting Defense Group, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power system and method for controlling power modules
- Patent number 12,225,657
- Issue date Feb 11, 2025
- Transportation IP Holdings, LLC
- Alvaro Jorge Mari Curbelo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed wiring
- Patent number 12,223,147
- Issue date Feb 11, 2025
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission module, electronic unit, and electronic device
- Patent number 12,213,244
- Issue date Jan 28, 2025
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20250240880
- Publication date Jul 24, 2025
- LG Display Co., Ltd.
- Binn KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250237900
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20250240877
- Publication date Jul 24, 2025
- Nitto Denko Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250227846
- Publication date Jul 10, 2025
- Murata Manufacturing Co., Ltd.
- Yasuhiro TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...
- Publication number 20250227840
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Sang Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL PLANAR METROLOGY MOUNTING DEVICE AND METHODS FOR ABRASIVE C...
- Publication number 20250216190
- Publication date Jul 3, 2025
- The United States of America, as represented by the Secretary of the Navy
- Derek Lengacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POINT HEAT DETECTORS BASED ON SURFACE MOUNTED THERMISTORS
- Publication number 20250218267
- Publication date Jul 3, 2025
- Honeywell International Inc.
- Andrea Chiatti
- G08 - SIGNALLING
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...
- Publication number 20250220814
- Publication date Jul 3, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE CAPABLE OF SUPPRESSING COMMON MODE NOISE
- Publication number 20250203756
- Publication date Jun 19, 2025
- EMPass Technology Inc.
- Yang-Chih HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BO...
- Publication number 20250203771
- Publication date Jun 19, 2025
- ROBERT BOSCH GmbH
- Charles-Edouard De Gryse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20250203765
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Yui NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT SUB-MOUNT
- Publication number 20250203780
- Publication date Jun 19, 2025
- Lextar Electronics Corporation
- Ming-Jing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
- Publication number 20250176113
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Luciano ZIZZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES
- Publication number 20250151196
- Publication date May 8, 2025
- Hewlett-Packard Development Company, L.P.
- Marcus Joseph Benzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISCHARGE COLLECTOR
- Publication number 20250151189
- Publication date May 8, 2025
- Wiliot, LTD.
- Alon YEHEZKELY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126710
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250107055
- Publication date Mar 27, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250081335
- Publication date Mar 6, 2025
- Industrial Technology Research Institute
- Yi-Rong Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
- Publication number 20250079284
- Publication date Mar 6, 2025
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND COIL DEVICE
- Publication number 20250071899
- Publication date Feb 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Masaki MIYABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Display panel

Connectors for linear lighting

Three dimensional circuit mounting structures

Circuit board and electronic device

Connection body and harness

Wiring board and power conversion apparatus

Insulating member arrangement structure and electronic device inclu...

Electronic device

Display apparatus

Board-level pad pattern for multi-row QFN packages

Multistage capacitive crosstalk compensation arrangement

Catheter-deployable soft robotic sensor arrays and processing of fl...

Electromagnetic wave absorber

Display module, display apparatus, and method of manufacturing the...

Flexible printed circuit board, COF module, and electronic device c...

Leadless current sensor package with high isolation

Electronic component sub-mount and electronic device using the same

Wiring board, electronic module, and electronic apparatus

Point heat detectors based on surface mounted thermistors

Illuminating circuit structure

Package board, antenna package including the same and image display...

Rapid implementation of high-temperature analog interface electronics

Decoupled PCB structure to parallel power transistors

Printed circuit board

Environmental hazard risk mitigation system, method and computer pr...

Printed circuit board and manufacturing method thereof

Power system and method for controlling power modules

Printed wiring

Transmission module, electronic unit, and electronic device

Patents Applicationslast 30 patents

DISPLAY DEVICE

DISPLAY APPARATUS

WIRING CIRCUIT BOARD

WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...

OPTICAL PLANAR METROLOGY MOUNTING DEVICE AND METHODS FOR ABRASIVE C...

POINT HEAT DETECTORS BASED ON SURFACE MOUNTED THERMISTORS

MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...

CIRCUIT BOARD MODULE CAPABLE OF SUPPRESSING COMMON MODE NOISE

PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BO...

STRETCHABLE DEVICE

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT SUB-MOUNT

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...

FLEXIBLE CIRCUIT BOARD

LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES

ELECTROSTATIC DISCHARGE COLLECTOR

PRINTED CIRCUIT BOARD

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

SWITCHING POWER SUPPLY DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE

PRINTED WIRING BOARD AND COIL DEVICE